BLE113-A-V1

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BLE113-A-V1

+BOM

RX TXRX MOD BLUETOOTH CHIP SMD

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  • 제조업체 부품 #BLE113-A-V1

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사양

속성 가치
Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Obsolete
RFFamily/Standard Bluetooth
Protocol Bluetooth v4.0
Frequency 2.4GHz
DataRate 2Mbps
Power-Output 0dBm
Sensitivity -93dBm
SerialInterfaces ISP, PWM, SPI, UART
AntennaType Integrated, Chip
UtilizedIC/Part CC2541
MemorySize 128kB Flash, 8kB SRAM
Voltage-Supply 2V ~ 3.6V
Current-Receiving 27mA
Current-Transmitting 26.1mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 85°C

개요

Description

The BLE113-A-V1 is a Bluetooth Low Energy (BLE) module designed for wireless connectivity in compact devices. It is based on the Bluetooth 4.0 specification and is manufactured by Bluegiga, a Silicon Labs company. The module integrates a Bluetooth radio, a low-energy transceiver, and a protocol stack, all within a small footprint, making it suitable for applications in health and fitness devices, smartphone accessories, and the Internet of Things (IoT).
Key features include ultra-low power consumption, which extends battery life in portable devices, and a sleep mode that further conserves energy. The BLE113-A-V1 supports both master and slave modes, allowing for versatile connectivity options. Its onboard programming capability reduces the need for an external microcontroller, simplifying system architecture.
The module offers a range of approximately 50 meters in open space and provides data rates up to 1 Mbps. It supports various profiles and services, enabling developers to create custom applications. Additionally, it has CE, FCC, and IC certifications, ensuring compliance with regulatory standards.

Equivalent

The BLE113-A-V1 chip is a Bluetooth Low Energy (BLE) module from Bluegiga, now part of Silicon Labs. Equivalent products include:
1. Silicon Labs BGM111: Another BLE module from the same manufacturer, offering similar features.
2. Nordic Semiconductor nRF52832: A popular BLE SoC with similar capabilities.
3. Texas Instruments CC2640R2F: A BLE solution with low power consumption.
4. Dialog Semiconductor DA14531: Known for its compact size and low energy use.
These alternatives offer comparable BLE functionality with varying features like power consumption, size, and computational capabilities.

Features

The BLE113-A-V1 is a Bluetooth Low Energy (BLE) module designed for use in wireless communication applications. Here are its key features:
1. Bluetooth Low Energy 4.0: Compliant with Bluetooth 4.0, it supports low energy communication, which is ideal for applications where energy consumption is a critical factor.
2. Integrated Chipset: It includes the Texas Instruments CC2541 SoC, integrating a microcontroller and Bluetooth radio.
3. Size and Form Factor: Compact form factor, suitable for space-constrained applications.
4. I/O Capabilities: Offers digital and analog I/O pins for interfacing with other hardware components.
5. Range and Power: Provides a communication range of up to 50 meters with ultra-low power consumption, making it suitable for battery-operated devices.
6. Onboard Antenna: Comes with an integrated antenna, simplifying the design and reducing external component requirements.
7. Development Support: Supported by development tools and software for quick prototyping and product development.
8. Applications: Commonly used in health and fitness devices, smart home products, and other IoT applications.
These features make the BLE113-A-V1 a versatile choice for developers looking to implement Bluetooth connectivity in their projects.

Pinout

The BLE113-A-V1 is a Bluetooth Low Energy (BLE) module designed for wireless communication in various applications. It typically features a 26-pin layout. The functions of these pins are generally categorized into several groups:
1. Power Supply Pins: These provide the necessary power to the module.
2. Ground Pins: Essential for completing the electrical circuit.
3. UART Interface Pins: Used for serial communication, allowing the module to interface with other devices.
4. GPIO Pins: General-purpose input/output pins that can be configured for various functions based on user requirements.
5. ADC Pins: Analog to Digital Converter pins for handling analog signals.
6. Reset Pin: Used to reset the module.
7. Debugging and Programming Pins: These are used for firmware updates and module debugging.
The BLE113-A-V1 is used in applications requiring short-range wireless communication, such as wearable devices, smart home products, and health monitors. Always refer to the manufacturer's datasheet for detailed pin configuration and functions to ensure correct implementation in your project.

Manufacturer

The BLE113-A-V1 is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in semiconductor and software solutions for a wide range of applications. They are known for their expertise in providing integrated solutions for Internet of Things (IoT) devices, wireless connectivity, microcontrollers, and sensors. Silicon Labs focuses on enabling solutions for smart homes, smart cities, industrial automation, and other IoT applications.

Application

The BLE113-A-V1 is a Bluetooth Low Energy (BLE) module commonly used in various applications due to its low power consumption and compact size. Its application areas include:
1. Wearable Devices: Used in fitness trackers and smartwatches for wireless connectivity.
2. Healthcare: Enables wireless communication in medical devices for patient monitoring.
3. Smart Home: Powers IoT devices like smart locks, lights, and thermostats.
4. Proximity Sensors: Utilized in asset tracking and location-based services.
5. Automotive: Facilitates in-car connectivity for sensors and infotainment systems.
6. Industrial Automation: Allows wireless sensor networks for monitoring and control.
These applications leverage the BLE113's capabilities for efficient and reliable wireless communication.

Package

The BLE113-A-V1 is a Bluetooth Smart module featuring an integrated antenna, designed for applications requiring low energy consumption. It typically comes in a compact, surface-mount package, making it suitable for integration into various small-form-factor devices.

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