Part A
5CEFA7F23I7N
정보
- Lifecycle
- Active
- Stock
- 7313 PCS
- Package
- FBGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Not a drop-in replacement
The 5CEFA7F23I7N and 5CEFA2M13C8N are not functionally interchangeable. They differ in logic density, package footprint, speed grade, and operating temperature range, so a direct substitution is not feasible without a full redesign of the target board and timing closure review.
Different logic density
Different package footprint
Different speed grade
Different temperature range
Parts at a glance
Part B
5CEFA2M13C8N
정보
- Lifecycle
- Active
- Stock
- 4445 PCS
- Package
- TFBGA-383
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA7F23I7N | 5CEFA2M13C8N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain, IP, and pinout compatibility for substitution. |
| Logic Elements (LE) | 149,500 | 25,000 | Logic capacity determines whether a design fits; a smaller device cannot host a larger design. |
| Total RAM (bits) | 7,880,448 | 1,536,000 | On-chip memory limits buffering, FIFOs, and soft-processor memory; insufficient RAM blocks a design. |
| 18x18 Multipliers | 312 | 72 | DSP block count governs arithmetic throughput for filters, FFTs, and control loops. |
| Package | FBGA-484 | MBGA-383 | Different packages are not footprint-compatible, requiring PCB redesign for substitution. |
| I/O Count | 240 | 175 | Available I/O limits peripheral and interface expansion; fewer pins may not support the same board. |
| Operating Temperature | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | Industrial vs commercial temperature grades affect reliability in harsh or outdoor environments. |
| Speed Grade | 7 (fastest) | 8 (slowest) | Speed grade determines maximum clock frequency and timing closure margin. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values simplify power reuse. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA7F23I7N | 5CEFA2M13C8N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA7F23I7N and the 5CEFA2M13C8N?
The 5CEFA7F23I7N is a Cyclone V FPGA with 149,500 logic elements in a 484-pin FBGA package, rated for industrial temperature range (TJ = -40°C to 100°C) and speed grade 7. The 5CEFA2M13C8N is a Cyclone V FPGA with 25,000 logic elements in a 383-pin Micro FBGA package, rated for commercial temperature range (TJ = 0°C to 85°C) and speed grade 8. They differ in logic density, package, temperature grade, and speed grade.
Are the 5CEFA7F23I7N and 5CEFA2M13C8N pin-to-pin compatible?
No. The 5CEFA7F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2M13C8N uses a 383-pin Micro FBGA package (13 mm x 13 mm). The package sizes, ball counts, and ball maps are different, so they are not pin-to-pin compatible.
Can the 5CEFA2M13C8N be used as a direct drop-in replacement for the 5CEFA7F23I7N?
No. The two devices differ in logic density (25,000 vs 149,500 logic elements), package (383-pin Micro FBGA vs 484-pin FBGA), temperature grade (commercial vs industrial), and speed grade (8 vs 7). A direct drop-in replacement is not possible without redesigning the PCB and revalidating timing, power, and thermal performance.
What are the operating temperature ranges for the 5CEFA7F23I7N and 5CEFA2M13C8N?
The 5CEFA7F23I7N is rated for industrial temperature range with a junction temperature (TJ) of -40°C to 100°C. The 5CEFA2M13C8N is rated for commercial temperature range with a junction temperature (TJ) of 0°C to 85°C.
What are the logic element counts for the 5CEFA7F23I7N and 5CEFA2M13C8N?
The 5CEFA7F23I7N contains 149,500 logic elements (LEs). The 5CEFA2M13C8N contains 25,000 logic elements (LEs).
What speed grades are available for the 5CEFA7F23I7N and 5CEFA2M13C8N?
The 5CEFA7F23I7N is specified with speed grade 7. The 5CEFA2M13C8N is specified with speed grade 8. Speed grade affects timing performance and must be considered when migrating between these devices.
Do the 5CEFA7F23I7N and 5CEFA2M13C8N belong to the same FPGA family?
Yes. Both devices are members of the Intel (formerly Altera) Cyclone V FPGA family. However, they differ in logic density, package, temperature grade, and speed grade, so they are not interchangeable without design changes.
What package types are used by the 5CEFA7F23I7N and 5CEFA2M13C8N?
The 5CEFA7F23I7N is offered in a 484-pin FineLine Ball Grid Array (FBGA) package. The 5CEFA2M13C8N is offered in a 383-pin Micro FineLine Ball Grid Array (Micro FBGA) package.