5CGXFC9E6F35I7N

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5CGXFC9E6F35I7N

+BOM

IC FPGA 560 I/O 1152FBGA

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Series Cyclone® V GX
Part Status Active
Digi Key Programmable Not Verified
Number of Logic Elements / Cells 301000
Total RAM Bits 14251008
Number of I/O 560
Voltage - Supply 1.07V ~ 1.13V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5CGXFC9
Number of LA Bs / CL Bs 113560

개요

Description

The code "5CGXFC9E6F35I7N" does not correspond to any widely recognized concept, product, or standard referencing system. It appears to be a unique identifier or alphanumeric code that could potentially relate to a specific product, software, or internal system related to a company or database. Without additional context, it's difficult to provide a precise introduction or explanation of its significance. If you have relevant details or a specific field in mind, please share them for a more tailored response.

Equivalent

The 5CGXFC9E6F35I7N chip is part of the Intel/Altera Cyclone 10 GX FPGA family. Equivalent products include the Cyclone 10 LP series and other Cyclone 5 or 20 series FPGAs, depending on specific requirements like I/O count, performance, and power consumption. For precise alternatives, consider the intended application specifications and performance metrics. Always check with suppliers for the most suitable replacements.

Pinout

The 5CGXFC9E6F35I7N is a part of the Intel Cyclone 10GX FPGA family. It features a pin count of 484 pins.
The FPGA is designed for a variety of applications, including telecommunications, automotive, and data processing. The device supports multiple I/O standards and offers a range of functionalities such as high-speed serial interfaces, logic cells, DSP blocks, and memory blocks.
The "35" in the part number indicates the device’s logic cell count, while the "I7N" signifies the speed grade and package type. The 5CGXFC9E6F35I7N provides flexibility for users to implement custom logic and control systems in their designs.

Manufacturer

The 5CGXFC9E6F35I7N is manufactured by Intel Corporation, a leading technology company known for designing and manufacturing semiconductor products, particularly microprocessors and integrated circuits. Founded in 1968 and headquartered in Santa Clara, California, Intel is one of the largest and most influential companies in the computer hardware industry.
Intel primarily focuses on developing advanced computing technologies and solutions for personal computers, data centers, and embedded systems. The company is well-known for its innovations in microprocessor architecture and has played a crucial role in the growth of the personal computing market. In addition to CPUs, Intel produces a wide range of products, including memory modules, chipsets, and field-programmable gate arrays (FPGAs), like the one associated with the 5CGXFC9E6F35I7N part number.
Intel's FPGAs are used in various applications, including telecommunications, automotive systems, and industrial automation, showcasing the company's commitment to providing versatile and high-performance solutions across multiple sectors.

Application

The 5CGXFC9E6F35I7N is a specific model of FPGA (Field Programmable Gate Array) from Intel's Cyclone series, primarily used in applications such as:
1. Digital Signal Processing: For implementing complex algorithms in telecommunications and audio processing.
2. Embedded Systems: In robotics, automotive control systems, and industrial automation.
3. Data Processing: For high-speed data acquisition and processing in scientific and commercial applications.
4. Video and Image Processing: Used in video surveillance, broadcasting, and real-time image analysis.
5. Prototyping and Development: For hardware design, testing, and validation in engineering projects.
These areas leverage its flexibility, performance, and efficiency in handling parallel processing tasks.

Package

The package type of the 5CGXFC9E6F35I7N is a 484-pin FBG (Fine Ball Grid Array) package. This is commonly used for FPGA devices, providing a compact form factor and efficient thermal and electrical performance.

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