Part A
5CEBA2F23C8N
정보
- Lifecycle
- Active
- Stock
- 2918 PCS
- Package
- FBGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Compatible functional replacement candidate
The 5CEBA2U19C7N is a viable functional replacement candidate for the 5CEBA2F23C8N, sharing the same Cyclone V FPGA family, logic density, and core architecture. However, designers must account for differences in package footprint, speed grade, and operating temperature range before committing to a drop-in substitution.
Logic Density
High match
Package Type
Validation required
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
5CEBA2U19C7N
정보
- Lifecycle
- Active
- Stock
- 7477 PCS
- Package
- FBGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA2F23C8N | 5CEBA2U19C7N | Why it matters |
|---|---|---|---|
| Package / Case | FBGA-484 | UBGA-484 | The physical package and ball pitch determine PCB footprint, routing density, and whether the two devices are drop-in compatible on an existing board. |
| Speed Grade | 8 (fastest) | 7 (faster) | Speed grade affects maximum operating frequency, timing closure, and achievable logic performance; a slower grade may not meet the same timing requirements. |
| Operating Temperature Range | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | The temperature grade defines the environmental conditions under which the device is guaranteed to operate reliably. |
| Logic Elements (LE) | 25,000 | 25,000 | Logic element count determines the amount of programmable logic available for implementing custom digital functions. |
| Total RAM Bits | 1,080,000 | 1,080,000 | Embedded memory capacity affects the ability to buffer data, implement FIFOs, and store coefficients or lookup tables on-chip. |
| Number of I/Os | 224 | 224 | The I/O count limits how many external signals and peripherals the FPGA can interface with directly. |
| Supply Voltage - Core | 1.1 V | 1.1 V | Core voltage must match the board power design; an incorrect level can damage the device or prevent proper operation. |
| Mounting Type | Surface Mount | Surface Mount | Mounting type determines the assembly process and whether the part is compatible with the intended PCB manufacturing flow. |
| RoHS Status | RoHS Compliant | RoHS Compliant | RoHS compliance is required for sale in many regions and affects material selection and disposal requirements. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA2F23C8N | 5CEBA2U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 9434 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 2002944 | 2002944 |
| Number of I/O | 224 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CEBA2F23C8N and 5CEBA2U19C7N devices?
Both are Intel (formerly Altera) Cyclone V FPGAs from the 5CEBA2 device family. The 5CEBA2F23C8N is a 23 mm FBGA (F23) package variant with a C8 speed grade, while the 5CEBA2U19C7N is a 19 mm UBGA (U19) package variant with a C7 speed grade. Both feature 25,000 logic elements (LEs) and belong to the Cyclone V E series.
What is the difference in speed grade between the 5CEBA2F23C8N and 5CEBA2U19C7N?
The 5CEBA2F23C8N uses speed grade C8, while the 5CEBA2U19C7N uses speed grade C7. In Intel FPGA nomenclature, a lower number indicates a faster speed grade, so the C7 device offers higher maximum operating frequencies and tighter timing performance than the C8 device.
Are the 5CEBA2F23C8N and 5CEBA2U19C7N package-compatible?
No. The 5CEBA2F23C8N uses a 484-pin FBGA package (23 mm body), and the 5CEBA2U19C7N uses a 484-pin UBGA package (19 mm body). Although both have 484 balls, the package dimensions, ball pitch, and PCB land patterns differ, so they are not drop-in replacements for each other.
Do the 5CEBA2F23C8N and 5CEBA2U19C7N have the same logic density and memory resources?
Yes. Both devices are Cyclone V E 5CEBA2 variants with 25,000 logic elements (LEs), 9,500 adaptive logic modules (ALMs), and 1,530 Kbits of embedded M10K memory. They also share the same number of 18x18 multipliers and PLLs, as they belong to the same device density within the Cyclone V E family.
Can the 5CEBA2F23C8N be used as a substitute for the 5CEBA2U19C7N in an existing design?
Not directly. Although both are 5CEBA2 devices with identical logic resources, they differ in package footprint (23 mm FBGA vs 19 mm UBGA) and speed grade (C8 vs C7). A substitution requires a new PCB layout to accommodate the different package, and timing must be re-verified because the C7 speed grade is faster than C8.
What are the typical operating voltage requirements for these devices?
Both the 5CEBA2F23C8N and 5CEBA2U19C7N operate with a core voltage (VCC) of 1.1 V typical, and support I/O standards including 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.0 V, depending on the bank configuration. These parameters are consistent across the Cyclone V E family and are documented in the Intel Cyclone V Device Handbook.
Which device is better for space-constrained applications?
The 5CEBA2U19C7N is better suited for space-constrained designs because its UBGA package has a 19 mm body size, compared to the 23 mm body of the 5CEBA2F23C8N FBGA package. The smaller footprint allows for denser PCB layouts, though it may present different thermal and routing considerations.
Are both devices RoHS compliant and lead-free?
Yes. Both the 5CEBA2F23C8N and 5CEBA2U19C7N are offered in lead-free, RoHS-compliant packages as standard Intel FPGA products. The "N" suffix in both part numbers indicates lead-free (Pb-free) construction, which is verified in Intel's product ordering information.