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ADSP-BF561SBBCZ-5A
+BOMIC DSP CTRLR 32B 500MHZ 256CBGA
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제조업체아날로그 디바이스(주)
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제조업체 부품 #ADSP-BF561SBBCZ-5A
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패키지 CSPBGA-256
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재고2628
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사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Blackfin® |
| Part Status | Active |
| Type | Fixed Point |
| Interface | SPI, SSP, UART |
| Clock Rate | 533MHz |
| Non - Volatile Memory | External |
| On - Chip RAM | 328kB |
| Voltage - I / O | 2.50V, 3.30V |
| Voltage - Core | 1.25V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
개요
Equivalent
- ADSP-BF561SBBCZ-5 (same series, minor variant)
- ADSP-BF533/537/539 (single-core Blackfin alternatives)
- ADSP-21489 (SHARC DSP for high-performance audio)
- TMS320C6748 (TI’s DSP with similar capabilities)
For exact replacements, check Analog Devices' cross-reference or newer Blackfin/ SHARC processors.
Features
- Dual-core architecture: Two 600 MHz Blackfin cores for high-performance signal processing.
- Memory: 328 KB on-chip RAM (164 KB per core), 4 MB flash.
- Performance: Up to 1200 MMACS (combined).
- Power: 1.2–1.3V core voltage, low-power design.
- I/O & Peripherals:
- 2x SPI, 2x UART, 2x serial ports (SPORTs).
- 16-bit parallel peripheral interface (PPI).
- 12x PWM timers, RTC, watchdog timer.
- Package: 297-ball CSP_BGA (13x13 mm).
- Industrial temp range: -40°C to +85°C.
Ideal for multimedia, automotive, and industrial applications requiring efficient dual-core processing.
Pinout
- Pin Count: 297-ball CSP-BGA (Chip Scale Package Ball Grid Array)
- Key Functions:
- Dual 500 MHz Blackfin cores (16/32-bit RISC architecture)
- High-performance signal processing (DSP + microcontroller capabilities)
- On-chip memory: 328 KB SRAM (shared between cores)
- Peripherals:
- Parallel Peripheral Interface (PPI)
- SPI, UART, Timers, PWM
- Ethernet MAC (10/100 Mbps)
- DMA controllers
- External memory support: SDRAM, flash, SRAM
Designed for multimedia, telecom, and embedded applications requiring high-speed processing.
Application
1. Audio/Video Processing – Real-time encoding/decoding in multimedia devices.
2. Communications – Base stations, VoIP, and software-defined radio.
3. Industrial Control – Motor control, automation, and robotics.
4. Automotive – Infotainment, driver assistance, and telematics.
5. Medical Imaging – Ultrasound and portable diagnostic equipment.
6. Military/Aerospace – Radar, sonar, and secure communications.
Its dual-core architecture and low power make it ideal for high-performance embedded applications.
