AM1808BZWTD4
텍사스 인스트루먼트(주)
- Lifecycle
- Active
- Stock
- 1425 PCS
- Package
- LFBGA-361
- Series
- 내장형 마이크로프로세서
AM1808BZWTD4과 AM1808BZCED4에 대한 심층 비교를 통해 두 제품의 사양 및 주요 특징에 대한 유용한 정보를 얻을 수 있습니다. RoHS 준수 여부, REACH 인증 상태, 시리즈, 장착 방식, 패키지 유형 및 기타 관련 특성을 포함한 중요한 요소들을 자세히 다룹니다. 두 제품의 차이점을 나란히 제시함으로써 부품 선택이 간소화되어 특정 용도에 가장 적합한 옵션을 쉽게 선택할 수 있습니다.
Replacement verdict
The AM1808BZWTD4 and AM1808BZCED4 are functionally interchangeable Sitara ARM9 microprocessors sharing the same core, package, and peripheral set, with the primary distinction being the operating temperature range. The AM1808BZWTD4 is rated for the commercial temperature range, while the AM1808BZCED4 is rated for the extended industrial temperature range, making the latter suitable for harsher environments. Designers should confirm that the target application's thermal profile aligns with the selected grade before finalizing the replacement.
텍사스 인스트루먼트(주)
텍사스 인스트루먼트(주)
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1808BZWTD4 | AM1808BZCED4 | Why it matters |
|---|---|---|---|
| Operating Temperature Range | -40°C to 90°C (TJ) | -40°C to 105°C (TJ) | The extended junction temperature range of the CED4 variant allows operation in harsher thermal environments, which is critical for industrial and automotive applications. |
| Package / Case | 361-LFBGA (16x16) | 361-LFBGA (16x16) | Both use the same 361-ball LFBGA footprint, so board layout is compatible; however, the thermal suffix differs, affecting solder reflow and thermal management requirements. |
| Speed Grade (Max Clock) | 456 MHz | 456 MHz | Identical core clock speed means equivalent processing throughput for the ARM926EJ-S core, so performance-sensitive firmware behaves the same. |
| Core / Architecture | ARM926EJ-S (ARM9) + C674x DSP | ARM926EJ-S (ARM9) + C674x DSP | Same heterogeneous architecture ensures software and DSP firmware are binary-compatible between the two parts. |
| On-Chip Memory (RAM) | 128 KB shared RAM + 8 KB ARM RAM | 128 KB shared RAM + 8 KB ARM RAM | Identical internal memory resources mean no changes to linker scripts or memory maps when substituting parts. |
| Supply Voltage (Core) | 1.2 V (1.14–1.32 V) | 1.2 V (1.14–1.32 V) | Same core voltage rail allows reuse of the existing power design without regulator changes. |
| Peripheral Set (UART/SPI/I2C/USB) | 3x UART, 2x SPI, 2x I2C, 2x USB 2.0 OTG, EMAC | 3x UART, 2x SPI, 2x I2C, 2x USB 2.0 OTG, EMAC | Identical peripheral complement guarantees drop-in compatibility for interface-driven designs. |
| Product Status / Lifecycle | Active (standard temp grade) | Active (extended temp grade) | Both are active, but the extended-temperature grade is preferred for rugged deployments; availability and lead times may differ between grades. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1808BZWTD4 | AM1808BZCED4 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Obsolete | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 456MHz | 456MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| Ethernet | 10/100Mbps (1) | 10/100Mbps (1) |
| SATA | SATA 3Gbps (1) | SATA 3Gbps (1) |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | -40°C ~ 90°C (TJ) |
Both are AM1808 Sitara ARM926EJ-S application processors from Texas Instruments in a 361-ball NFBGA (ZWT) package. The primary difference is the operating temperature range: the AM1808BZWTD4 is rated for the commercial temperature range of 0°C to 90°C (T), while the AM1808BZCED4 is rated for the extended temperature range of -40°C to 90°C (E). The "D4" suffix in both part numbers indicates a 456 MHz maximum operating frequency.
Yes. Both devices share the same 361-ball ZWT NFBGA package with identical pinout and ball assignments. The only difference is the temperature grade of the silicon, so the PCB land pattern and layout can be identical for both parts.
Functionally, the AM1808BZCED4 is a drop-in replacement for the AM1808BZWTD4 because it has the same package, pinout, and 456 MHz speed grade, and it covers a wider temperature range (-40°C to 90°C vs. 0°C to 90°C). However, the substitution should be validated against the target design's thermal and power requirements, since extended-temperature devices may have different power consumption characteristics at temperature extremes.
Both the AM1808BZWTD4 and AM1808BZCED4 are rated for a maximum ARM core operating frequency of 456 MHz, as indicated by the "D4" speed grade suffix in the part number.
The AM1808BZWTD4 supports the commercial temperature range of 0°C to 90°C (junction/ambient per TI datasheet). The AM1808BZCED4 supports the extended temperature range of -40°C to 90°C, making it suitable for industrial and outdoor applications requiring sub-zero operation.
Yes. Both the AM1808BZWTD4 and AM1808BZCED4 are based on the same AM1808 silicon and integrate the same peripherals, including the ARM926EJ-S core, EMIF, DDR2/mDDR controller, USB 2.0 OTG, Ethernet MAC, LCD controller, McASP, SPI, I2C, UART, and eHRPWM modules. Peripheral availability is identical between the two temperature grades.
The AM1808BZCED4 should be selected for applications requiring operation below 0°C, since its extended temperature rating of -40°C to 90°C covers industrial and outdoor environments. The AM1808BZWTD4 is limited to 0°C to 90°C and is intended for commercial-temperature applications only.