사양
| 속성 | 가치 |
| Supplier | Texas Instruments,Rochester Electronics, LLC |
| Package / Case | Tape & Reel (TR),Cut Tape (CT),Bulk |
| Part Status | Active |
| Type | Buffer, ReDriver |
| Applications | LVDS |
| Input | CML, LVDS, LVPECL |
| Output | LVDS |
| Data Rate (Max) | 3.125Gbps |
| Number of Channels | 1 |
| Delay Time | 350ps |
| Signal Conditioning | Output Pre-Emphasis |
| Capacitance - Input | 1.7 pF |
| Voltage - Supply | 3V ~ 3.6V |
| Supply Current | 35mA |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
개요
Description
The DS25BR120TSD/NOPB is a Texas Instruments high-speed SerDes (serializer/deserializer) device in the DS25BR family. It provides a high-speed serial link between a parallel data interface (e.g., FPGA/ASIC) and a high-speed serial channel, enabling broad interconnect bandwidth for backplanes, cables, or other data paths.
Key points:
- Converts parallel data to a serial stream and back, enabling long, high-speed links.
- Uses differential signaling and is designed for flexible, high-performance interconnects.
- Suitable for bidirectional or unidirectional links with compatible counterparty devices.
- Typically implemented in Pb-free packaging (NOPB); the TSD suffix denotes the specific package type.
Common applications: data communication links, backplanes, interconnects between processors and memory, telecom/enterprise networking equipment, and other high-speed interconnects.
For exact electrical specs, data rates, interface options, and application notes, consult the TI DS25BR120 product page and its datasheet.
Key points:
- Converts parallel data to a serial stream and back, enabling long, high-speed links.
- Uses differential signaling and is designed for flexible, high-performance interconnects.
- Suitable for bidirectional or unidirectional links with compatible counterparty devices.
- Typically implemented in Pb-free packaging (NOPB); the TSD suffix denotes the specific package type.
Common applications: data communication links, backplanes, interconnects between processors and memory, telecom/enterprise networking equipment, and other high-speed interconnects.
For exact electrical specs, data rates, interface options, and application notes, consult the TI DS25BR120 product page and its datasheet.
Pinout
Pin count: 20 pins (TSSOP-20 package, DS25BR120TSD/NOPB).
Function: High-speed differential clock/data fanout buffer (1:2). It takes a differential input and provides two identical differential outputs for distribution, with an enable control and standard power/ground pins.
Function: High-speed differential clock/data fanout buffer (1:2). It takes a differential input and provides two identical differential outputs for distribution, with an enable control and standard power/ground pins.
Manufacturer
- Manufacturer: Dallas Semiconductor (the DS prefix is from Dallas Semiconductor; the brand is now part of Maxim Integrated, which itself is part of Analog Devices).
- What kind of company: A semiconductor company that designs and manufactures integrated circuits and related electronic components.
- What kind of company: A semiconductor company that designs and manufactures integrated circuits and related electronic components.
Application
Application areas: high-speed data and clock distribution in backplanes and boards; fan-out buffers for LVDS/CML SERDES interfaces in telecom, data-center, and networking equipment; instrumentation, test gear, and automotive electronics needing multiple copies of a differential signal; video/imaging data paths; and general differential-signal distribution in complex systems.
Package
DS25BR120TSD/NOPB comes in a TSSOP-16 (thin-shrunk small-outline, 16-pin) package.
