10M16DCF484C8G
정보
- Lifecycle
- Active
- Stock
- 6504 PCS
- Package
- BGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
10M16DCF484C8G과 10M16DAF484I6G에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 10M16DCF484C8G and 10M16DAF484I6G are functionally compatible as both are Intel MAX 10 FPGA devices with identical 16,000 logic elements, 484-pin FBGA packaging, and equivalent core architecture. However, they differ in operating temperature grade and speed grade, making the 10M16DAF484I6G suitable as a replacement only when the extended industrial temperature range and faster speed grade are acceptable or required for the target application.
정보
정보
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCF484C8G | 10M16DAF484I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 16,000 | 16,000 | Matching logic density ensures equivalent programmable logic capacity for the target design. |
| Package | 484-pin FBGA | 484-pin FBGA | Identical package and pin count allow the same PCB footprint and board layout to be reused. |
| Operating Temperature Range | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | The industrial-rated device supports harsher environments, so it can replace the commercial part in extended-temperature applications but not vice versa. |
| Speed Grade | 8 (faster) | 6 (slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Embedded Memory | Up to 5,888 Kbits | Up to 5,888 Kbits | Equal on-chip memory capacity supports the same buffering, FIFO, and data storage requirements. |
| 18x18 Multipliers | Up to 160 | Up to 160 | Identical DSP block count ensures the same arithmetic and signal-processing capability. |
| User I/O Pins | Up to 320 | Up to 320 | Matching I/O count preserves interface compatibility with the surrounding circuitry. |
| Configuration Flash | Integrated (single-chip) | Integrated (single-chip) | Both are instant-on, non-volatile MAX 10 devices, eliminating the need for external configuration memory. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M16DCF484C8G | 10M16DAF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 320 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
The primary differences are operating temperature range, speed grade, and package type. The 10M16DCF484C8G is a commercial-grade device (0°C to 85°C junction temperature) with speed grade 8 in a 484-pin FineLine BGA (FBGA) package. The 10M16DAF484I6G is an industrial-grade device (-40°C to 100°C junction temperature) with speed grade 6 in a 484-pin FineLine BGA (FBGA) package. Both are Intel (Altera) MAX 10 family FPGAs with 16,000 logic elements.
Yes. Both devices use the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out specifications. However, designers must verify that the differing speed grades and temperature grades do not affect timing closure or thermal requirements in the target application.
Not directly. The 10M16DCF484C8G is rated for commercial temperature range (0°C to 85°C) while the 10M16DAF484I6G is rated for industrial temperature range (-40°C to 100°C). Additionally, the speed grades differ (8 vs. 6), which affects timing performance. A drop-in replacement requires re-validating timing, power, and thermal margins against the original design requirements.
Both devices feature 16,000 logic elements (LEs), which is the defining characteristic of the MAX 10 10M16 density level. They also share the same embedded memory, DSP blocks, and analog-to-digital converter (ADC) resources as specified in the Intel MAX 10 device datasheet.
The 10M16DAF484I6G is better suited for industrial applications because it is rated for the industrial temperature range of -40°C to 100°C junction temperature. The 10M16DCF484C8G is rated only for commercial temperature range (0°C to 85°C) and is not recommended for industrial environments requiring extended temperature operation.
Yes. Both the 10M16DCF484C8G and 10M16DAF484I6G support the same configuration schemes as part of the Intel MAX 10 family, including internal configuration flash, JTAG, and external configuration via CPLD or microprocessor. Configuration method support is determined by the device family and density, not by speed grade or temperature grade.
The 10M16DCF484C8G uses speed grade 8, while the 10M16DAF484I6G uses speed grade 6. A lower speed grade number indicates faster performance in Intel FPGA nomenclature. Therefore, the 10M16DAF484I6G (grade 6) offers faster maximum operating frequencies and tighter timing specifications than the 10M16DCF484C8G (grade 8).
Yes. Both the 10M16DCF484C8G and 10M16DAF484I6G are RoHS-compliant as stated in Intel's product material declarations and distributor environmental documentation. The "G" suffix in both part numbers indicates lead-free (Pb-free) packaging.