Part A
5CEFA9F23I7N
정보
- Lifecycle
- Active
- Stock
- 4366 PCS
- Package
- BGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F23I7N and 5CEFA2M13C7N are not functionally interchangeable. They differ fundamentally in logic density, package footprint, and operating temperature grade, making direct substitution infeasible without a complete board redesign and thermal revalidation.
Different logic density
Different package footprint
Different temperature grade
Different transceiver count
Parts at a glance
Part B
5CEFA2M13C7N
정보
- Lifecycle
- Active
- Stock
- 3960 PCS
- Package
- TFBGA-383
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F23I7N | 5CEFA2M13C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 25000 | Logic element count determines the maximum complexity of digital designs the FPGA can implement; a large mismatch means the two devices are not functionally interchangeable for most designs. |
| Total RAM Bits | 14251008 | 1945600 | Embedded memory capacity limits buffering, FIFO depth, and data storage on-chip; the larger device supports substantially more memory-intensive applications. |
| Number of I/Os | 480 | 224 | I/O count determines how many external signals and peripherals can be interfaced, directly affecting board-level compatibility and substitutability. |
| Package / Case | FBGA-484 | MBGA-383 | Different package footprints and ball counts are not pin-compatible, so a direct drop-in replacement on the same PCB is not possible. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | The temperature grade determines suitability for industrial versus commercial environments; substituting a commercial part into an industrial application risks reliability. |
| Speed Grade | 7 (faster) | 7 (faster) | Speed grade affects maximum achievable clock frequency and timing closure; matching grades ensures comparable performance. |
| Embedded Multipliers (18x18) | 684 | 132 | DSP block count determines digital signal processing throughput for applications such as filtering and FFT; the large difference limits functional equivalence. |
| Supply Voltage | 1.1 V core | 1.1 V core | Core voltage must match the board power design; identical values indicate power-supply compatibility. |
| Series / Family | Cyclone V E | Cyclone V E | Same family indicates shared architecture, toolchain, and IP support, which simplifies migration between the two devices. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F23I7N | 5CEFA2M13C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F23I7N and the 5CEFA2M13C7N?
The 5CEFA9F23I7N is a Cyclone V FPGA with 301,000 logic elements, 12,200 Kbits of embedded memory, and 480 18x18 multipliers in a 484-pin FBGA package, rated for industrial temperature range (TJ = -40°C to 100°C). The 5CEFA2M13C7N is a Cyclone V FPGA with 25,000 logic elements, 1,400 Kbits of embedded memory, and 72 18x18 multipliers in a 383-pin Micro FBGA package, rated for commercial temperature range (TJ = 0°C to 85°C). The 5CEFA9F23I7N offers significantly higher logic density, memory, and DSP resources, while the 5CEFA2M13C7N provides a smaller footprint and lower power consumption for cost-sensitive applications.
Are the 5CEFA9F23I7N and 5CEFA2M13C7N pin-compatible?
No. The 5CEFA9F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2M13C7N uses a 383-pin Micro FBGA package (13 mm x 13 mm). The package sizes, ball counts, and ball maps differ, so they are not pin-compatible and cannot be used as drop-in replacements without a PCB redesign.
Can the 5CEFA2M13C7N be used as a substitute for the 5CEFA9F23I7N in an existing design?
No, not directly. The 5CEFA2M13C7N has fewer logic elements (25,000 vs 301,000), less embedded memory (1,400 Kbits vs 12,200 Kbits), fewer multipliers (72 vs 480), a different package (383-pin Micro FBGA vs 484-pin FBGA), and a commercial temperature grade instead of industrial. A direct substitution would require significant design changes and may not meet the original logic, memory, DSP, or environmental requirements.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA9F23I7N is rated for industrial temperature range with a junction temperature (TJ) of -40°C to 100°C. The 5CEFA2M13C7N is rated for commercial temperature range with a TJ of 0°C to 85°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled environments.
Which device offers higher logic density and embedded memory?
The 5CEFA9F23I7N offers higher logic density and embedded memory. It contains 301,000 logic elements and 12,200 Kbits of embedded memory, compared to 25,000 logic elements and 1,400 Kbits of embedded memory in the 5CEFA2M13C7N. This makes the 5CEFA9F23I7N more suitable for complex, high-performance applications.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEFA9F23I7N and the 5CEFA2M13C7N are members of the Intel (formerly Altera) Cyclone V FPGA family. They share the same architecture and development tools but differ in logic capacity, memory, DSP resources, package, and temperature grade.
What package types are used by the 5CEFA9F23I7N and 5CEFA2M13C7N?
The 5CEFA9F23I7N is housed in a 484-pin FineLine BGA (FBGA) package with a 23 mm x 23 mm body size. The 5CEFA2M13C7N is housed in a 383-pin Micro FineLine BGA (Micro FBGA) package with a 13 mm x 13 mm body size. The different package types affect PCB layout, thermal performance, and available I/O count.
Which device is more suitable for low-power or space-constrained applications?
The 5CEFA2M13C7N is more suitable for low-power or space-constrained applications due to its smaller 13 mm x 13 mm Micro FBGA package and lower logic density, which typically results in lower static and dynamic power consumption. The 5CEFA9F23I7N, with its larger 23 mm x 23 mm package and higher resource count, is intended for higher-performance applications where power and board space are less critical.