5CEBA4F17C8N vs 5CEBA2F17C6N

5CEBA4F17C8N과 5CEBA2F17C6N에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 5CEBA2F17C6N is a viable functional replacement candidate for the 5CEBA4F17C8N in space-constrained designs where reduced logic density and lower speed grade are acceptable. Both devices share the same 256-ball FBGA package and Cyclone V FPGA architecture, ensuring footprint compatibility. However, the 5CEBA2F17C6N offers approximately half the logic elements and a slower speed grade, which may impact timing closure and resource utilization. Validation is required to confirm that the reduced logic capacity and performance meet application requirements.

Package Type High match
Logic Density Validation required
Speed Grade Validation required
Supply Voltage High match

Parts at a glance

Part A

5CEBA4F17C8N

정보

Lifecycle
Active
Stock
2430 PCS
Package
FBGA-256
Series
내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Part B

5CEBA2F17C6N

정보

Lifecycle
Active
Stock
5923 PCS
Package
LBGA-256
Series
내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEBA4F17C8N 5CEBA2F17C6N Why it matters
Logic Elements (LE) 49,000 25,000 Determines the amount of programmable logic available; a design that fits in the larger device may not fit in the smaller one, affecting functional substitutability.
Total Embedded RAM 3,080 kbit 1,540 kbit On-chip memory capacity affects buffering, FIFO depth, and data storage; insufficient RAM can prevent a design from being ported between devices.
Embedded 18x18 Multipliers 132 66 DSP resources limit arithmetic throughput; fewer multipliers can bottleneck signal-processing or math-intensive designs.
Maximum User I/O 128 128 I/O count determines how many external signals can be interfaced; matching counts supports pin-compatible substitution.
Speed Grade 8 6 Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same performance targets.
Package FBGA-256 FBGA-256 Package type and footprint must match for physical board compatibility and drop-in replacement.
Operating Temperature Range 0°C to 85°C (Commercial) 0°C to 85°C (Commercial) Temperature grade determines suitability for the target environment; mismatches can cause reliability issues.
Core Supply Voltage 1.1 V 1.1 V Core voltage must match the board power design; differing requirements would need regulator changes.
Family Cyclone V E Cyclone V E Same device family ensures compatible architecture, toolchain support, and IP reuse.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEBA4F17C8N 5CEBA2F17C6N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 18480 9434
Number of Logic Elements/Cells 49000 25000
Total RAM Bits 3464192 2002944
Number of I/O 128 128
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 5CEBA4F17C8N and 5CEBA2F17C6N FPGA devices?

The 5CEBA4F17C8N and 5CEBA2F17C6N are both Intel (formerly Altera) Cyclone V E series FPGAs in the same 256-pin FBGA package (17 mm x 17 mm). The primary differences are logic density and speed grade: the 5CEBA4F17C8N offers approximately 49,000 logic elements (LEs) with a speed grade of 8, while the 5CEBA2F17C6N offers approximately 25,000 LEs with a faster speed grade of 6. The 5CEBA4F17C8N also provides more embedded memory, multipliers, and transceiver resources than the 5CEBA2F17C6N.

Are the 5CEBA4F17C8N and 5CEBA2F17C6N pin-compatible?

Yes. Both devices are offered in the same 256-pin FineLine BGA (FBGA) package with the same 17 mm x 17 mm body size and identical pinout for the Cyclone V E family. However, pin-compatibility does not guarantee functional equivalence; designers must verify that all I/O assignments, power pins, and configuration pins meet the target design requirements before substituting one for the other.

Can the 5CEBA2F17C6N be used as a direct drop-in replacement for the 5CEBA4F17C8N?

Not directly. Although both devices share the same package and pinout, the 5CEBA4F17C8N has higher logic density (approximately 49,000 LEs vs. 25,000 LEs) and a different speed grade (8 vs. 6). A design compiled for the 5CEBA4F17C8N may exceed the resources of the 5CEBA2F17C6N, and timing closure may differ due to the speed grade change. The design must be recompiled and validated for the target device before substitution.

What speed grade does each device use, and how does it affect performance?

The 5CEBA4F17C8N uses speed grade 8, while the 5CEBA2F17C6N uses speed grade 6. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 5CEBA2F17C6N has faster maximum operating frequencies and tighter timing specifications than the 5CEBA4F17C8N, even though it has lower logic density.

Do both devices support the same configuration and transceiver options?

Both devices belong to the Cyclone V E family and support standard configuration schemes such as active serial, passive serial, and JTAG. However, the 5CEBA4F17C8N includes more transceiver channels and higher-speed transceiver capabilities than the 5CEBA2F17C6N. Designers should consult the respective device datasheets to confirm the exact transceiver count and supported data rates for each part number.

Which device is more suitable for high-logic-density applications?

The 5CEBA4F17C8N is more suitable for high-logic-density applications because it provides approximately 49,000 logic elements, significantly more than the approximately 25,000 logic elements of the 5CEBA2F17C6N. The 5CEBA4F17C8N also offers more embedded memory blocks and digital signal processing (DSP) blocks, making it better suited for complex designs that require greater resource counts.

Are there differences in power consumption between the 5CEBA4F17C8N and 5CEBA2F17C6N?

Yes. The 5CEBA4F17C8N generally consumes more power than the 5CEBA2F17C6N due to its higher logic density and larger resource count. However, actual power consumption depends on the specific design, clock frequencies, I/O usage, and operating conditions. Intel provides the Early Power Estimator (EPE) and PowerPlay Power Analyzer tools to estimate power for each device accurately.

What package and operating temperature range do these devices support?

Both the 5CEBA4F17C8N and 5CEBA2F17C6N are offered in a 256-pin FBGA package measuring 17 mm x 17 mm. The "C" in the part number indicates commercial temperature grade, typically 0°C to 85°C junction temperature. Industrial and automotive temperature grades are available under different part number suffixes. Always verify the exact temperature grade from the manufacturer datasheet for the specific ordering code.