Part A
5CEFA2F23C8N
정보
- Lifecycle
- Active
- Stock
- 2565 PCS
- Package
- FBGA-484
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2F23C8N are not drop-in replacements for each other. The 5CEFA9F27I7N offers substantially higher logic density, greater embedded memory, and more multiplier resources in a larger 672-pin FBGA package, while the 5CEFA2F23C8N provides a lower-density, lower-cost alternative in a smaller 484-pin FBGA package with a faster speed grade. The differences in logic capacity, memory resources, package footprint, and speed grade make them functionally incompatible for direct substitution without a full redesign.
Different logic density
Different memory resources
Different package footprint
Different speed grade
Parts at a glance
Part B
5CEFA9F27I7N
정보
- Lifecycle
- Active
- Stock
- 7586 PCS
- Package
- BGA-672
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2F23C8N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 25000 | Logic element count determines the maximum complexity of digital designs the FPGA can implement; a large mismatch means the two devices are not functionally interchangeable for most designs. |
| Total RAM Bits | 14251008 | 1945600 | Embedded memory capacity limits buffering, FIFO depth, and data storage on-chip; designs needing large memory cannot be ported to the smaller device. |
| Number of I/Os | 336 | 224 | Available user I/O pins constrain peripheral and interface connectivity; fewer pins may prevent direct substitution in systems requiring many external signals. |
| Package / Case | 672-BGA (27x27) | 484-FBGA (23x23) | Package footprint and ball count must match the PCB layout; different packages are not drop-in compatible. |
| Operating Temperature Range | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | Industrial versus commercial temperature grades affect reliability in harsh environments; substituting a commercial-grade part into an industrial application is not acceptable. |
| Speed Grade | 7 (fastest) | 8 (slower) | Speed grade determines maximum achievable clock frequency and timing closure; a slower grade may fail timing requirements met by the faster device. |
| Supply Voltage - Core | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values allow shared power rail architecture. |
| Number of LABs / CLBs | 113560 | 9434 | Logic array blocks define the granularity of programmable logic resources; a large difference indicates vastly different capacity classes. |
| Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain and IP compatibility, but different density variants within the family are not pin or function equivalent. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2F23C8N | 5CEFA9F27I7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 113560 |
| Number of Logic Elements/Cells | 25000 | 301000 |
| Total RAM Bits | 2002944 | 14251008 |
| Number of I/O | 224 | 336 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2F23C8N?
The 5CEFA9F27I7N and 5CEFA2F23C8N are both Intel (formerly Altera) Cyclone V FPGAs, but they differ in logic density, package, and speed grade. The 5CEFA9F27I7N offers approximately 301,000 logic elements (LEs) in a 672-pin FBGA package with an industrial temperature grade and speed grade 7. The 5CEFA2F23C8N offers approximately 25,000 LEs in a 484-pin FBGA package with a commercial temperature grade and speed grade 8. These differences affect logic capacity, I/O count, power, and target applications.
Are the 5CEFA9F27I7N and 5CEFA2F23C8N pin-to-pin compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA package, while the 5CEFA2F23C8N uses a 484-pin FBGA package. The different pin counts, ball maps, and package dimensions mean they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint without redesign.
Can the 5CEFA2F23C8N be used as a direct substitute for the 5CEFA9F27I7N?
No. The 5CEFA2F23C8N has significantly fewer logic elements (approximately 25,000 vs. approximately 301,000), fewer I/O pins due to the smaller 484-pin package, and a different speed grade (8 vs. 7). A direct substitution would require verifying that the reduced logic capacity, I/O count, and timing performance meet the design requirements, and would also require a new PCB layout.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA9F27I7N is specified with an industrial temperature grade, typically supporting a junction temperature range of -40°C to +100°C (Tj). The 5CEFA2F23C8N is specified with a commercial temperature grade, typically supporting a junction temperature range of 0°C to +85°C (Tj). The exact temperature specifications should be confirmed in the respective Intel Cyclone V device datasheets.
Do both devices belong to the same Intel FPGA family?
Yes. Both the 5CEFA9F27I7N and 5CEFA2F23C8N are members of the Intel Cyclone V F-series FPGA family. They share the same architecture, IP support, and development tools, but differ in density, package, speed grade, and temperature grade.
Which device is better suited for high-logic-density applications?
The 5CEFA9F27I7N is better suited for high-logic-density applications because it provides approximately 301,000 logic elements, whereas the 5CEFA2F23C8N provides approximately 25,000 logic elements. The 5CEFA9F27I7N also offers more I/O pins due to its larger 672-pin package, making it more appropriate for complex designs requiring extensive logic and interfacing.
What speed grades are associated with these two part numbers?
The 5CEFA9F27I7N has a speed grade of 7, as indicated by the "7" in the part number suffix. The 5CEFA2F23C8N has a speed grade of 8, as indicated by the "8" in the part number suffix. In Intel Cyclone V nomenclature, a lower speed grade number generally indicates faster performance, so the speed grade 7 device typically supports higher clock frequencies than the speed grade 8 device under equivalent conditions.
Can both devices be used in the same design to scale logic capacity?
They can be used in the same product family strategy for design scaling, but not interchangeably on the same PCB. Because the 5CEFA9F27I7N and 5CEFA2F23C8N have different packages, pin counts, logic densities, and speed grades, a design targeting both would require separate PCB layouts and timing closure for each device. They share the Cyclone V architecture and toolchain, which can simplify IP reuse and firmware porting between the two.