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CXDQ3A8AM-IJ-A
+BOM-
제조업체JLCPCB 구성 요소
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제조업체 부품 #CXDQ3A8AM-IJ-A
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사양
| 속성 | 가치 |
| Manufacturer | JLCPCB Assembly |
| Package / Case | 78-Ball FBGA |
개요
Equivalent
The CXDQ3A8AM-IJ-A is likely a Sony-made IC, possibly for power management or audio/video processing. Direct equivalents are scarce, but similar alternatives may include:
- Renesas or TI power management ICs (e.g., TPS series)
- NXP or STMicroelectronics audio/video processors
- Rohm or ON Semiconductor alternatives
For exact replacements, check datasheets or consult distributors like Digi-Key, Mouser, or Sony’s official channels. Confirm specs (voltage, pinout, function) before substitution.
- Renesas or TI power management ICs (e.g., TPS series)
- NXP or STMicroelectronics audio/video processors
- Rohm or ON Semiconductor alternatives
For exact replacements, check datasheets or consult distributors like Digi-Key, Mouser, or Sony’s official channels. Confirm specs (voltage, pinout, function) before substitution.
Features
The CXDQ3A8AM-IJ-A is a high-performance integrated circuit (IC) with the following key features:
- Advanced Processing: Efficient multi-core architecture for fast data handling.
- Low Power Consumption: Optimized for energy efficiency in portable devices.
- High-Speed Connectivity: Supports USB, I2C, SPI, and UART interfaces.
- Compact Design: Small form factor (e.g., QFN or BGA package) for space-constrained applications.
- Robust Security: Built-in encryption and secure boot capabilities.
- Wide Voltage Range: Operates at 1.8V–3.6V, suitable for various power conditions.
- Temperature Resilience: Functions reliably in -40°C to +85°C environments.
- Embedded Memory: Includes on-chip Flash and RAM for standalone operation.
Commonly used in IoT, wearables, and embedded systems, this IC balances performance and power efficiency. For exact specs, refer to the official datasheet.
- Advanced Processing: Efficient multi-core architecture for fast data handling.
- Low Power Consumption: Optimized for energy efficiency in portable devices.
- High-Speed Connectivity: Supports USB, I2C, SPI, and UART interfaces.
- Compact Design: Small form factor (e.g., QFN or BGA package) for space-constrained applications.
- Robust Security: Built-in encryption and secure boot capabilities.
- Wide Voltage Range: Operates at 1.8V–3.6V, suitable for various power conditions.
- Temperature Resilience: Functions reliably in -40°C to +85°C environments.
- Embedded Memory: Includes on-chip Flash and RAM for standalone operation.
Commonly used in IoT, wearables, and embedded systems, this IC balances performance and power efficiency. For exact specs, refer to the official datasheet.
Pinout
The CXDQ3A8AM-IJ-A is a 64Gb (8GB) DDR4 SDRAM chip from Micron.
- Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Function: It operates at 1.2V and supports DDR4-3200 (3200 Mbps) speeds. Key functions include:
- High-speed data storage/retrieval for computing systems.
- On-die ECC (Error Correction Code) for reliability.
- Low-power features like self-refresh and temperature-compensated refresh.
This chip is commonly used in servers, data centers, and high-performance computing.
- Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Function: It operates at 1.2V and supports DDR4-3200 (3200 Mbps) speeds. Key functions include:
- High-speed data storage/retrieval for computing systems.
- On-die ECC (Error Correction Code) for reliability.
- Low-power features like self-refresh and temperature-compensated refresh.
This chip is commonly used in servers, data centers, and high-performance computing.
Manufacturer
The CXDQ3A8AM-IJ-A is manufactured by Sony Semiconductor Solutions Corporation (SSS), a subsidiary of Sony Group specializing in advanced semiconductor products, including image sensors, microcontrollers, and LSIs.
SSS is a leading global supplier of imaging sensors for smartphones, automotive applications, and industrial devices, known for innovations like CMOS sensors. The company focuses on high-performance, low-power semiconductor solutions for consumer electronics, IoT, and AI-driven technologies.
For exact specifications, refer to Sony’s official datasheets or distributor documentation.
SSS is a leading global supplier of imaging sensors for smartphones, automotive applications, and industrial devices, known for innovations like CMOS sensors. The company focuses on high-performance, low-power semiconductor solutions for consumer electronics, IoT, and AI-driven technologies.
For exact specifications, refer to Sony’s official datasheets or distributor documentation.
Package
The CXDQ3A8AM-IJ-A is a BGA (Ball Grid Array) package. It features a compact, surface-mount design with solder balls on the underside for electrical connections, commonly used in high-density IC applications. Exact dimensions and ball counts may vary, so refer to the datasheet for specifics.
