10M16DAU324C8G
정보
- Lifecycle
- Active
- Stock
- 3130 PCS
- Package
- LFBGA-324
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
10M16DAU324C8G과 10M16DAU324I6G에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 10M16DAU324I6G is a functionally compatible alternative to the 10M16DAU324C8G, sharing the same Intel MAX 10 FPGA family, 16,000 logic elements, 324-pin FBGA package, and core architecture. The primary distinction is the operating temperature grade, with the industrial-grade I6G supporting a wider temperature range than the commercial-grade C8G. Designers should validate thermal margins and timing closure under the target operating conditions before committing to a drop-in substitution.
정보
정보
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAU324C8G | 10M16DAU324I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial-grade parts support harsher conditions. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing performance. |
| Logic Elements (LEs) | 16000 | 16000 | Defines the available programmable logic capacity for implementing user designs. |
| Package | 324-pin FBGA | 324-pin FBGA | Must match the PCB footprint for physical interchangeability. |
| Family / Series | MAX 10 | MAX 10 | Confirms both devices belong to the same FPGA family with compatible architecture and toolchain. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must match the board power design for correct operation. |
| Configuration Memory | Integrated flash | Integrated flash | On-chip configuration flash enables instant-on operation without external configuration devices. |
| RoHS Compliance | RoHS compliant | RoHS compliant | Ensures the part meets environmental regulations for lead-free manufacturing. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAU324C8G | 10M16DAU324I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 246 | 246 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 324-pin FineLine BGA (FBGA) package. They share the same logic density of 16,000 logic elements (LEs), the same 324-pin package, and the same dual-configuration flash architecture. The suffix difference is the speed grade and temperature grade: C8G denotes commercial temperature range with speed grade 8, while I6G denotes industrial temperature range with speed grade 6.
The "C" in 10M16DAU324C8G indicates the commercial temperature grade (typically 0°C to 85°C junction temperature), and "8" indicates speed grade 8. The "I" in 10M16DAU324I6G indicates the industrial temperature grade (typically -40°C to 100°C junction temperature), and "6" indicates speed grade 6. Speed grade 6 is faster than speed grade 8, meaning the I6G device supports higher maximum operating frequencies for the same logic paths.
Yes. Both devices use the same 324-pin FBGA package with the same pinout and footprint. They are pin-to-pin compatible, so a board designed for one can physically accept the other. However, electrical and timing differences between speed grades and temperature grades must be validated before substitution.
Physical replacement is possible because both are 324-pin FBGA devices with identical pinouts. However, the I6G is an industrial-temperature, faster speed-grade device. The design's timing closure, power budget, and thermal management must be re-verified. The I6G may consume different power and may require different external component ratings for industrial temperature operation. Always confirm against the Intel MAX 10 device datasheet and your board-level requirements.
The 10M16DAU324I6G is specified for the industrial temperature range and is therefore the appropriate choice for industrial-temperature environments. The 10M16DAU324C8G is specified for the commercial temperature range and is not rated for the same extended temperature conditions. Selection should be based on the actual operating temperature range required by the application.
Yes. Both are MAX 10 10M16 devices, which provide 16,000 logic elements (LEs). They share the same embedded memory capacity, embedded multiplier configuration, and dual-configuration flash features as defined by the Intel MAX 10 device family. The primary differences are speed grade and temperature grade, not logic or memory density.
Both 10M16DAU324C8G and 10M16DAU324I6G are MAX 10 FPGAs featuring dual-configuration flash, which allows two configuration images to be stored on-chip. They support instant-on configuration and can be configured via JTAG, internal flash, or external configuration sources as defined in the Intel MAX 10 documentation. Configuration details are identical for both devices because they share the same die and package family.
The I6G device has speed grade 6, which is faster than the C8G device's speed grade 8. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10M16DAU324I6G supports higher maximum operating frequencies and tighter timing margins than the 10M16DAU324C8G, assuming both are operated within their respective temperature ranges.