Part A
10M08DCF256I7G
정보
- Lifecycle
- Active
- Stock
- 5000 PCS
- Package
- LBGA-256
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Compatible functional replacement candidate
The 10M08DAF256C8GES is a viable functional replacement candidate for the 10M08DCF256I7G in non-temperature-critical applications, sharing identical logic density, package footprint, and supply voltage requirements, though the commercial-grade temperature range and slower speed grade of the 10M08DAF256C8GES must be validated against the target application's environmental and timing requirements.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M08DAF256C8GES
정보
- Lifecycle
- Active
- Stock
- 6174 PCS
- Package
- LBGA-256
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M08DCF256I7G | 10M08DAF256C8GES | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, which supports similar design toolchains and IP reuse. |
| Logic Elements | 8000 | 8000 | Matching logic capacity ensures equivalent programmable logic resources for the same design. |
| Package | 256-FBGA | 256-FBGA | Identical package and pin count allow the same PCB footprint and assembly process. |
| Operating Temperature | -40°C to 100°C | 0°C to 85°C | Industrial temperature range supports harsher environments, while commercial range is limited to benign conditions. |
| Speed Grade | 7 | 8 | A faster speed grade can improve timing closure and maximum operating frequency. |
| Embedded Memory | 378 kbit | 378 kbit | Equal embedded memory supports the same on-chip data buffering and storage requirements. |
| User I/O | 178 | 178 | Same number of user I/O pins ensures compatible interfacing with external peripherals. |
| Supply Voltage | 1.2 V core | 1.2 V core | Identical core voltage simplifies power supply design and board-level compatibility. |
| Configuration Memory | Internal configuration flash | Internal configuration flash | Both offer instant-on non-volatile configuration, eliminating external configuration memory. |
| RoHS Compliance | Compliant | Compliant | RoHS compliance is required for many commercial and industrial product certifications. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M08DCF256I7G | 10M08DAF256C8GES |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Discontinued at Digi-Key |
| Number of LABs/CLBs | 500 | 500 |
| Number of Logic Elements/Cells | 8000 | 8000 |
| Total RAM Bits | 387072 | 387072 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M08DCF256I7G and the 10M08DAF256C8GES?
The 10M08DCF256I7G is a MAX 10 FPGA with 8,000 logic elements in a 256-pin FineLine BGA package, specified for industrial temperature range (I7, -40°C to 100°C junction) and featuring dual configuration flash. The 10M08DAF256C8GES is a MAX 10 FPGA with the same 8,000 logic elements and 256-pin FineLine BGA package, but it is specified for commercial temperature range (C8, 0°C to 85°C junction) and is supplied as an engineering sample (ES) with single configuration flash. The primary differences are the temperature grade, configuration flash option, and product lifecycle status.
Are the 10M08DCF256I7G and 10M08DAF256C8GES pin-to-pin compatible?
Yes. Both devices are offered in the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel (formerly Altera) MAX 10 device family documentation. However, designers must verify that the configuration scheme and temperature requirements of the target application are satisfied before substituting one for the other.
Can the 10M08DAF256C8GES be used as a drop-in replacement for the 10M08DCF256I7G in an industrial application?
No. The 10M08DAF256C8GES is rated for commercial temperature range (0°C to 85°C junction), while the 10M08DCF256I7G is rated for industrial temperature range (-40°C to 100°C junction). Additionally, the 10M08DAF256C8GES is an engineering sample (ES) device not intended for production deployment. Using it in an industrial or production application would violate the device's specified operating conditions and lifecycle status.
What is the logic capacity of both the 10M08DCF256I7G and the 10M08DAF256C8GES?
Both devices feature 8,000 logic elements (LEs), 378 Kbits of M9K embedded memory, and 172 embedded 18x18 multipliers, as specified in the Intel MAX 10 FPGA device family datasheet. They also both include analog-to-digital converter (ADC) blocks and internal configuration flash.
What does the "ES" suffix indicate on the 10M08DAF256C8GES?
The "ES" suffix indicates that the device is an engineering sample. Engineering samples are pre-production devices provided for evaluation and design validation purposes only. They are not guaranteed to meet final production specifications and should not be used in volume production or shipped in end products.
What is the difference in configuration flash between the two devices?
The 10M08DCF256I7G features dual configuration flash (indicated by the "D" in the part number), allowing two separate configuration images to be stored on-chip. The 10M08DAF256C8GES features single configuration flash (indicated by the "A" in the part number), storing only one configuration image. This affects features such as dual-boot and fail-safe configuration updating.
Which device is recommended for a new production design requiring industrial temperature operation?
The 10M08DCF256I7G is the appropriate choice for production designs requiring industrial temperature range (-40°C to 100°C junction) and dual configuration flash. The 10M08DAF256C8GES is an engineering sample with commercial temperature rating and should not be selected for production. Designers should consult Intel MAX 10 ordering information for the latest production-status equivalents.