Part A
10M25DCF484C8G
정보
- Lifecycle
- Active
- Stock
- 3416 PCS
- Package
- BGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Compatible functional replacement candidate
The 10M25DCF484C8G and 10M25DCF484I6G are functionally compatible Intel MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration; the primary distinction is the operating temperature grade, with the industrial-grade variant offering extended thermal range for demanding environments.
Logic Density
High match
Package Type
High match
I/O Count
High match
Operating Temperature
Validation required
Parts at a glance
Part B
10M25DCF484I6G
정보
- Lifecycle
- Active
- Stock
- 2586 PCS
- Package
- BGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DCF484C8G | 10M25DCF484I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions. |
| Speed Grade | 8 (fastest) | 6 (slower) | Affects maximum achievable clock frequency and timing closure; a lower speed grade may not meet the same performance targets. |
| Logic Elements (LEs) | 25,000 | 25,000 | Defines the available programmable logic capacity for implementing user designs. |
| Total RAM (M9K blocks) | 1,080 Kbits | 1,080 Kbits | Determines on-chip memory available for buffering, FIFOs, and data storage within the FPGA. |
| Embedded Multipliers (18x18) | 150 | 150 | Provides dedicated DSP resources for arithmetic-intensive functions such as filtering and multiplication. |
| Package | 484-pin FBGA | 484-pin FBGA | Must match the PCB footprint and pinout for physical interchangeability. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Core voltage must be compatible with the board power design for correct operation. |
| Number of I/O Pins | 360 | 360 | Determines how many external signals the device can interface with in the target application. |
| Configuration Memory Type | SRAM-based (volatile) | SRAM-based (volatile) | Volatile configuration requires an external configuration device on every power-up. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M25DCF484C8G | 10M25DCF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the 10M25DCF484C8G and 10M25DCF484I6G devices?
Both are Intel (formerly Altera) MAX 10 family field-programmable gate arrays (FPGAs) in the 484-pin FineLine BGA (FBGA) package. They share the same 25,000-logic-element density, integrated analog-to-digital converter (ADC) blocks, and non-volatile configuration flash. The suffix difference indicates the operating temperature grade: C8G denotes commercial temperature range with speed grade 8, while I6G denotes industrial temperature range with speed grade 6.
What is the difference between the C8G and I6G suffixes on these MAX 10 FPGAs?
The "C" in 10M25DCF484C8G indicates commercial temperature range (typically 0°C to 85°C junction), and "8" indicates speed grade 8. The "I" in 10M25DCF484I6G indicates industrial temperature range (typically -40°C to 100°C junction), and "6" indicates speed grade 6. Speed grade 6 is faster than speed grade 8, meaning the industrial-grade device also offers higher performance.
Are the 10M25DCF484C8G and 10M25DCF484I6G pin-compatible?
Yes. Both devices use the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out files. The package footprint and pin functions are the same, so they are pin-to-pin compatible at the PCB level.
Can the 10M25DCF484C8G be substituted with the 10M25DCF484I6G in an existing design?
In many cases yes, because both share the same package, pinout, and 25,000 LE density. However, the substitution must be validated because the industrial-grade I6G part has a wider temperature range and a faster speed grade (6 vs. 8). Timing closure, power consumption, and configuration settings may differ, so the design should be recompiled and verified against the target device's datasheet before substitution.
Do both devices support the same configuration methods?
Yes. Both the 10M25DCF484C8G and 10M25DCF484I6G are MAX 10 FPGAs featuring integrated non-volatile flash configuration. They support the same configuration schemes, including internal configuration from the on-chip flash, as well as external configuration via JTAG and other supported modes as documented in the Intel MAX 10 FPGA configuration user guide.
What is the logic density and embedded memory of these MAX 10 devices?
Both devices provide 25,000 logic elements (LEs). They also include embedded memory blocks (M9K) totaling 1,080 Kbits, and integrated analog-to-digital converter (ADC) blocks. These parameters are identical between the 10M25DCF484C8G and 10M25DCF484I6G because they share the same device die.
Which device should be selected for an industrial-temperature application?
The 10M25DCF484I6G should be selected for industrial-temperature applications because its "I" suffix denotes industrial temperature range support (typically -40°C to 100°C junction). The 10M25DCF484C8G is rated for commercial temperature range (typically 0°C to 85°C junction) and is not specified for industrial temperature operation.
Are these devices RoHS compliant and lead-free?
Yes. Both the 10M25DCF484C8G and 10M25DCF484I6G are offered in RoHS-compliant, lead-free FBGA packages as stated in Intel MAX 10 device ordering information. The "G" suffix in both part numbers indicates RoHS-compliant packaging. Designers should confirm the specific ordering code and environmental compliance documentation from Intel or authorized distributors for the latest status.