5CEFA2F23C8N
정보
- Lifecycle
- Active
- Stock
- 2565 PCS
- Package
- FBGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
5CEFA2F23C8N과 5CEFA7U19C6N에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The 5CEFA2F23C8N and 5CEFA7U19C6N are both Intel (Altera) Cyclone V FPGAs sharing the same core architecture, logic cell family, and 28 nm process technology, making them functionally related candidates. However, they differ in logic density, package type, pin count, and speed grade, so the 5CEFA7U19C6N cannot be treated as a direct drop-in replacement for the 5CEFA2F23C8N without a full design review covering resource utilization, PCB footprint, and timing closure.
정보
정보
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA2F23C8N | 5CEFA7U19C6N | Why it matters |
|---|---|---|---|
| Family | Cyclone V E | Cyclone V E | Same device family ensures toolchain and IP compatibility. |
| Logic Elements (LE) | 25,000 | 149,500 | Logic capacity determines the complexity of designs the device can implement. |
| Total RAM Bits | 1,944,576 | 7,024,640 | Embedded memory affects buffering, data storage, and DSP capability. |
| Number of I/Os | 224 | 240 | I/O count limits peripheral and interface connectivity options. |
| Package / Case | FBGA-484 | UBGA-484 | Package type affects PCB footprint, assembly, and thermal characteristics. |
| Operating Temperature | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade determines suitability for the target environment. |
| Speed Grade | 8 | 6 | Speed grade impacts maximum operating frequency and timing closure. |
| Supply Voltage | 1.1 V | 1.1 V | Core voltage must match the board power design for correct operation. |
| Number of Transceivers | 0 | 0 | Transceiver availability determines support for high-speed serial protocols. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2F23C8N | 5CEFA7U19C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 56480 |
| Number of Logic Elements/Cells | 25000 | 149500 |
| Total RAM Bits | 2002944 | 7880704 |
| Number of I/O | 224 | 240 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEFA2F23C8N is a Cyclone V E FPGA with 25,000 logic elements in a 484-pin FBGA package, while the 5CEFA7U19C6N is a Cyclone V E FPGA with 149,500 logic elements in a 484-pin UBGA package. They differ in logic density, package type, and speed grade.
No. The 5CEFA2F23C8N uses a 484-pin FBGA package, and the 5CEFA7U19C6N uses a 484-pin UBGA package. These are different package types with different ball maps and PCB land patterns, so they are not pin-to-pin compatible.
No. The two devices have different logic densities, package types, and speed grades. A direct replacement is not possible without redesigning the PCB and revalidating the logic design against the target device's resources and timing.
The 5CEFA2F23C8N contains 25,000 logic elements. The 5CEFA7U19C6N contains 149,500 logic elements.
The 5CEFA2F23C8N is specified with speed grade C8. The 5CEFA7U19C6N is specified with speed grade C6. The C6 speed grade is faster than C8 in the Cyclone V family.
Yes. Both the 5CEFA2F23C8N and the 5CEFA7U19C6N are members of the Intel (formerly Altera) Cyclone V E FPGA family.
The 5CEFA2F23C8N uses a 484-pin FineLine BGA (FBGA) package. The 5CEFA7U19C6N uses a 484-pin Ultra FineLine BGA (UBGA) package.
The 5CEFA7U19C6N offers higher logic capacity with 149,500 logic elements, compared to 25,000 logic elements in the 5CEFA2F23C8N. The 5CEFA7U19C6N is better suited for larger, more complex designs.