AS4C128M16D3LC-12BIN

The AS4C128M16D3LC-12BIN is a DDR3 SDRAM chip from Alliance Memory. Equivalent products would typically include similar DDR3 SDRAM chips from other manufacturers with comparable specifications, such as the Micron MT41J128M16, Samsung K4B2G1646Q, or Hynix H5TQ2G63DFR. Ensure compatibility in terms of memory size, speed grade, and package type when considering alternatives.

The AS4C128M16D3LC-12BIN is a 2Gb DDR3 SDRAM memory module. Key features include:
1. Density and Organization: It has a density of 2Gb, organized as 128M x 16 bits.
2. Speed: Operates at a maximum clock speed of 800 MHz, which corresponds to a data rate of 1600 MT/s.
3. Voltage: It runs at a low voltage of 1.35V, which helps in reducing power consumption.
4. Package: Available in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package, facilitating compact integration.
5. Temperature Range: Supports an industrial temperature range from -40°C to 95°C, suitable for various environmental conditions.
6. Refresh: Features an 8K refresh cycle, ensuring data integrity over time.
7. Compatibility: Meets the JEDEC standards for DDR3, ensuring compatibility with a wide range of systems.
8. Additional Features: Includes on-die termination (ODT) and programmable CAS latency, enhancing performance and flexibility.
These features make it suitable for applications requiring efficient, high-speed memory solutions.

The AS4C128M16D3LC-12BIN is a 2Gb DDR3 SDRAM memory chip manufactured by Alliance Memory. It features a 96-ball FBGA (Fine-pitch Ball Grid Array) package. The pin count for this chip is 96.
This memory chip's primary function is to provide high-speed data storage and retrieval for electronic devices, making it suitable for use in computers, servers, and other digital devices requiring rapid access to large volumes of data. It operates at a clock frequency of 933 MHz (DDR3-1866) and has a data transfer rate of up to 1866 MT/s (megatransfers per second). The chip is organized as 128M x 16 bits, which allows it to efficiently handle large data blocks. Additionally, it supports several features typical of DDR3 SDRAM, including programmable CAS latency, burst lengths, and auto-refresh/self-refresh functions, which enhance its performance and reliability in various applications.

The AS4C128M16D3LC-12BIN is a memory product manufactured by Alliance Memory, Inc. Alliance Memory is a company that specializes in providing legacy memory products, including DRAM, SRAM, and SDRAM, to serve industrial and telecommunications markets. Their product offerings cater to the needs of customers who require memory components that are no longer produced by major memory manufacturers. Alliance Memory focuses on supporting long-term availability and offering compatible replacements for discontinued memory products, ensuring continuity for applications that rely on these components.

The AS4C128M16D3LC-12BIN is a DDR3 SDRAM chip commonly used in applications requiring high-speed data transfer and memory efficiency. Key application areas include:
1. Consumer Electronics: Enhances performance in devices like TVs, set-top boxes, and gaming consoles.
2. Computing Devices: Used in laptops, desktops, and workstations to facilitate multitasking and improve system responsiveness.
3. Networking Equipment: Supports faster data processing in routers, switches, and other networking hardware.
4. Industrial Systems: Provides reliable memory solutions for embedded systems and automation equipment.
5. Telecommunications: Utilized in base stations and communication infrastructure for efficient data handling.
These applications benefit from the chip's high density, speed, and low power consumption.

The AS4C128M16D3LC-12BIN is a DRAM memory chip with a Fine-Pitch Ball Grid Array (FBGA) package type. This compact package is often used in memory modules for its space efficiency and reliability.