AM3352BZCZD60

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AM3352BZCZD60

+BOM

IC MPU SITARA 600MHZ 324NFBGA

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  • 패키지 NFBGA-324

  • 재고5032

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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사양

속성 가치
Package / Case Tray
Series Sitara™
Part Status Active
Core Processor ARM® Cortex®-A8
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 600MHz
Co - Processors / DSP Multimedia; NEON™ SIMD
RAM Controllers LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration Yes
Display&Interface Controllers LCD, Touchscreen
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 + PHY (2)
Voltage - I / O 1.8V, 3.3V
Operating Temperature -40°C ~ 90°C (TJ)
Security Features Cryptography, Random Number Generator

개요

Equivalent

The AM3352BZCZD60 is a Sitara ARM Cortex-A8 processor from Texas Instruments. Equivalent alternatives include:
1. AM3352BZCZ60 (same specs, different package)
2. AM3354BZCZD60 (higher performance, more peripherals)
3. AM3358BZCZD60 (similar, with enhanced graphics)
4. i.MX6UL from NXP (similar Cortex-A7, lower power)
5. STM32MP157 from STMicroelectronics (dual-core Cortex-A7)
Check datasheets for exact compatibility.

Pinout

The AM3352BZCZD60 is a 60-pin (BGA package) ARM Cortex-A8 microprocessor from Texas Instruments.
Key Functions:
- CPU: 1GHz Cortex-A8 core
- Memory: Supports DDR2/DDR3/LPDDR, NAND, NOR flash
- Interfaces: USB 2.0, UART, SPI, I²C, MMC/SD
- Peripherals: 2x PRU-ICSS (Programmable Real-Time Units), Ethernet MAC, ADC, PWM
- GPIO: Multiple configurable pins
Used in embedded systems like industrial automation, IoT, and consumer devices.

Application

The AM3352BZCZD60, a member of Texas Instruments' Sitara™ AM335x ARM Cortex-A8 processor family, is widely used in:
- Industrial Automation (PLCs, HMIs, motor control)
- Embedded Computing (gateways, edge devices)
- Consumer Electronics (smart appliances, POS systems)
- Medical Devices (portable diagnostics, monitoring)
- Automotive (infotainment, telematics)
- IoT & Smart Energy (meters, sensors)
Its low power, real-time processing, and rich peripherals (Ethernet, USB, PRU-ICSS) make it ideal for cost-sensitive, connected embedded systems.

Package

The AM3352BZCZD60 is packaged in a 256-pin NFBGA (ZCE suffix), measuring 17 mm × 17 mm with a 0.8 mm ball pitch. This BGA (Ball Grid Array) package is designed for high-density PCB mounting, suitable for embedded applications. The "Z60" denotes its industrial temperature range (-40°C to +105°C).

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