25LC1024T-E/SM
마이크로칩 기술
- Lifecycle
- Active
- Stock
- 6964 PCS
- Package
- SOIC-8
- Series
- 기억력
25LC1024T-E/SM과 25LC160D-E/SN16KVAO에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 25LC1024T-E/SM and 25LC160D-E/SN16KVAO are not functionally interchangeable. The 25LC1024T-E/SM provides 1 Mbit of SPI serial EEPROM in an 8-lead SOIC package, while the 25LC160D-E/SN16KVAO provides only 16 Kbit in a 16-lead SOIC package with an automotive qualification. The tenfold difference in memory density, the different page and sector architecture, and the incompatible package footprint prevent direct substitution without a complete board and firmware redesign.
마이크로칩 기술
마이크로칩 기술
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 25LC1024T-E/SM | 25LC160D-E/SN16KVAO | Why it matters |
|---|---|---|---|
| Memory Density | 1 Mbit | 16 Kbit | Density determines total storage capacity; a 1 Mbit device stores 64 times more data than a 16 Kbit device, so they are not functionally interchangeable for firmware or data-logging needs. |
| Memory Organization | 128K x 8 | 2K x 8 | Byte-wide organization affects addressing and the number of address bytes required per transaction, influencing software compatibility. |
| Maximum Clock Frequency | 10 MHz | 10 MHz | Clock rate sets the maximum SPI throughput; matching speeds ensures the host controller timing budget is satisfied. |
| Supply Voltage Range | 2.5 V to 5.5 V | 2.5 V to 5.5 V | Operating voltage range must match the system rail; both support 2.5–5.5 V, allowing use in 3.3 V and 5 V designs. |
| Page Size | 256 bytes | 16 bytes | Page size limits the number of bytes writable in a single page-write command; a larger page reduces write overhead and improves throughput. |
| Package / Mounting | 8-SOIC (SOIJ), Surface Mount | 8-SOIC, Surface Mount | Package footprint and pinout must match the PCB layout; both are 8-pin SOIC but body width variants can affect solderability. |
| Operating Temperature Range | -40 °C to +125 °C | -40 °C to +125 °C | Temperature grade determines suitability for automotive and industrial environments; both meet the extended -40 to +125 °C range. |
| Interface Type | SPI (Serial Peripheral Interface) | SPI (Serial Peripheral Interface) | Protocol compatibility is essential for host controller communication; both use standard SPI modes 0 and 3. |
| Automotive Qualification | AEC-Q100 (Extended grade) | AEC-Q100 (Variant suffix KVAO) | AEC-Q100 qualification indicates the device is validated for automotive reliability and quality requirements. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 25LC1024T-E/SM | 25LC160D-E/SN16KVAO |
|---|---|---|
| Supplier | - | Microchip Technology |
| Series | - | Automotive, AEC-Q100 |
| Part Status | Active | Active |
| Memory Type | Non-Volatile | Non-Volatile |
| Memory Format | EEPROM | EEPROM |
| Technology | EEPROM | EEPROM |
| Memory Size | 1Mb (128K x 8) | 16Kb (2K x 8) |
| Memory Interface | SPI | SPI |
| Clock Frequency | 20 MHz | 5 MHz |
| Write Cycle Time - Word Page | 6ms | 5ms |
| Voltage - Supply | 2.5V ~ 5.5V | 2.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
The 25LC1024T-E/SM is a 1 Mbit SPI serial EEPROM in an 8-lead SOIJ package, while the 25LC160D-E/SN16KVAO is a 16 Kbit SPI serial EEPROM in an 8-lead SOIC package. The primary differences are memory density (1 Mbit vs 16 Kbit), package type (SOIJ vs SOIC), and the 25LC160D-E/SN16KVAO carries an automotive AEC-Q100 qualification.
Both devices use an 8-lead package with standard SPI pinout (CS, SO, WP, VSS, SI, SCK, HOLD, VCC). However, the 25LC1024T-E/SM uses the SOIJ (8-lead SOIC with 5.33 mm body width) package, while the 25LC160D-E/SN16KVAO uses the SOIC (8-lead, 3.90 mm body width) package. PCB land patterns differ, so they are not drop-in replacements without layout verification.
No, not directly. Although both are SPI EEPROMs, the 25LC1024T-E/SM has a different memory density (1 Mbit vs 16 Kbit), a different package footprint (SOIJ vs SOIC), and lacks the automotive qualification of the 25LC160D-E/SN16KVAO. Substitution requires validation of memory size, package compatibility, and qualification requirements.
The 25LC1024T-E/SM operates from 2.5V to 5.5V. The 25LC160D-E/SN16KVAO operates from 2.5V to 5.5V. Both support standard 2.5V to 5.5V supply ranges per Microchip datasheets.
The 25LC1024T-E/SM supports a maximum SPI clock frequency of 20 MHz. The 25LC160D-E/SN16KVAO supports a maximum SPI clock frequency of 10 MHz. The higher clock rate of the 25LC1024T-E/SM allows faster data throughput.
Yes. Both the 25LC1024T-E/SM and 25LC160D-E/SN16KVAO support SPI modes 0 (0,0) and 3 (1,1), as specified in their respective Microchip datasheets.
The 25LC1024T-E/SM is specified for the extended temperature range of -40°C to +125°C. The 25LC160D-E/SN16KVAO is also specified for -40°C to +125°C, but additionally carries the automotive AEC-Q100 qualification for use in automotive applications.
The 25LC1024T-E/SM uses the 8-lead SOIJ package with a body width of 5.33 mm and is rated MSL 1. The 25LC160D-E/SN16KVAO uses the 8-lead SOIC package with a body width of 3.90 mm and is rated MSL 1. Both are lead-free and RoHS compliant.