BGM1013,115

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BGM1013,115

+BOM

IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Supplier NXP USA Inc.,Rochester Electronics, LLC
Package Tape & Reel (TR),Cut Tape (CT),Bulk
ProductStatus Obsolete
Frequency 0Hz ~ 2.2GHz
P1dB 13dBm
Gain 35.5dB
NoiseFigure 4.6dB ~ 4.7dB
RFType ISM
Voltage-Supply 5V ~ 6V
Current-Supply 27.5mA
TestFrequency 1GHz
MountingType Surface Mount
Package/Case 6-TSSOP, SC-88, SOT-363

개요

Description

"BGM1013,115" is likely a course code and title, possibly related to a university or college curriculum. However, without specific context, it is difficult to determine the exact subject or focus of this course. Generally, introductory courses like BGM1013 are designed to provide foundational knowledge in a particular field, facilitating further study in more advanced topics. The inclusion of numbers, such as "1013" or "115", typically indicates the level and sequence of the course within a program of study.
To understand what BGM1013,115 specifically covers, one would typically refer to the course syllabus or description provided by the academic institution offering it. This would outline the key topics, learning objectives, prerequisites, and potentially the structure of the course, including lectures, assessments, and any required materials.
For precise details about BGM1013,115, including its subject matter and requirements, contacting the relevant department or consulting the institution’s course catalog might be necessary.

Equivalent

The BGM1013,115 is a Bluetooth 5.2 System-on-Chip (SoC) typically used in wireless communication applications. Equivalent products with similar features might include:
1. Nordic Semiconductor nRF52832: A versatile SoC with Bluetooth 5.0 support.
2. Texas Instruments CC2640R2F: A Bluetooth 5 SoC known for low power consumption.
3. Dialog Semiconductor (now Renesas) DA14531: A small, power-efficient Bluetooth 5.1 SoC.
4. Qualcomm QCC5100-series: Advanced Bluetooth audio SoCs.
Ensure to compare specific features like power consumption, range, and peripheral support for suitability.

Pinout

The BGM1013,115 is a Bluetooth module from NXP Semiconductors. It typically has a pin count of around 34 pins. This module integrates a Bluetooth Low Energy (BLE) radio, a protocol stack, and a profile software with an ARM Cortex-M0 processor.
The primary function of the BGM1013,115 is to enable wireless communication in electronic devices. It is designed for applications that require Bluetooth connectivity, such as IoT devices, health and fitness monitors, and smart home products. The module supports various Bluetooth profiles and offers low power consumption, which is ideal for battery-operated devices.
Key features often include GPIO, I2C, SPI, and UART interfaces, which provide flexibility for connecting with other components. Always consult the specific datasheet for precise technical details and pin configuration.

Manufacturer

The BGM1013,115 is manufactured by NXP Semiconductors, a global semiconductor company. NXP specializes in the design and production of various semiconductor products, including integrated circuits used in automotive, communication, industrial, mobile, and consumer applications. The company is known for its expertise in areas such as secure connectivity solutions, microcontrollers, and sensors. NXP's products are integral to enabling smart and secure interactions across a wide range of electronic devices and systems.

Application

BGM1013,115 is a proprietary blend of natural ingredients with potential applications in the food and beverage industry, primarily as a flavor enhancer or additive. Its formulation may also have uses in the nutraceutical sector, where it can be included in dietary supplements aimed at promoting general health and wellbeing. Additionally, BGM1013,115 might find applications in the formulation of functional foods, which are designed to provide specific health benefits beyond basic nutrition. Its natural composition could make it appealing for use in products targeting health-conscious consumers looking for clean-label alternatives.

Package

The BGM1013,115 typically refers to a Bluetooth module. The package type for such modules is often a surface-mount device (SMD), designed for integration into printed circuit boards (PCBs) in electronic devices. For precise specifications, always refer to the manufacturer's datasheet.

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