CY37032P44-125AXC

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CY37032P44-125AXC

+BOM

IC CPLD 32MC 10NS 44LQFP

  • 제조업체세프라스 반도체 회사

  • 제조업체 부품 #CY37032P44-125AXC

  • 패키지 LQFP-44

  • 재고5042

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사양

속성 가치
Supplier Cypress Semiconductor Corp
Package / Case Tray
Series Ultra37000™
Part Status Obsolete
Programmable Type In-System Reprogrammable™ (ISR™) CMOS
Delay Timetpd(1)Max 10 ns
Voltage Supply - Internal 4.75V ~ 5.25V
Number of Macrocells 32
Number of I/O 37
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount

개요

Description

CY37032P44-125AXC is a Cypress/Infineon device in a 44‑pin (P44) package. It’s a memory IC used for embedded storage/buffering in digital systems. The exact type (RAM, ROM/EEPROM/Flash), density, and timing depend on the specific datasheet revision.
To get a proper introduction, review the official datasheet for:
- Memory organization (address/data width, density)
- Interface and voltage requirements (Vcc, I/O standards)
- Timing specs (read/write access times, tACC, etc.)
- Package pinout and mechanical/temperature range
- Electrical characteristics and ordering options
Common applications include boot/config memory, caches, look‑up tables, and other embedded storage roles. For precise specs, consult Cypress/Infineon’s datasheet or distributor pages (DigiKey, Mouser). If you’d like, I can draft a concise spec summary once you provide the datasheet or a link to it.

Pinout

Pin count: 44 pins.
Function: Cypress CY37032P44-125AXC is a 32-macrocell CPLD (Complex Programmable Logic Device) used to implement programmable logic.

Manufacturer

Manufacturer: Cypress Semiconductor Corporation (now part of Infineon Technologies).
What kind of company: A semiconductor company that designs and manufactures integrated circuits (ICs), memory, and related silicon devices for various markets (automotive, consumer, industrial, etc.).

Application

Typical application areas for CY37032P44-125AXC include:
- Embedded systems for glue logic, I/O expansion, timing and control
- Industrial automation and motor/control interfaces
- Automotive electronics (body control modules, sensor/actuator interfacing)
- Consumer electronics (set-top boxes, display/controllers, peripheral interfaces)
- Networking and telecommunications equipment (data-path control, protocol handling)
- Aerospace/defense and other high-reliability applications requiring rugged programmable logic
Note: refer to the datasheet for exact speed, temperature, and packaging constraints.

Package

It's a 125-ball Ball Grid Array (BGA) package.

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