10M50DAF256C8G
정보
- Lifecycle
- Active
- Stock
- 2856 PCS
- Package
- LBGA-256
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
10M50DAF256C8G과 10M50DCF256C7G에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 10M50DAF256C8G and 10M50DCF256C7G are both Intel MAX 10 FPGA devices in the same 256-pin FBGA package with identical logic density and feature set, making them functionally interchangeable in most designs. The primary distinction is speed grade and temperature range, so the 10M50DCF256C7G can serve as a drop-in replacement for the 10M50DAF256C8G provided the target application tolerates the faster speed grade and the narrower commercial temperature window.
정보
정보
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256C8G | 10M50DCF256C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 50,000 | 50,000 | Identical logic capacity ensures the same design fits without resource re-estimation. |
| Package | 256-pin FBGA | 256-pin FBGA | Same package and pin count allow drop-in board-level replacement without layout changes. |
| Speed Grade | 8 (fastest commercial) | 7 (fastest commercial) | Speed grade affects maximum operating frequency and timing closure; a faster grade can improve performance but may change power and timing margins. |
| Operating Temperature Range | 0°C to +85°C (commercial) | 0°C to +85°C (commercial) | Matching temperature ranges ensures both parts are suitable for the same environmental conditions. |
| Embedded Memory (M9K blocks) | 1,638 Kbits | 1,638 Kbits | Identical embedded memory capacity supports the same on-chip buffering and storage requirements. |
| User I/O Pins | 178 | 178 | Same I/O count ensures all peripheral interfaces can be routed identically. |
| Configuration Flash (Internal) | Yes (dual configuration) | Yes (dual configuration) | Integrated configuration flash eliminates external configuration memory, simplifying board design and boot-up. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage means identical power supply design and decoupling requirements. |
| RoHS / Lead-Free | Yes | Yes | Both are RoHS-compliant, meeting environmental and regulatory requirements for the same markets. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256C8G | 10M50DCF256C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The primary differences are the speed grade and the operating temperature range. The 10M50DAF256C8G is a speed grade 8 device specified for commercial temperature range (0°C to 85°C junction). The 10M50DCF256C7G is a faster speed grade 7 device specified for commercial temperature range (0°C to 85°C junction). Both are Intel MAX 10 FPGA devices with 50,000 logic elements in a 256-pin FineLine BGA (FBGA) package.
Yes. Both devices are offered in the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel MAX 10 device pin-out specifications. However, designers must verify that the faster speed grade of the 10M50DCF256C7G does not introduce signal integrity or timing issues in the target design.
In many cases yes, because the 10M50DCF256C7G is a faster speed grade (7 vs. 8) in the same package and temperature range. However, a direct substitution requires timing analysis to confirm that the faster device does not violate hold-time or other timing constraints, and that power consumption remains within the board's thermal and electrical limits. Always validate against the Intel MAX 10 device datasheet and your design's timing report.
Both devices feature 50,000 logic elements (LEs), 1,638 Kbits of M9K embedded memory, and 288 18x18 multiplier blocks, as specified in the Intel MAX 10 device family datasheet. They also include integrated analog-to-digital converter (ADC) blocks and flash memory for configuration.
Yes. Both the 10M50DAF256C8G and 10M50DCF256C7G are MAX 10 FPGA devices with integrated flash configuration memory. They support internal configuration from the on-chip flash, as well as external configuration via JTAG, and they can be used in dual-configuration mode. Refer to the Intel MAX 10 FPGA Configuration User Guide for detailed methods.
Both the 10M50DAF256C8G and the 10M50DCF256C7G are specified for the commercial temperature range, with a junction temperature (Tj) of 0°C to 85°C. The "C" in the part number indicates commercial grade. Industrial-grade versions would carry an "I" designator and a different temperature range.
The 10M50DCF256C7G is faster. In Intel FPGA speed grade nomenclature, a lower number indicates a faster speed grade. Speed grade 7 is faster than speed grade 8, resulting in shorter propagation delays and higher maximum operating frequencies for the 10M50DCF256C7G compared to the 10M50DAF256C8G.
Yes. Both devices are offered in RoHS-compliant packages as stated in Intel's product material declarations and distributor documentation. The 256-pin FBGA package is lead-free and meets RoHS requirements. Always confirm the specific ordering code and latest compliance documentation from Intel or authorized distributors.