10CL040YU484C8G vs 10CL006YU256C8G

10CL040YU484C8G과 10CL006YU256C8G에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10CL006YU256C8G and 10CL040YU484C8G are both Intel Cyclone 10 LP FPGAs sharing the same core architecture, speed grade, and supply voltage, but they differ significantly in logic density, package, and I/O count. The 10CL040YU484C8G offers substantially higher logic capacity and more user I/O, making it a viable functional upgrade candidate only when board layout, power budget, and design resource requirements are revalidated. It is not a pin-compatible drop-in replacement.

Logic Density Validation required
Package Type Not compatible
I/O Count Not compatible
Core Architecture High match

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10CL006YU256C8G 10CL040YU484C8G Why it matters
Logic Elements (LEs) 6,272 39,600 LE count defines the available programmable logic capacity; a large mismatch means the two devices are not functionally interchangeable for designs requiring more logic.
Total RAM Bits 276,480 1,161,216 Embedded memory capacity determines how much data buffering, FIFO, or on-chip storage the design can implement without external memory.
Number of I/O Pins 176 325 I/O count limits how many external signals and peripherals the device can interface with, directly affecting board-level compatibility.
Package / Pin Count 256-pin UBGA (14x14 mm) 484-pin UBGA (19x19 mm) Different package footprints and pin counts are not drop-in compatible and require different PCB layouts.
Number of PLLs 1 4 PLL count affects clock generation and frequency synthesis capability; fewer PLLs restrict multi-clock domain designs.
Maximum User I/O Banks 4 8 More I/O banks allow greater flexibility in voltage-level partitioning and interface standards across the design.
Embedded Multiplier (18x18) Blocks 15 126 DSP multiplier blocks determine arithmetic and signal-processing throughput; a large difference limits substitution in DSP-heavy applications.
Core Supply Voltage 1.2 V 1.2 V Core voltage must match the board power design; identical values here indicate power-rail compatibility.
Operating Temperature Range 0°C to 85°C (Commercial) 0°C to 85°C (Commercial) Temperature grade must meet the target application environment; matching grades indicate equivalent thermal suitability.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10CL040YU484C8G 10CL006YU256C8G
Series Cyclone® 10 LP Cyclone® 10 LP
Part Status Active Active
Digi Key Programmable Not Verified -
Number of LA Bs / CL Bs 2475 -
Number of Logic Elements / Cells 39600 -
Total RAM Bits 1161216 276480
Number of I/O 325 176
Voltage - Supply 1.2V 1.2V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Packaging Tray -
Number of LABs/CLBs - 392
Number of Logic Elements/Cells - 6272

Frequently asked questions

What are the key differences between the 10CL006YU256C8G and the 10CL040YU484C8G?

The 10CL006YU256C8G is a Cyclone 10 LP FPGA with 6,272 logic elements (LEs) in a 256-pin UBGA package, while the 10CL040YU484C8G offers 39,600 LEs in a 484-pin UBGA package. The 10CL040YU484C8G provides significantly higher logic density and more user I/O, making it suitable for larger designs, whereas the 10CL006YU256C8G targets smaller, cost-sensitive applications.

Are the 10CL006YU256C8G and 10CL040YU484C8G pin-to-pin compatible?

No. The 10CL006YU256C8G uses a 256-pin UBGA package, and the 10CL040YU484C8G uses a 484-pin UBGA package. The different package sizes, pin counts, and pinouts prevent direct pin-to-pin compatibility or drop-in replacement on the same PCB footprint.

Do both devices belong to the same FPGA family and use the same configuration method?

Yes. Both the 10CL006YU256C8G and 10CL040YU484C8G are members of the Intel (Altera) Cyclone 10 LP family. They support the same configuration schemes, including active serial (AS), passive serial (PS), and JTAG configuration, using external configuration devices or a host controller.

What is the operating temperature grade for the 10CL006YU256C8G and 10CL040YU484C8G?

Both devices carry the "C8" speed grade and commercial temperature suffix in their ordering codes, indicating a commercial temperature range of 0°C to 85°C junction temperature (TJ). They are not rated for industrial or automotive temperature ranges unless a different ordering code is selected.

Can the 10CL006YU256C8G be used as a direct substitute for the 10CL040YU484C8G in an existing design?

No. The 10CL006YU256C8G has fewer logic elements (6,272 vs. 39,600), fewer user I/O pins, and a different package footprint than the 10CL040YU484C8G. A direct substitution would require redesigning the PCB, recompiling the FPGA design, and verifying that the reduced logic capacity and I/O count meet the application requirements.

What are the typical supply voltage requirements for these Cyclone 10 LP devices?

Both the 10CL006YU256C8G and 10CL040YU484C8G require a 1.2 V core supply (VCCINT) and support flexible I/O standards with VCCIO voltages typically at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, depending on the configured I/O bank. Exact voltage tolerances and sequencing requirements should be verified in the respective Intel Cyclone 10 LP device datasheets.

Which device is more suitable for high-density logic applications?

The 10CL040YU484C8G is more suitable for high-density logic applications because it provides 39,600 logic elements and 484 package pins, offering substantially more logic capacity and I/O than the 10CL006YU256C8G, which provides 6,272 logic elements and 256 package pins. The 10CL006YU256C8G is better suited for low-cost, low-power, small-form-factor designs.