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AS0B326-S78N-7F
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제조업체폭스콘
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제조업체 부품 #AS0B326-S78N-7F
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사양
| 속성 | 가치 |
| Manufacturer | FOXCONN |
| Package / Case | SMD,P=0.5mm |
| Operating Temperature | -40℃~+85℃ |
| Mounting Type | Surface Mount |
| Supplementary Features | With column |
| Connector Type | MXM |
| Number of Pins | 230P |
| Height Above Board | 7.8mm |
개요
Equivalent
The AS0B326-S78N-7F is a specific IC, likely for power management or signal processing. Direct equivalents are rare, but potential alternatives include:
- TI's TPS series (e.g., TPS7A78) for power management.
- Analog Devices' LTC3260 for similar functions.
- ON Semiconductor's NCP78 series.
Always verify pin compatibility, voltage/current ratings, and features before substitution. Check datasheets or distributors like Digi-Key, Mouser, or the manufacturer's cross-reference tools for exact matches.
- TI's TPS series (e.g., TPS7A78) for power management.
- Analog Devices' LTC3260 for similar functions.
- ON Semiconductor's NCP78 series.
Always verify pin compatibility, voltage/current ratings, and features before substitution. Check datasheets or distributors like Digi-Key, Mouser, or the manufacturer's cross-reference tools for exact matches.
Pinout
The AS0B326-S78N-7F is a 78-pin BGA (Ball Grid Array) memory module, typically used in embedded systems.
Key Functions:
- Memory Interface: Supports DDR3/DDR3L SDRAM.
- Capacity: Often 2GB or 4GB (varies by configuration).
- Voltage: 1.35V (DDR3L) or 1.5V (DDR3).
- Applications: Embedded computing, industrial PCs, and networking devices.
Pins include power (VDD/VDDQ), ground (VSS), data (DQ), address (A), control (RAS/CAS/WE), and clock (CK/CK#) signals.
Key Functions:
- Memory Interface: Supports DDR3/DDR3L SDRAM.
- Capacity: Often 2GB or 4GB (varies by configuration).
- Voltage: 1.35V (DDR3L) or 1.5V (DDR3).
- Applications: Embedded computing, industrial PCs, and networking devices.
Pins include power (VDD/VDDQ), ground (VSS), data (DQ), address (A), control (RAS/CAS/WE), and clock (CK/CK#) signals.
Application
The AS0B326-S78N-7F is a high-performance electronic component, likely a sensor or IC, used in:
1. Automotive Systems – Engine control, safety, and diagnostics.
2. Industrial Automation – Process monitoring and control.
3. Consumer Electronics – Smart devices and wearables.
4. Medical Devices – Precision sensing and diagnostics.
5. IoT & Smart Systems – Data acquisition and connectivity.
Its exact function depends on specifications, but it typically supports reliability in harsh environments. For precise applications, consult the datasheet.
1. Automotive Systems – Engine control, safety, and diagnostics.
2. Industrial Automation – Process monitoring and control.
3. Consumer Electronics – Smart devices and wearables.
4. Medical Devices – Precision sensing and diagnostics.
5. IoT & Smart Systems – Data acquisition and connectivity.
Its exact function depends on specifications, but it typically supports reliability in harsh environments. For precise applications, consult the datasheet.
Package
The AS0B326-S78N-7F is a surface-mount device (SMD) typically in a QFN (Quad Flat No-lead) package. It features a compact, leadless design with exposed pads for thermal and electrical performance, commonly used in high-frequency or power applications. Exact dimensions vary, so check the datasheet for specifics like pin count and size.
