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BMM350
+BOMSEN MR I2C/I3C 9-WLCSP
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제조업체보쉬 센서 기술
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제조업체 부품 #BMM350
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데이터시트 BMM350 DataSheet
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재고20864
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Part Status | Active |
| Base Product Number | BMM350 |
| Technology | Magnetoresistive |
| Axis | X, Y, Z |
| Output Type | I2C, I3C |
| Sensing Range | ±2mT |
| Voltage - Supply | 1.72V ~ 1.98V |
| Resolution | 16 b |
| Operating Temperature | -40°C ~ 85°C |
| Supplier Device Package | 9-WLCSP (1.28x1.28) |
| Mounting Type | Surface Mount |
| Package | 9-BGA, WLCSP |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
개요
Description
Students might explore the dynamics of business environments, learn about decision-making processes, and develop skills in leadership and communication. The course may include practical applications through case studies, group projects, and discussions to prepare students for real-world business challenges.
Key topics could include market research, consumer behavior, branding strategies, and the impact of digital technology on business. Assessment methods typically involve a combination of exams, assignments, and presentations to evaluate understanding and practical application of the material.
Overall, BMM350 aims to provide a foundational understanding of business management concepts, equipping students with the necessary tools and frameworks to succeed in more advanced studies or entry-level business roles.
Equivalent
Features
1. 3-Axis Magnetic Field Sensing: Provides accurate measurement of magnetic fields in three dimensions, which is essential for compass applications and orientation detection.
2. High Sensitivity and Precision: Offers high-resolution magnetic field data, allowing for precise navigation and orientation.
3. Low Power Consumption: Designed for battery-powered applications, making it suitable for mobile and wearable devices.
4. Compact Form Factor: With its small size, it is easy to integrate into space-constrained devices.
5. Digital Output: Interfaces via I2C or SPI, facilitating easy communication with microcontrollers.
6. Wide Range of Applications: Ideal for use in consumer electronics, robotics, drones, and other devices requiring accurate heading information.
7. Enhanced Calibration and Compensation: Includes features to mitigate interference and improve accuracy in various environmental conditions.
These features make the BMM350 a versatile and reliable choice for developers needing precise magnetic field sensing capabilities in a compact package.
Pinout
The BMM350 module typically includes the following functions:
1. Magnetometer: Measures magnetic field strength in three dimensions (X, Y, and Z axes).
2. Data Processing: On-chip processing for data filtering and compensation to ensure accuracy.
3. I2C/SPI Interface: Supports standard communication protocols for easy integration with microcontrollers and other devices.
4. Low Power Consumption: Designed for battery-powered applications with efficient power management.
The module’s compact 16-pin package allows it to be easily integrated into consumer electronics, including smartphones, tablets, and wearable devices. For precise pin assignments and electrical specifications, refer to the BMM350 datasheet provided by Bosch Sensortec.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the supply voltage range for the BMM350?
A: The BMM350 operates with a supply voltage between 1.72V and 1.98V.
Q: What output interfaces does this magnetoresistive sensor support?
A: It supports both I2C and I3C (Improved Inter-Integrated Circuit) digital output interfaces.
Q: What is the sensing range of the BMM350 for each axis?
A: The device provides a magnetic field sensing range of ±2mT (millitesla) on the X, Y, and Z axes.
Q: What is the resolution of the BMM350 sensor?
A: The sensor features a 16-bit resolution for high-precision magnetic field measurements.
Q: What is the operating temperature range for this component?
A: It is rated for operation over an industrial temperature range of -40°C to +85°C.
Q: What package type is the BMM350 available in?
A: It comes in a 9-Ball WLCSP (Wafer-Level Chip Scale Package), specifically a 9-WLCSP measuring 1.28x1.28 mm.
Q: Is the BMM350 suitable for surface-mount assembly?
A: Yes, its mounting type is Surface Mount, compatible with standard SMT processes.