10M40DCF672C8G
정보
- Lifecycle
- Active
- Stock
- 5081 PCS
- Package
- BGA-672
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
10M40DCF672C8G과 10M40DAF672C8G에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 10M40DCF672C8G and 10M40DAF672C8G are functionally equivalent Intel MAX 10 FPGA devices sharing the same logic density, package, speed grade, and operating temperature range. The only difference is the integrated configuration flash feature, making the 10M40DAF672C8G a viable alternative where active serial configuration is not required.
정보
정보
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF672C8G | 10M40DAF672C8G | Why it matters |
|---|---|---|---|
| Family | Intel MAX 10 FPGA | Intel MAX 10 FPGA | Both parts belong to the same device family, so they share the same architecture, toolchain, and IP support. |
| Logic Elements (LEs) | 40,000 | 40,000 | Identical logic capacity means equivalent ability to implement user logic and IP blocks. |
| Embedded Memory | 1,260 Kbits | 1,260 Kbits | Matching on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| 18x18 Multipliers | 288 | 288 | Equal DSP resources allow the same signal processing and arithmetic workloads. |
| Package | 672-pin FBGA | 672-pin FBGA | Same package and pin count enable a common PCB footprint and mechanical compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Identical temperature grade ensures the same environmental operating envelope. |
| Configuration Method | Dual Configuration (dual-boot image support) | Single Configuration (flash-based) | Dual configuration allows fail-safe updates and fallback images, while single configuration offers only one stored image, affecting boot flexibility and reliability. |
| Configuration Flash | Integrated | Integrated | Both devices include on-die configuration flash, eliminating the need for external configuration memory. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage means identical power supply design and decoupling requirements. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF672C8G | 10M40DAF672C8G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 500 | 500 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 10M40 density grade, featuring 40,000 logic elements (LEs), non-volatile integrated flash configuration, and a 672-pin FineLine BGA (FBGA) package. The 10M40DCF672C8G and 10M40DAF672C8G differ in their specified operating temperature grade and corresponding ordering suffix.
The primary difference is the temperature grade indicated by the ordering code suffix. The 10M40DCF672C8G is specified for the commercial temperature range (typically 0°C to 85°C junction), while the 10M40DAF672C8G is specified for the industrial temperature range (typically -40°C to 100°C junction). Both share the same 40,000-LE density, 672-pin FBGA package, and MAX 10 device family features.
Yes. Both devices use the same 672-pin FineLine BGA (FBGA) package with identical pinouts as defined by the MAX 10 device family. The package footprint and pin assignments are the same; the difference is limited to the temperature grade specification and ordering code.
Substitution depends on the target application's temperature requirements. The 10M40DAF672C8G is rated for the industrial temperature range, while the 10M40DCF672C8G is rated for the commercial range. A commercial-grade device should not be substituted in an application requiring industrial temperature operation. Always verify against the manufacturer's datasheet and the system's thermal requirements before substituting.
Both devices are MAX 10 FPGAs featuring integrated non-volatile flash configuration memory. They support instant-on operation and do not require an external configuration device for basic operation. They also support dual configuration images and can be reconfigured via external sources if required by the design.
Yes. Both devices include embedded M9K memory blocks and embedded multiplier blocks (DSP blocks) as part of the MAX 10 10M40 density feature set. The exact quantities of M9K blocks and multiplier blocks are defined in the Intel MAX 10 device datasheet for the 10M40 density grade.
Both devices are supplied in a 672-pin FineLine BGA (FBGA) package, designated by the "F672" code in the ordering part number. This package is lead-free and RoHS-compliant as specified in Intel's product documentation.
Verified specifications are available from the Intel MAX 10 FPGA device datasheet and family documentation, as well as authorized distributor listings such as DigiKey, Mouser, and TTI. These sources provide the ordering code breakdown, temperature grades, package details, and electrical characteristics for both devices.