10M08SAM153I7G

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10M08SAM153I7G

+BOM

IC FPGA 112 I/O 153MBGA

  • 제조업체정보

  • 제조업체 부품 #10M08SAM153I7G

  • 패키지 153-VFBGA

  • 재고3026

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package Tray
Series MAX® 10
ProductStatus Active
NumberofLABs/CLBs 500
NumberofLogicElements/Cells 8000
TotalRAMBits 387072
NumberofI/O 112
Voltage-Supply 2.85V ~ 3.465V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 153-VFBGA

개요

Description

The "10M08SAM153I7G" is a specific model of an Intel MAX 10 FPGA (Field-Programmable Gate Array) device. FPGAs are integrated circuits designed to be configured by the customer after manufacturing, allowing for customizable hardware configurations. The "10M08" indicates the device series and logic element count, with "08" representing approximately 8,000 logic elements.
Key features of the MAX 10 devices include:
1. Non-volatile Configuration Memory: They retain configuration after power cycling, eliminating the need for external configuration devices.
2. Embedded Flash: Provides on-chip storage for user data and configuration.
3. Mixed-Signal Capability: Includes analog-to-digital converters (ADCs) for applications requiring analog input.
4. Low Power Consumption: Suitable for power-sensitive applications.
5. Single-Chip Solution: Combines logic, storage, and processing capabilities in one package.
6. Versatile I/O Options: Supports a wide range of protocols and interfaces.
The "SAM153I7G" refers to specific package, temperature grade, and other variant-specific features, such as the UFBGA153 package type, industrial temperature range, and RoHS compliance.

Equivalent

The 10M08SAM153I7G is part of Intel's MAX 10 FPGA family. Equivalent products would be other models within the MAX 10 series with similar specifications, such as the 10M08SAU169I7G or the 10M08SCE144I7G. These models offer comparable features, including logic elements, embedded memory, and I/O pins, but may differ in package type or pin count. Always consult the specific datasheets to ensure compatibility with your design requirements.

Features

The 10M08SAM153I7G is a part of the Intel MAX 10 family of FPGAs. Key features include:
1. Non-volatile FPGA: Integrates flash memory for instant-on configuration.
2. Logic Elements (LEs): Contains 8,000 logic elements.
3. Integrated Analog-to-Digital Converter (ADC): Includes ADC functionality for analog signal processing.
4. Operating Temperature Range: Supports industrial temperature ranges.
5. Embedded Memory: Features on-chip memory storage capabilities.
6. General Purpose I/Os: Offers multiple I/O options for various interfacing needs.
7. Package Type: Available in a 153-pin Micro FineLine BGA package.
8. Power Management: Includes efficient power management features to reduce consumption.
9. Configuration Options: Provides flexible configuration options, including JTAG and internal configuration.
10. Development Support: Compatible with Intel's Quartus Prime software for design and development.
These features make it suitable for applications in industrial, automotive, and consumer electronics where reliable, low-power, instant-on FPGAs are necessary.

Pinout

The 10M08SAM153I7G is a member of the Intel MAX 10 FPGA family. It features 153 pins in a Micro FineLine BGA (MBGA) package. This specific FPGA model provides a range of functionalities, including:
1. Logic Elements (LEs): The FPGA contains 8,000 LEs, which are used to implement custom digital logic.
2. Memory Blocks: It includes embedded memory blocks to store data and facilitate efficient data processing.
3. Phase-Locked Loops (PLLs): These are used for clock management and to generate various clock frequencies from a single source.
4. Analog-to-Digital Converter (ADC): Some variations offer ADC functionality to interface with analog signals.
5. General Purpose I/Os: The device supports a variety of I/O standards, making it versatile for connecting with other digital components.
6. Embedded Multipliers: Useful for DSP applications, providing efficient multiply operations.
7. Configuration via Dual-Configuration Flash: Allows the FPGA to store multiple configuration files.
The 10M08SAM153I7G is suitable for a wide range of applications such as industrial, automotive, and consumer electronics due to its low power consumption and flexible design capabilities.

Manufacturer

The manufacturer of the 10M08SAM153I7G is Intel Corporation. This particular part is a member of the Intel MAX 10 FPGA family. Intel Corporation is a multinational technology company based in the United States, known for designing and manufacturing semiconductor components, particularly microprocessors and integrated circuits. The company was founded in 1968 and has played a significant role in the advancement of computing technology.
Intel is one of the leading companies in the semiconductor industry, producing a wide range of products for various applications, including personal computers, servers, and embedded systems. The company is also involved in the development of technologies related to artificial intelligence, data centers, and the Internet of Things (IoT). Over the years, Intel has expanded its portfolio to include programmable solutions like FPGAs, which cater to diverse industries such as telecommunications, automotive, and industrial automation. The acquisition of Altera in 2015 significantly bolstered Intel's FPGA capabilities, integrating them into its existing product line and allowing the company to offer more comprehensive solutions to its customers.

Application

The 10M08SAM153I7G is an Intel MAX 10 FPGA, which is used in various applications due to its flexibility and integration capabilities. Common application areas include:
1. Industrial Automation: Controls and interfaces for machinery and processes.
2. Consumer Electronics: Custom logic and signal processing.
3. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
4. Communications: Signal processing and protocol bridging.
5. Medical Devices: Data acquisition and processing for diagnostic equipment.
6. IoT: Edge processing and connectivity solutions.
7. Aerospace and Defense: Secure communications and sensor interfacing.
These applications benefit from the device's non-volatile configuration, low power consumption, and integrated analog-to-digital converters.

Package

The 10M08SAM153I7G is a part of the Intel MAX 10 FPGA series. Its package type is a 153-pin Micro FineLine BGA (Ball Grid Array).

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