AS4C128M16D2A-25BIN

The AS4C128M16D2A-25BIN is a high-performance DRAM (Dynamic Random Access Memory) chip designed for various applications, including consumer electronics and industrial systems. It features a storage capacity of 128 Megabits, organized as 8 Megabytes (8 bits wide), making it suitable for processing larger data sets.
Key specifications include a 16-bit data bus, a maximum clock frequency of 200 MHz, and a supply voltage of 1.8V, which enhances its energy efficiency. The chip supports various access modes, such as burst and random, allowing for flexible operation within different applications.
In addition to its technical capabilities, the AS4C128M16D2A-25BIN is known for its reliability and speed, making it ideal for tasks requiring quick data retrieval and storage. Its compact design and compatibility with standard interfaces make it easily integrable into existing systems, promoting versatility in hardware design.

The AS4C128M16D2A-25BIN is a 2GB DDR3 SDRAM chip. Equivalent products include:
1. MT41K128M16HA-125
2. H5TQ2G83AFR-PBA
3. K4B4G1646D-BCK0
4. IS43TR16640B-25BLI
Ensure compatibility with your specific application, as alternatives may have different specifications or features.

The AS4C128M16D2A-25BIN is a 2-gigabit (2Gb) DDR3 SDRAM memory chip with the following key features:
1. Organization: It has a memory organization of 128M x 16, allowing for efficient data handling.
2. Speed: Operates at a data rate of 800 Mbps with a clock frequency of 400 MHz.
3. Voltage: Designed to operate at a low voltage of 1.5V, which enhances power efficiency.
4. Package: Available in a 78-ball TFBGA (Thin Fine Ball Grid Array) package, which provides a compact footprint.
5. Operating Temperature: Supports a commercial temperature range of 0°C to 70°C, suitable for standard applications.
6. Features: Includes features like burst mode, multiple banks (8 banks), and self-refresh capability, making it suitable for high-performance computing.
7. Compatibility: Compliant with JEDEC standards, ensuring compatibility with various DDR3 memory controllers.
These features make the AS4C128M16D2A-25BIN suitable for applications in computing and consumer electronics where high-speed memory is required.

The AS4C128M16D2A-25BIN is a 2GB (128M x 16-bit) DDR3 SDRAM memory chip. It has a total pin count of 78 pins.
Key functions include:
- Data Input/Output: Supports 16 data bits for read and write operations.
- Addressing: Uses a 13-bit address bus to select memory locations.
- Control Signals: Includes pins for clock (CK, CK#), chip enable (CE#), write enable (WE#), and others for operational control.
- Power Management: Features pins for power supply connections (VDD, VSS) and functionality like self-refresh.

This memory is designed for use in various applications, including computers and embedded systems, and operates at a clock speed of 800 MHz with a data rate of 1600 MT/s.

The AS4C128M16D2A-25BIN is manufactured by Alliance Semiconductor Corporation. Alliance Semiconductor is a company that specializes in developing and supplying high-performance memory and mixed-signal semiconductor solutions. Founded in 1987, the company focuses on providing innovative memory products, including DRAM and SRAM, primarily for applications in computing, consumer electronics, telecommunications, and automotive sectors.
Alliance Semiconductor operates in the semiconductor industry, which involves designing, manufacturing, and selling electronic components used in a wide range of technologies. Their products are integral to various applications, supporting advancements in data processing and storage capabilities. The company serves global markets, emphasizing quality, reliability, and customer satisfaction in its offerings.

The AS4C128M16D2A-25BIN is a 2Gb DDR3 SDRAM memory chip commonly used in various applications, including:
1. Consumer Electronics: Televisions, game consoles, and set-top boxes.
2. Computers and Laptops: Main memory for desktops, notebooks, and servers.
3. Networking Devices: Routers and switches for enhanced data handling.
4. Industrial Applications: Control systems and automation equipment.
5. Telecommunications: Base stations and communication devices.
6. Automotive: In-vehicle infotainment systems and navigation units.
Its high-speed performance and reliability make it suitable for applications requiring efficient data processing and storage.

The AS4C128M16D2A-25BIN is packaged in a standard 78-ball TFBGA (Thin Fine Pitch Ball Grid Array) form factor, which facilitates compact design and efficient thermal performance for memory applications.