BCM7584NCKFEBA03G

이미지는 참조용입니다.

BCM7584NCKFEBA03G

+BOM

SOC SET TOP BOX IC

  • 제조업체브로드컴 유한회사

  • 제조업체 부품 #BCM7584NCKFEBA03G

  • 재고3720

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
ProductStatus Obsolete

개요

Description

The BCM7584NCKFEBA03G is a specific model of a set-top box (STB) chipset developed by Broadcom. It is designed to support digital television services, providing high-definition video decoding, advanced audio processing, and enhanced interactive features. The chipset is typically integrated into devices that facilitate the reception of satellite, cable, or IPTV signals, converting them into a format that can be displayed on televisions.
Key features of the BCM7584NCKFEBA03G may include support for various video codecs such as H.264 and HEVC, enabling efficient streaming of high-quality video content. It often includes built-in security features to protect content, support for multiple broadcast standards, and connectivity options for interfacing with other home entertainment devices. Additionally, it might be equipped with an integrated CPU to handle interactive applications and a graphics processing unit (GPU) for rendering user interfaces and graphics.
This chipset is part of Broadcom's broader product line aimed at enhancing the capabilities and performance of digital television delivery systems.

Equivalent

The BCM7584NCKFEBA03G is a Broadcom set-top box system-on-chip (SoC). Equivalent products would include SoCs from other manufacturers with similar functionalities, such as the STMicroelectronics STiH418, the Amlogic S905 series, or the HiSilicon Hi3798 series. These alternatives generally offer similar capabilities in terms of video decoding, security features, and connectivity for set-top box applications. Always verify specific requirements for direct compatibility.

Features

The BCM7584NCKFEBA03G is a highly integrated chip designed for advanced set-top box (STB) applications. It features a high-performance dual-core processor that supports full HD video decoding and encoding, offering smooth playback and recording capabilities. The chipset supports multiple video formats, including H.264, MPEG-2, and VC-1, ensuring compatibility with various content sources.
In terms of connectivity, it includes built-in support for high-speed Ethernet, USB, and HDMI, facilitating seamless interaction with other devices and networks. The BCM7584NCKFEBA03G also provides robust security features, including digital rights management (DRM) support to protect content from unauthorized access.
Additionally, the chip is designed for low power consumption, making it an energy-efficient choice for modern STBs. Its advanced graphics capabilities support rich user interfaces, enhancing the viewer's experience. Overall, the BCM7584NCKFEBA03G offers a comprehensive solution for delivering high-quality digital television services.

Manufacturer

The BCM7584NCKFEBA03G is a chipset manufactured by Broadcom Inc. Broadcom is a global technology company that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions. It serves various markets, including data center, networking, software, broadband, wireless, and storage. Broadcom is known for its innovations in semiconductor technology and has a strong presence in the production of chips for telecommunications and networking equipment.

Application

The BCM7584NCKFEBA03G is typically used in digital set-top boxes and home entertainment systems. It supports applications such as satellite, cable, and IPTV (Internet Protocol Television) set-top boxes, enabling high-definition video processing, digital video recording, and interactive TV services. The chip facilitates advanced audio and video output, networking capabilities, and enhanced security features for content protection. It is ideal for use in smart TVs, streaming devices, and other digital media players that require efficient media processing and connectivity options.

Package

The BCM7584NCKFEBA03G is a chipset package used in electronic devices, such as set-top boxes. Its package type is typically a Ball Grid Array (BGA), which allows for high-density connections by placing solder balls on the underside of the chip to connect with the PCB.

BCM7584NCKFEBA03G과 관련된 제품