Part A
10AX016E4F27E3SG
정보
- Lifecycle
- Active
- Stock
- 2616 PCS
- Package
- FBGA-672
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Compatible functional replacement candidate
The 10AX016E4F27E3SG and 10AX032E2F27I2SG are both Intel Arria 10 GX series FPGAs sharing the same 672-pin FBGA package and core architecture, making them functionally related candidates. However, they differ in logic density, speed grade, and operating temperature range, so the 10AX032E2F27I2SG offers higher capacity and industrial-grade thermal tolerance while the 10AX016E4F27E3SG targets lower-density commercial applications. Designers must validate logic utilization, timing closure, and thermal requirements before substituting one for the other.
Logic Density
Validation required
Speed Grade
Validation required
Package Type
High match
Operating Temperature
Not compatible
Parts at a glance
Part B
10AX032E2F27I2SG
정보
- Lifecycle
- Active
- Stock
- 8092 PCS
- Package
- BBGA-672
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX016E4F27E3SG | 10AX032E2F27I2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 160,000 | 320,000 | Logic capacity determines the maximum complexity of designs the FPGA can implement; a device with half the logic elements cannot substitute for a larger design. |
| Total RAM Bits | 8,800,000 | 17,800,000 | Embedded memory capacity affects buffering, FIFO depth, and data storage; insufficient RAM can prevent a design from fitting. |
| Number of I/Os | 240 | 240 | I/O count determines how many external signals the device can interface with; matching counts supports pin-compatible substitution. |
| Operating Temperature Range | 0°C to 100°C (Extended Commercial) | -40°C to 100°C (Industrial) | Temperature grade affects reliability in harsh environments; industrial-grade parts are required for automotive and industrial applications. |
| Speed Grade | 4 | 2 | Speed grade determines maximum achievable clock frequency and timing closure; a slower grade may not meet timing requirements of a design targeting a faster device. |
| Package / Case | 672-BBGA, FCBGA | 672-BBGA, FCBGA | Package type and footprint must match for board-level compatibility; identical packages allow drop-in replacement without PCB redesign. |
| Supply Voltage | 0.87V to 0.93V | 0.87V to 0.93V | Core voltage must match the board power design; mismatched voltages can damage the device or cause unreliable operation. |
| Series | Arria 10 GX | Arria 10 GX | Same device family ensures compatible toolchain support, IP cores, and configuration methods. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX016E4F27E3SG | 10AX032E2F27I2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | 61510 | 119900 |
| Number of Logic Elements/Cells | 160000 | 320000 |
| Total RAM Bits | 10086400 | 21040128 |
| Number of I/O | 240 | 240 |
| Voltage - Supply | 0.87V ~ 0.93V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10AX016E4F27E3SG and the 10AX032E2F27I2SG?
The 10AX016E4F27E3SG is an Intel (Altera) Arria 10 GX FPGA with 160,000 logic elements, a speed grade of 4, and an extended temperature range of 0°C to 100°C (E3). The 10AX032E2F27I2SG is an Arria 10 GX FPGA with 320,000 logic elements, a faster speed grade of 2, and an industrial temperature range of -40°C to 100°C (I2). Both use the same 672-pin FBGA package (F27).
Are the 10AX016E4F27E3SG and 10AX032E2F27I2SG pin-to-pin compatible?
Yes, both devices are offered in the same F27 package, which is a 672-pin FineLine BGA (FBGA) with a 27 mm x 27 mm body size. However, pin-to-pin compatibility does not guarantee functional equivalence; the 10AX032E2F27I2SG has more logic resources and a different speed grade, so designers must verify I/O banking, transceiver channels, and power sequencing against the respective datasheets.
Can the 10AX016E4F27E3SG be used as a drop-in replacement for the 10AX032E2F27I2SG?
No, a drop-in replacement is not possible without design changes. The 10AX032E2F27I2SG has twice the logic density (320K vs 160K logic elements) and a faster speed grade (2 vs 4). The 10AX016E4F27E3SG also has a commercial/extended temperature range (0°C to 100°C) versus the industrial range (-40°C to 100°C) of the 10AX032E2F27I2SG. The FPGA configuration bitstream and timing closure are device-specific.
What is the difference in speed grade between the 10AX016E4F27E3SG and the 10AX032E2F27I2SG?
The 10AX016E4F27E3SG has a speed grade of 4, while the 10AX032E2F27I2SG has a speed grade of 2. In Intel Arria 10 nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10AX032E2F27I2SG offers higher maximum operating frequencies and tighter timing performance than the 10AX016E4F27E3SG.
What are the operating temperature ranges for these two FPGAs?
The 10AX016E4F27E3SG is rated for an extended temperature range of 0°C to 100°C junction temperature (E3 suffix). The 10AX032E2F27I2SG is rated for an industrial temperature range of -40°C to 100°C junction temperature (I2 suffix). The industrial-rated device is suitable for harsher environments, while the extended-range device targets commercial and industrial applications with controlled ambient conditions.
Do both FPGAs support the same transceiver speeds and protocols?
Both devices are members of the Intel Arria 10 GX family and support transceiver data rates up to 17.4 Gbps per channel, with protocol support for PCI Express Gen3, 10/40/100 Gigabit Ethernet, and Interlaken. However, the exact number of transceiver channels and their maximum performance may vary by device density and speed grade. Designers must consult the Arria 10 Device Overview and the specific device pin-out files for verified channel counts.
Which device is more suitable for high-volume production with lower power consumption?
The 10AX016E4F27E3SG, with its lower logic density (160K LE) and slower speed grade (4), typically consumes less static and dynamic power than the 10AX032E2F27I2SG (320K LE, speed grade 2). For designs that do not require the additional logic or industrial temperature range, the 10AX016E4F27E3SG can be a more cost-effective and lower-power option. Actual power consumption must be estimated using Intel's Early Power Estimator (EPE) or PowerPlay Power Analyzer.
Are these FPGAs RoHS compliant and lead-free?
Both the 10AX016E4F27E3SG and the 10AX032E2F27I2SG are offered in RoHS-compliant, lead-free packages as indicated by the "G" suffix in the ordering code. The "SG" suffix denotes a lead-free (Pb-free) FBGA package. Designers should verify the specific product ordering code and environmental compliance documentation from Intel or authorized distributors such as DigiKey or Mouser for the latest certification status.