BCM56962B1KFSBG

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BCM56962B1KFSBG

+BOM

2.4T: 24X 100G / 96X 25G

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개요

Description

BCM56962B1KFSBG is a Broadcom switch ASIC (Tomahawk-class) used in data-center switch platforms. It provides high-throughput, low-latency packet forwarding with full L2/L3 capabilities, QoS, ACLs, multicast support, and hardware acceleration for routing/processing tasks. The silicon targets high port-density configurations (typical 100 GbE/40 GbE line-rate interfaces) and is designed to be used with Broadcom software stacks (SDK/OpenNSL-style tooling) on OEM platforms. The suffix B1KFSBG denotes a specific packaging/variant of the BCM56962 silicon (temperature range, memory map, package type). For exact specifications (throughput, port counts, memory/buffer, timing), consult the official Broadcom data sheet and platform hardware guide.

Features

I don’t have the exact official spec sheet on hand. Here’s a concise, high-level feature overview for BCM56962B1KFSBG (Tomahawk-class switch ASIC):
- High-performance L2/L3 switching with line-rate forwarding
- Supports multiple port speeds and dense port configurations (10G/25G/40G/100G)
- Hardware-based ACLs with large forwarding/TCAM for IPv4/IPv6 and multicast
- Advanced QoS with hierarchical scheduling, shaping, and policers
- VRF, ECMP routing, and IP routing support
- EVPN/VXLAN data-center fabric capabilities; MLAG support
- Precision time protocol (PTP) hardware timestamping for synchronization
- Programmable/SDK-enabled forwarding pipeline with memory/TCAM resources
- Power- and resource-efficient design suitable for data-center deployments
For exact numbers (fabric rate, exact port mapping, TCAM sizes, memory, package details), please share the official datasheet or allow me to fetch it.

Pinout

Pin count: Not publicly specified here; BCM56962B1KFSBG uses a high-pin-count BGA package (the exact number is in the Broadcom packaging/datasheet).
Function: A Broadcom BCM56962 Ethernet switch/SoC with integrated MAC/PHY and switch fabric for multi-port network switching (enterprise/datacenter use). For the exact pin count, refer to the official Broadcom datasheet/packaging information.

Manufacturer

- Manufacturer: Broadcom Inc.
- What kind of company: A global American semiconductor company (fabless) that designs and sells a wide range of ICs and related infrastructure software for networking, data centers, storage, wireless, and broadband applications.

Application

BCM56962B1KFSBG is Broadcom’s high‑end Ethernet switch ASIC for data‑center and enterprise networks. Typical application areas:
- Data‑center leaf/spine/top‑of‑rack (ToR) switches and white‑box platforms
- High‑density 25/40/100 GbE server connectivity and fabric interconnects
- Enterprise campus/core/distribution switches with low latency and QoS
- Service provider edge/aggregation and IX facilities
- Cloud/virtualized networks (EVPN‑VXLAN) with hardware acceleration and programmable fabric
In short: scalable, high‑performance switching for hyperscale, brownfield and greenfield deployments.

Package

BGA (ball-grid array) package.

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