10M16DCU324C8G vs 10M16DCU324A7G

10M16DCU324C8G과 10M16DCU324A7G에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M16DCU324A7G is a viable functional replacement candidate for the 10M16DCU324C8G, sharing identical logic density, package, and I/O configuration, with the primary distinction being the faster speed grade of the A7G variant. Designers should validate timing closure and power budget when substituting the faster device into an existing C8G design.

Logic Density High match
Package Type High match
I/O Count High match
Speed Grade Validation required

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M16DCU324C8G 10M16DCU324A7G Why it matters
Speed Grade 8 7 The speed grade determines the maximum operating frequency and timing closure margin; a grade 7 device is faster than a grade 8 device, so timing-critical designs may not be directly interchangeable.
Logic Elements (LEs) 16000 16000 Logic capacity defines how much digital logic can be implemented; identical LE counts mean both devices offer the same logic density.
Total RAM Bits 562176 562176 Embedded memory capacity affects buffering, FIFO depth, and data storage within the FPGA; matching values indicate equivalent on-chip memory resources.
Number of I/Os 246 246 I/O count determines how many external signals the device can interface with; identical counts support the same peripheral connectivity.
Package / Case 324-UBGA (FBGA) 324-UBGA (FBGA) Package type and footprint must match for physical board compatibility; identical packages allow the same PCB land pattern.
Operating Temperature Range 0°C to 85°C (Commercial) 0°C to 85°C (Commercial) Temperature range defines the environmental conditions under which the device is guaranteed to operate; matching ranges ensure the same application environments are supported.
Supply Voltage 1.15V to 1.25V (Core) 1.15V to 1.25V (Core) Core supply voltage must be compatible with the board power design; identical requirements allow the same power delivery network.
Device Family Series MAX 10 (Commercial Speed Grade 8) MAX 10 (Automotive Speed Grade 7) The series and grade suffix indicate qualification level and performance binning; the A7G variant is automotive-qualified and faster, which may affect sourcing, reliability requirements, and timing.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M16DCU324C8G 10M16DCU324A7G
Supplier - Intel
Series MAX® 10 MAX® 10
Part Status Active Active
Number of LABs/CLBs - 1000
Number of Logic Elements/Cells - 16000
Total RAM Bits 562176 562176
Number of I/O 246 246
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 125°C (TJ)
Digi Key Programmable Not Verified -
Number of LA Bs / CL Bs 1000 -
Number of Logic Elements / Cells 16000 -
Packaging Tray -

Frequently asked questions

What are the 10M16DCU324C8G and 10M16DCU324A7G devices?

Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 324-pin UBGA package with 16,000 logic elements (LEs). The 10M16DCU324C8G is specified with a commercial temperature grade and speed grade 8, while the 10M16DCU324A7G is specified with an automotive temperature grade and speed grade 7.

What do the C8 and A7 suffixes indicate in these part numbers?

In the MAX 10 ordering code, the letter after the package code denotes the temperature grade and the trailing digit denotes the speed grade. "C8" indicates commercial temperature range with speed grade 8, and "A7" indicates automotive temperature range with speed grade 7.

Are the 10M16DCU324C8G and 10M16DCU324A7G pin-compatible?

Yes. Both devices use the same 324-pin UBGA package and the same MAX 10 10M16 device die, so they share the same pinout and footprint. The difference is limited to temperature grade and speed grade, not package or pin function.

Can the 10M16DCU324C8G and 10M16DCU324A7G be used interchangeably in a design?

Not automatically. The 10M16DCU324A7G is rated for the automotive temperature range and has a different speed grade than the 10M16DCU324C8G. Any substitution must be validated against the target design's timing closure, operating temperature requirements, and the manufacturer's device specifications.

Do the two devices differ in logic capacity or embedded resources?

No. Both are 10M16 devices with 16,000 logic elements and the same MAX 10 architecture, including the same embedded memory, DSP blocks, and analog-to-digital converter resources. The differences are the temperature grade and speed grade only.

Which device is intended for automotive applications?

The 10M16DCU324A7G, indicated by the "A" in the ordering code, is the automotive temperature-grade version. The 10M16DCU324C8G, indicated by the "C", is the commercial temperature-grade version.

Does the speed grade difference affect timing performance?

Yes. Speed grade 8 and speed grade 7 represent different maximum operating frequencies and timing characteristics in the MAX 10 family. The 10M16DCU324C8G (speed grade 8) and 10M16DCU324A7G (speed grade 7) must be evaluated separately against the timing requirements of the design.

Are configuration and programming methods the same for both devices?

Yes. Both are MAX 10 FPGAs in the same device family and package, so they use the same configuration schemes, including internal configuration flash and supported external configuration options. Programming files must still be generated for the specific speed and temperature grade being used.