Part A
10M16SCU169C8G
알트라
- Lifecycle
- Active
- Stock
- 3068 PCS
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Compatible functional replacement candidate
The 10M16SCU169C8G and 10M16DAU324C8G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and C8 speed grade, making them functionally comparable for logic capacity and speed. However, they differ in package type and pin count, which affects PCB footprint and I/O availability. The 10M16SCU169C8G uses a 169-pin UBGA package, while the 10M16DAU324C8G uses a 324-pin UBGA package. Designers must verify pinout compatibility and thermal performance before substituting. This is a functional replacement candidate, not a drop-in replacement.
Logic Elements
High match
Speed Grade
High match
Package Type
Validation required
Pin Count
Not compatible
Parts at a glance
Part B
10M16DAU324C8G
정보
- Lifecycle
- Active
- Stock
- 3130 PCS
- Package
- LFBGA-324
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SCU169C8G | 10M16DAU324C8G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Same device family ensures similar architecture, toolchain support, and IP compatibility. |
| Logic Elements (LEs) | 16,000 | 16,000 | Equal logic capacity means comparable ability to implement user logic without resource changes. |
| Package | 169-pin UBGA | 324-pin UBGA | Different package and pin count affect PCB footprint, routing, and mechanical compatibility. |
| Number of I/Os | 130 | 246 | I/O count determines how many external signals and peripherals can be interfaced. |
| Embedded Memory | 588 kbits | 588 kbits | On-chip memory capacity affects buffering, data storage, and implementation of memory-heavy functions. |
| Analog-to-Digital Converter (ADC) | Not available | 1 MSPS, 12-bit | Integrated ADC enables analog sensing without external converter components. |
| Flash Memory for Configuration | Yes (internal configuration flash) | Yes (internal configuration flash) | Internal configuration flash allows single-chip operation and simplifies board design. |
| Operating Temperature Range | 0°C to 85°C | 0°C to 85°C | Temperature grade determines suitability for commercial versus industrial environments. |
| Supply Voltage | 1.2 V core, 2.5 V/3.3 V I/O | 1.2 V core, 2.5 V/3.3 V I/O | Matching voltage requirements ensures power supply compatibility and level shifting needs. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SCU169C8G | 10M16DAU324C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 1000 |
| Number of Logic Elements/Cells | - | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 246 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 1000 | - |
| Number of Logic Elements / Cells | 16000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the 10M16SCU169C8G and the 10M16DAU324C8G?
The primary differences are package type, pin count, and I/O availability. The 10M16SCU169C8G uses a 169-pin UBGA package, while the 10M16DAU324C8G uses a 324-pin UBGA package. Both are Intel (Altera) MAX 10 FPGA devices with 16,000 logic elements and a C8 speed grade, but the larger 324-pin package provides more user I/O pins and additional features such as higher memory interface capability.
Are the 10M16SCU169C8G and 10M16DAU324C8G pin-to-pin compatible?
No. The 10M16SCU169C8G has a 169-ball UBGA package, and the 10M16DAU324C8G has a 324-ball UBGA package. They have different physical dimensions, ball counts, and ball maps, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint.
Do both devices have the same logic density and speed grade?
Yes. Both the 10M16SCU169C8G and 10M16DAU324C8G are MAX 10 devices with 16,000 logic elements (10M16) and a C8 speed grade. The logic fabric, embedded memory blocks, and DSP resources are identical across both devices; the differences are limited to package, pin count, and the number of available I/O pins.
Which device offers more user I/O pins?
The 10M16DAU324C8G offers more user I/O pins. Its 324-pin UBGA package provides a higher I/O count than the 169-pin UBGA package of the 10M16SCU169C8G. The exact number of user I/O pins should be confirmed from the Intel MAX 10 device pin-out files for each specific package.
Can the 10M16SCU169C8G be used as a drop-in replacement for the 10M16DAU324C8G?
No. Because the two devices use different packages (169-ball UBGA vs. 324-ball UBGA), they have different footprints, ball counts, and pin assignments. A drop-in replacement is not possible without a PCB redesign. Additionally, the I/O count and available features differ, so the system design must be revalidated.
Do both devices support the same configuration and power supply options?
Both devices belong to the Intel MAX 10 family and share the same configuration architecture, including internal configuration flash and support for instant-on operation. They also use the same core and I/O voltage rails as defined by the MAX 10 family specifications. However, the exact number of supported configuration schemes and power pins may vary by package, so the respective device pin-out and power pin tables should be consulted.
Which package is better for space-constrained designs?
The 10M16SCU169C8G is better for space-constrained designs because its 169-ball UBGA package is physically smaller than the 324-ball UBGA package of the 10M16DAU324C8G. The trade-off is fewer user I/O pins and potentially fewer dedicated interface pins.
Are both devices RoHS compliant and lead-free?
Both the 10M16SCU169C8G and 10M16DAU324C8G are offered in RoHS-compliant, lead-free packages as part of Intel's standard product offerings. The "G" suffix in both part numbers indicates RoHS compliance and lead-free construction. Final confirmation should be made using the Intel product material declaration or the distributor's compliance documentation.