CDCLVD1204RGTR

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CDCLVD1204RGTR

+BOM

IC CLK BUFFER 2:4 800MHZ 16QFN

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  • 패키지 QFN-16

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사양

속성 가치
Package / Case Tape & Reel (TR),Cut Tape (CT),Bulk
Part Status Active
Type Fanout Buffer (Distribution), Multiplexer
Number of Circuits 1
Ratio - Input: Output 2:4
Differential - Input: Output Yes/Yes
Input LVCMOS, LVDS, LVPECL
Output LVDS
Frequency - Max 800 MHz
Voltage - Supply 2.375V ~ 2.625V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount

개요

Description

The CDCLVD1204RGTR is a low-voltage differential signaling (LVDS) clock buffer from Texas Instruments. It distributes one input clock to four identical LVDS outputs with minimal skew and jitter, ideal for high-speed applications like networking, telecom, and data acquisition.
Key features:
- Input/Output: Accepts LVDS, LVPECL, or HCSL inputs; provides LVDS outputs.
- Frequency Range: Supports up to 2.5 GHz.
- Low Additive Jitter: < 100 fs (typical).
- Low Power: Operates at 2.5V or 3.3V supply.
- Package: 16-pin VQFN (RGTR).
Applications include clock distribution in FPGAs, ASICs, and high-speed serial interfaces. The device ensures signal integrity with tight channel-to-channel skew (< 50 ps) and is designed for low power consumption.
For detailed specs, refer to the [TI datasheet](https://www.ti.com/product/CDCLVD1204).

Equivalent

Equivalent products to the CDCLVD1204RGTR (a 1:4 LVDS clock buffer) include:
- Texas Instruments CDCLVD1208 (1:8 version)
- ON Semiconductor NB4L52 (1:4 LVDS buffer)
- Renesas 5PB1104 (1:4 LVDS fanout buffer)
- IDT 853S004 (1:4 LVDS clock distributor)
These alternatives offer similar functionality for clock distribution in high-speed applications. Always verify specs for compatibility.

Features

The CDCLVD1204RGTR is a high-performance LVDS clock buffer with the following key features:
- Inputs/Outputs: 1 LVCMOS/LVTTL input, 4 LVDS outputs.
- Frequency Range: Up to 800 MHz.
- Low Jitter: <1 ps RMS (12 kHz–20 MHz).
- Supply Voltage: 3.3 V (operating range: 2.375 V–3.6 V).
- Low Power: Typically 72 mW (3.3 V).
- Propagation Delay: <1.5 ns (typical).
- Package: 16-pin VQFN (RGTR).
- Applications: Clock distribution in networking, telecom, and high-speed data systems.
Compact, low-noise, and power-efficient, it ensures precise clock signal integrity.

Pinout

The CDCLVD1204RGTR is a 16-pin (VQFN package) LVDS fanout buffer. Key functions:
- Inputs: 1 differential LVDS/CMOS/LVPECL clock input.
- Outputs: 4 differential LVDS clock outputs (1:4 fanout).
- Features: Low additive jitter, supports up to 2.5 GHz, 3.3V operation.
- Applications: Clock distribution in high-speed systems (FPGA/ASIC timing, telecom).
Pins include power (VCC), ground (GND), input (CLKIN±), outputs (CLKOUT±x4), and enable (EN).

Manufacturer

The CDCLVD1204RGTR is manufactured by Texas Instruments (TI), a leading global semiconductor company. TI specializes in designing and producing analog and embedded processing chips for various industries, including automotive, industrial, consumer electronics, and communications. Known for innovation and reliability, TI provides high-performance solutions for signal conditioning, power management, and timing applications.
The CDCLVD1204RGTR is a low-voltage differential signaling (LVDS) clock buffer, reflecting TI's expertise in precision timing and signal integrity.

Application

The CDCLVD1204RGTR is a high-performance clock buffer and distributor used in various applications:
- Telecommunications: Synchronizes clocks in networking equipment.
- Data Centers: Ensures precise timing for servers and storage systems.
- Industrial Automation: Provides stable clock signals for control systems.
- Consumer Electronics: Used in high-speed interfaces like HDMI/USB.
- Automotive Infotainment: Supports timing in displays and audio systems.
It offers low jitter, multiple outputs, and operates at high frequencies (up to 2.5 GHz), making it ideal for timing-critical systems.

Package

The CDCLVD1204RGTR is a 1.2V LVDS clock buffer from Texas Instruments. It comes in a VQFN-16 (RGT) package, which is a 4mm × 4mm, 16-pin Quad Flat No-Lead package with an exposed thermal pad. This compact, surface-mount package is suitable for high-speed applications requiring efficient thermal dissipation.

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