사양
| 속성 | 가치 |
| Supplier | Rochester Electronics, LLC,Flip Electronics |
| Package / Case | Tray,Tray |
| Series | NoBL™ |
| Part Status | Obsolete |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Technology | SRAM - Synchronous, SDR |
| Memory Size | 18Mb (1M x 18) |
| Memory Interface | Parallel |
| Clock Frequency | 167 MHz |
| Access Time | 3.4 ns |
| Voltage - Supply | 3.135V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
개요
Description
CY7C1372D-167AXI is a Cypress Semiconductor device in the CY7C1372 series designed to interface a processor or FPGA via an AXI-compatible bus. It typically serves as a data-path buffer or small memory/bridge that links an AXI master to internal logic or external memory, enabling high-speed, clock-domain‑crossing data transfer.
Key points you’d find in the datasheet:
- AXI interface: slave (and possibly burst) timing, data widths, and handshake signals
- Data path and storage: on‑chip memory or FIFO/buffer capabilities, latency, and throughput
- Clocking and voltage: supported core and I/O voltages, timing requirements
- Register map: control/status registers to configure transfers, interrupts, and status
- Package and power options: available densities, package types, power modes
Because exact features (density, dual-port options, latency, and pinout) vary by part revision, consult the official CY7C1372D-167AXI datasheet and user guide. If you share your target data rates, memory size, and FPGA/SoC, I can tailor guidance.
Key points you’d find in the datasheet:
- AXI interface: slave (and possibly burst) timing, data widths, and handshake signals
- Data path and storage: on‑chip memory or FIFO/buffer capabilities, latency, and throughput
- Clocking and voltage: supported core and I/O voltages, timing requirements
- Register map: control/status registers to configure transfers, interrupts, and status
- Package and power options: available densities, package types, power modes
Because exact features (density, dual-port options, latency, and pinout) vary by part revision, consult the official CY7C1372D-167AXI datasheet and user guide. If you share your target data rates, memory size, and FPGA/SoC, I can tailor guidance.
Equivalent
Cannot determine exact equivalents without the device function. CY7C1372D-167AXI is a Cypress CY7C family device; cross-references depend on its function (FIFO, RAM, switch, etc.). To find equivalents, obtain the datasheet, note package, speed, voltage, and interface, then use DigiKey/Mouser/Octopart cross-reference: search by CY7C1372D-167AXI or by function and packaging. Potential alternatives from other vendors include IDT, Renesas, Microchip, TI, or Maxlinear, matching the same interface and timing.
Pinout
- Pin count: 167 pins (167-ball BGA package)
- Function: Static RAM memory device (2M × 8), i.e., 16 Mb total, used for high-speed random-access storage.
- Function: Static RAM memory device (2M × 8), i.e., 16 Mb total, used for high-speed random-access storage.
Manufacturer
Manufacturer: Cypress Semiconductor Corporation.
Company type: A global semiconductor company that designs and manufactures memory, microcontroller, and analog/digital IC products (acquired by Infineon Technologies in 2020).
Company type: A global semiconductor company that designs and manufactures memory, microcontroller, and analog/digital IC products (acquired by Infineon Technologies in 2020).
Application
CY7C1372D-167AXI is a high-speed interconnect device (AXI-compatible) used for routing and multiplexing multiple data channels. Common application areas include:
- High-speed data routing and crosspoint switching
- I/O backplanes for telecom/Datacom systems
- FPGA/ASIC designs needing AXI-based interconnect and channel multiplexing
- Memory/storage interconnects and cache/buffer fabrics
- Test, measurement, and prototyping equipment
- Video, imaging, and multimedia data paths
- High-speed data routing and crosspoint switching
- I/O backplanes for telecom/Datacom systems
- FPGA/ASIC designs needing AXI-based interconnect and channel multiplexing
- Memory/storage interconnects and cache/buffer fabrics
- Test, measurement, and prototyping equipment
- Video, imaging, and multimedia data paths
Package
RoHS-compliant 208-pin LQFP (14x14 mm) package.
