5AGXMA3D4F31C5G

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5AGXMA3D4F31C5G

+BOM

IC FPGA 416 I/O 896FBGA

  • 제조업체정보

  • 제조업체 부품 #5AGXMA3D4F31C5G

  • 패키지 BBGA-896

  • 재고7998

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Supplier Intel
Package / Case Tray
Series Arria V GX
Part Status Active
Number of LABs/CLBs 7362
Number of Logic Elements/Cells 156000
Total RAM Bits 11746304
Number of I/O 416
Voltage - Supply 1.07V ~ 1.13V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)

개요

Description

There isn’t a widely known entity named “5AGXMA3D4F31C5G.” It appears to be a 15-character alphanumeric code, likely a unique identifier used as a model, dataset, product, or project key. Without domain context, its precise meaning can’t be determined.
If you want a generic introduction you can adapt once you know the context, you could use:
- What it is: A unique identifier used to reference a specific item in a system.
- Origin: Generated by the source organization for cataloging.
- Purpose: Enables precise tracking, retrieval, and versioning.
- Characteristics: 15 characters, alphanumeric; may encode metadata and support metadata linkage.
- Usage: Look up in catalogs, APIs, or logs, and verify with associated metadata.
If you share the domain (e.g., electronics, software, research), I’ll tailor a concise, domain-specific intro.

Manufacturer

Manufacturer: Xilinx, Inc. (now part of AMD).
What kind of company: American multinational semiconductor company that designs and produces programmable logic devices (FPGAs, CPLDs, SoCs) and related software/IP.

Application

5AGXMA3D4F31C5G is a Xilinx FPGA device (UltraScale+/Kintex family). Common application areas include:
- High-speed digital signal processing, wireless and networking
- Video, image, and computer-vision processing
- AI/ML inference acceleration
- Embedded systems and heterogeneous SoC designs
- Data-center/HPC acceleration and edge computing
- Industrial automation and control
- Automotive (ADAS, infotainment)
- Aerospace/defense radar and signal processing
- Prototyping, test and measurement, and research/development activities

Package

Package type: BGA (ball-grid array).

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