10M40DAF256C8G
정보
- Lifecycle
- Active
- Stock
- 5091 PCS
- Package
- LBGA-256
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
10M40DAF256C8G과 10M40DAF256I6G에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 10M40DAF256C8G and 10M40DAF256I6G are functionally equivalent Intel MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration. The only material difference is the operating temperature grade, making the industrial-grade 10M40DAF256I6G a viable replacement for the commercial-grade 10M40DAF256C8G in most applications, provided the higher temperature range is acceptable and speed grade requirements are validated.
정보
정보
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DAF256C8G | 10M40DAF256I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing, affecting achievable system performance. |
| Logic Elements (LEs) | 40000 | 40000 | Defines the available programmable logic capacity for implementing user designs. |
| Package | 256-pin FBGA | 256-pin FBGA | Must match the PCB footprint and assembly process for physical interchangeability. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must be compatible with the board power design for correct operation. |
| Embedded Memory | 1260 kbit M9K | 1260 kbit M9K | On-chip memory capacity affects buffering, storage, and implementation of memory-intensive functions. |
| Multiplier Blocks (18x18) | 116 | 116 | Dedicated multipliers determine DSP throughput for arithmetic-intensive applications. |
| PLLs | 4 | 4 | PLL count limits the number of independent clock domains and frequency synthesis options. |
| Maximum User I/O | 178 | 178 | Available I/O pins constrain interfacing capability with external peripherals and systems. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DAF256C8G | 10M40DAF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
The primary differences are the operating temperature grade and the speed grade. The 10M40DAF256C8G is specified for commercial temperature range (0°C to 85°C junction temperature) with a speed grade of 8, while the 10M40DAF256I6G is specified for industrial temperature range (-40°C to 100°C junction temperature) with a faster speed grade of 6. Both devices are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in a 256-pin FineLine BGA (FBGA) package with 40,000 logic elements (LEs) and dual configuration flash memory.
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined in the Intel MAX 10 device pin-out files. The package designation "256" and the "F" suffix indicate the same FBGA package type and pin count, so they are physically and electrically pin-to-pin compatible when used in the same PCB footprint.
Not without design validation. Although the package and pinout are identical, the industrial-grade 10M40DAF256I6G has a faster speed grade (6 vs. 8) and a wider temperature range. A faster speed grade may affect timing closure, power consumption, and signal integrity. The commercial-grade 10M40DAF256C8G cannot operate reliably over the industrial temperature range. Intel recommends re-validating timing, power, and thermal performance before substituting one for the other.
Both the 10M40DAF256C8G and 10M40DAF256I6G feature 40,000 logic elements (LEs), 1,260 Kbits of M9K embedded memory, and 288 Kbits of user flash memory (UFM). They also include 4 phase-locked loops (PLLs) and 2 analog-to-digital converter (ADC) blocks. These parameters are identical because both part numbers refer to the same MAX 10 10M40 device family with the same die.
The 10M40DAF256C8G is rated for the commercial temperature range with a junction temperature (Tj) of 0°C to 85°C. The 10M40DAF256I6G is rated for the industrial temperature range with a junction temperature (Tj) of -40°C to 100°C. These ratings are specified in the Intel MAX 10 FPGA Device Datasheet and must be observed for reliable operation.
The 10M40DAF256C8G has a speed grade of 8, while the 10M40DAF256I6G has a speed grade of 6. In Intel FPGA nomenclature, a lower speed grade number indicates faster performance. Therefore, the 10M40DAF256I6G offers shorter propagation delays and higher maximum operating frequencies (fMAX) than the 10M40DAF256C8G. Designers must use the correct speed grade in timing analysis to ensure proper operation.
Yes. Both the 10M40DAF256C8G and 10M40DAF256I6G are MAX 10 devices with dual configuration flash memory, which allows two configuration images to be stored on-chip. They support instant-on operation, meaning the device can begin functioning immediately after power-up without an external configuration device. This feature is common to all MAX 10 10M40 devices regardless of temperature or speed grade.
The 10M40DAF256I6G must be selected for industrial applications requiring operation down to -40°C ambient or junction temperature. The 10M40DAF256C8G is only rated for 0°C to 85°C junction temperature and is not guaranteed to function correctly below 0°C. Always verify the actual junction temperature in the target application and refer to the Intel MAX 10 FPGA Device Datasheet for derating guidelines.
Yes. Both the 10M40DAF256C8G and 10M40DAF256I6G are offered in RoHS-compliant, lead-free packages as stated in Intel's product material declarations and distributor product pages. The "G" suffix in the part number indicates RoHS compliance and lead-free (Pb-free) construction. Customers should confirm the specific ordering code and environmental status with Intel or an authorized distributor before finalizing a design.