10AX048H2F34E2SG
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- Lifecycle
- Active
- Stock
- 4660 PCS
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
10AX048H2F34E2SG과 10AX032E2F27E2LG에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 10AX048H2F34E2SG and 10AX032E2F27E2LG are both Intel Arria 10 GX series FPGAs sharing the same core architecture, transceiver technology, and logic cell family, making them functionally related candidates. However, they differ in logic density, package footprint, and speed grade, so a direct drop-in replacement is not possible without design rework. The 10AX048H2F34E2SG offers higher logic capacity and a larger package, while the 10AX032E2F27E2LG provides a more compact footprint with lower density. Engineers must validate pinout compatibility, thermal performance, and power delivery before considering substitution.
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정보
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048H2F34E2SG | 10AX032E2F27E2LG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines the maximum complexity of designs the device can implement; a lower LE count may not fit a design built for the larger device. |
| Adaptive Logic Modules (ALM) | 183,590 | 122,400 | ALMs are the fundamental logic building blocks; fewer ALMs directly reduce available combinational and sequential logic resources. |
| Total Embedded Memory | 18,620 Kbit | 12,400 Kbit | On-chip memory affects buffering, FIFO depth, and data storage capability; insufficient memory can force external memory usage or redesign. |
| DSP Blocks (Variable Precision) | 1,368 | 912 | DSP blocks determine signal-processing throughput; fewer blocks limit parallel multiply-accumulate operations for arithmetic-intensive designs. |
| Maximum User I/O Pins | 492 | 336 | I/O count constrains the number of external interfaces and peripherals that can be connected simultaneously. |
| Package | FBGA-1152 (F34) | FBGA-672 (F27) | Different package footprints and ball counts are not pin-compatible, requiring a new PCB layout for substitution. |
| Transceiver Count | 24 | 12 | High-speed serial transceivers support protocols like PCIe and Ethernet; fewer transceivers limit high-bandwidth interconnect options. |
| Speed Grade | 2 (High Performance) | 2 (High Performance) | Speed grade affects maximum operating frequency and timing closure; matching grades preserves timing performance. |
| Operating Temperature Range | 0°C to 100°C (Commercial) | 0°C to 100°C (Commercial) | Temperature range must match the target environment; industrial or extended ranges are required for harsh conditions. |
| Family / Series | Arria 10 GX | Arria 10 GX | Same family ensures toolchain, IP, and configuration compatibility, simplifying migration between the two devices. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10AX048H2F34E2SG | 10AX032E2F27E2LG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 119900 |
| Number of Logic Elements/Cells | - | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 492 | 240 |
| Voltage - Supply | 0.87V ~ 0.98V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 183590 | - |
| Number of Logic Elements / Cells | 480000 | - |
| Packaging | Tray | - |
The 10AX048H2F34E2SG is an Intel Arria 10 GX FPGA with 480,000 logic elements in a 1152-pin FBGA package, while the 10AX032E2F27E2LG is an Arria 10 GX FPGA with 320,000 logic elements in a 672-pin FBGA package. They differ in logic density, package size, pin count, and speed grade.
No. The 10AX048H2F34E2SG uses a 1152-pin FBGA package, while the 10AX032E2F27E2LG uses a 672-pin FBGA package. The different pin counts and package footprints make them physically incompatible for the same PCB land pattern.
No. Beyond the package and pin count differences, the 10AX048H2F34E2SG offers 480,000 logic elements versus 320,000 logic elements in the 10AX032E2F27E2LG. A design requiring the higher logic density, I/O count, or transceiver channels of the larger device cannot be directly replaced without redesign and revalidation.
Yes. Both the 10AX048H2F34E2SG and the 10AX032E2F27E2LG are members of the Intel Arria 10 GX FPGA family, which shares the same architecture, IP ecosystem, and development tools such as Intel Quartus Prime.
The 10AX048H2F34E2SG is specified with speed grade 2, indicated by the "2" in the part number. The 10AX032E2F27E2LG is also specified with speed grade 2. Both devices therefore share the same speed grade designation within the Arria 10 GX family.
Both the 10AX048H2F34E2SG and the 10AX032E2F27E2LG are specified for the industrial temperature grade, indicated by the "I" suffix in their ordering codes. They are rated for operation over the industrial temperature range as defined in the Intel Arria 10 device datasheet.
The 10AX048H2F34E2SG should be selected. It provides 480,000 logic elements and a 1152-pin FBGA package, offering higher logic density and more user I/O pins than the 10AX032E2F27E2LG, which provides 320,000 logic elements in a 672-pin FBGA package.
Both devices are Arria 10 GX FPGAs and support transceiver channels as defined by the Arria 10 GX device family. However, the exact number of transceiver channels and maximum data rates differ by device density and package. Designers must consult the Intel Arria 10 device datasheet and pin-out files for the specific channel counts and supported protocols for each part number.