Part A
10CL080YF780I7G
알트라
- Lifecycle
- Active
- Stock
- 4082 PCS
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Compatible functional replacement candidate
The 10CL080YF484C6G is a viable functional replacement candidate for the 10CL080YF780I7G, sharing the same logic density, device family, and core architecture. However, the differing package footprint and speed grade require careful validation against the target board layout and timing budget before substitution.
Logic Density
High match
Package Type
Validation required
Speed Grade
Validation required
Operating Temperature
High match
Parts at a glance
Part B
10CL080YF484C6G
정보
- Lifecycle
- Active
- Stock
- 9535 PCS
- Package
- BGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10CL080YF780I7G | 10CL080YF484C6G | Why it matters |
|---|---|---|---|
| Package / Case | 780-FBGA (29x29) | 484-FBGA (23x23) | Different package footprints and ball counts are not drop-in compatible; the PCB layout must match the specific package. |
| Operating Temperature Range | -40°C to 100°C (Industrial, I7) | 0°C to 85°C (Commercial, C6) | Industrial-grade parts support wider temperature extremes; substituting a commercial part in an industrial environment risks reliability. |
| Speed Grade | 7 (faster) | 6 (slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same performance requirements. |
| Logic Elements (LEs) | 8,000 | 8,000 | Matching logic capacity ensures the same design fits without resource overflow. |
| Family / Series | Cyclone 10 LP | Cyclone 10 LP | Same device family means identical architecture, IP compatibility, and tool support. |
| Embedded Memory | 270 kbit | 270 kbit | Equal embedded memory supports the same on-chip buffering and storage requirements. |
| Number of I/O Pins | 278 | 278 | Identical usable I/O count allows the same peripheral interfacing, though ball placement differs by package. |
| Supply Voltage | 1.2 V core | 1.2 V core | Same core voltage means identical power supply design and decoupling requirements. |
| Multiplier / PLL | 2 PLLs | 2 PLLs | Equal PLL resources support the same clock generation and frequency synthesis schemes. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10CL080YF780I7G | 10CL080YF484C6G |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® 10 LP | Cyclone® 10 LP |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 5079 |
| Number of Logic Elements/Cells | - | 81264 |
| Total RAM Bits | 2810880 | 2810880 |
| Number of I/O | 423 | 289 |
| Voltage - Supply | 1.2V | 1.2V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 5079 | - |
| Number of Logic Elements / Cells | 81264 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the 10CL080YF780I7G and the 10CL080YF484C6G?
Both devices are Intel (formerly Altera) Cyclone 10 LP FPGAs with 80,000 logic elements, but they differ in package, speed grade, and temperature grade. The 10CL080YF780I7G uses a 780-pin FBGA package, has a speed grade of 7, and is rated for industrial temperature range (I7). The 10CL080YF484C6G uses a 484-pin FBGA package, has a speed grade of 6, and is rated for commercial temperature range (C6).
Are the 10CL080YF780I7G and 10CL080YF484C6G pin-to-pin compatible?
No. The 10CL080YF780I7G is in a 780-pin FBGA package, while the 10CL080YF484C6G is in a 484-pin FBGA package. The different pin counts and ball maps mean they are not pin-to-pin compatible and require different PCB footprints.
Can the 10CL080YF484C6G be used as a direct drop-in replacement for the 10CL080YF780I7G?
No. A direct drop-in replacement is not possible because the packages differ (484-pin vs 780-pin FBGA), the speed grades differ (6 vs 7), and the temperature grades differ (commercial vs industrial). Any substitution requires a full design review, including PCB layout changes, timing analysis, and thermal validation.
What is the logic capacity of both the 10CL080YF780I7G and the 10CL080YF484C6G?
Both devices provide 80,000 logic elements (LEs), which is the defining feature of the Cyclone 10 LP 10CL080 device family. They also share the same embedded memory and multiplier resources as defined by the 10CL080 device specification.
What do the speed grade and temperature grade suffixes indicate for these two FPGAs?
In the 10CL080YF780I7G, the "I7" suffix indicates an industrial temperature grade and speed grade 7. In the 10CL080YF484C6G, the "C6" suffix indicates a commercial temperature grade and speed grade 6. Speed grade 6 is faster than speed grade 7, while the industrial temperature grade supports a wider operating temperature range than the commercial grade.
Which device is better suited for industrial temperature environments?
The 10CL080YF780I7G is better suited for industrial temperature environments because its "I7" suffix denotes an industrial temperature grade. The 10CL080YF484C6G carries a commercial temperature grade ("C6") and is intended for commercial operating conditions.
Do both devices belong to the same FPGA family and device density?
Yes. Both the 10CL080YF780I7G and the 10CL080YF484C6G are members of the Intel Cyclone 10 LP family and share the same 10CL080 device density of 80,000 logic elements. The differences are limited to package, speed grade, and temperature grade.
What should be verified before considering a design migration between these two parts?
Before migrating between the 10CL080YF780I7G and the 10CL080YF484C6G, verify the target package footprint and ballout, confirm timing closure at the applicable speed grade, validate the operating temperature range against the system environment, and check that all I/O and power pin assignments meet the new package constraints using the official Intel Cyclone 10 LP device documentation.