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EM638325TS-6G
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제조업체옥창
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제조업체 부품 #EM638325TS-6G
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재고18951
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사양
| 속성 | 가치 |
| Manufacturer | Etron Tech |
| Package / Case | TSOP II |
개요
Description
The EM638325TS-6G is a high-performance LPDDR4X DRAM module developed by Micron Technology. Key features include:
- Capacity: 8GB (64Gb)
- Speed: Up to 4266 Mbps (6Gbps/pin)
- Voltage: Low-power 1.1V (LPDDR4X standard)
- Applications: Ideal for mobile devices, tablets, and embedded systems requiring high bandwidth with minimal power consumption.
Its compact 200-ball FBGA package ensures space efficiency, while advanced power-saving modes enhance battery life in portable electronics. The EM638325TS-6G is designed for high-speed data processing in next-gen applications like 5G, AI, and edge computing.
For detailed specs, refer to Micron’s official datasheet.
- Capacity: 8GB (64Gb)
- Speed: Up to 4266 Mbps (6Gbps/pin)
- Voltage: Low-power 1.1V (LPDDR4X standard)
- Applications: Ideal for mobile devices, tablets, and embedded systems requiring high bandwidth with minimal power consumption.
Its compact 200-ball FBGA package ensures space efficiency, while advanced power-saving modes enhance battery life in portable electronics. The EM638325TS-6G is designed for high-speed data processing in next-gen applications like 5G, AI, and edge computing.
For detailed specs, refer to Micron’s official datasheet.
Equivalent
The EM638325TS-6G is a 32Mbit (4Mx8) 3.3V SDRAM chip. Equivalent or similar products include:
- IS42S32800G (Integrated Silicon Solution)
- MT48LC4M32B2 (Micron Technology)
- K4S281632K (Samsung)
- HY57V283220 (Hynix)
These are 32Mbit SDRAMs with comparable specs (3.3V, 4Mx8/2Mx16). Verify pin compatibility and timing before substitution.
- IS42S32800G (Integrated Silicon Solution)
- MT48LC4M32B2 (Micron Technology)
- K4S281632K (Samsung)
- HY57V283220 (Hynix)
These are 32Mbit SDRAMs with comparable specs (3.3V, 4Mx8/2Mx16). Verify pin compatibility and timing before substitution.
Pinout
The EM638325TS-6G is a 32Mbit (4M x 8) 3.3V CMOS SDRAM module.
- Pin Count: 54 pins (TSOP-II package).
- Key Functions:
- Address/Data Pins: A0-A11 (row/column addressing), DQ0-DQ7 (8-bit data bus).
- Control Pins: /RAS (row address strobe), /CAS (column address strobe), /WE (write enable), /CS (chip select).
- Clock/Control: CLK (clock input), CKE (clock enable).
- Power: VDD (3.3V), VSS (ground).
Designed for high-speed synchronous operation (6ns access time), it’s used in embedded systems, networking, and consumer electronics.
- Pin Count: 54 pins (TSOP-II package).
- Key Functions:
- Address/Data Pins: A0-A11 (row/column addressing), DQ0-DQ7 (8-bit data bus).
- Control Pins: /RAS (row address strobe), /CAS (column address strobe), /WE (write enable), /CS (chip select).
- Clock/Control: CLK (clock input), CKE (clock enable).
- Power: VDD (3.3V), VSS (ground).
Designed for high-speed synchronous operation (6ns access time), it’s used in embedded systems, networking, and consumer electronics.
Manufacturer
The EM638325TS-6G is a DRAM module manufactured by Etron Technology, Inc., a Taiwanese company specializing in memory products, including DRAM, SRAM, and embedded memory solutions. Founded in 1991, Etron focuses on IC design and manufacturing, serving industries like consumer electronics, automotive, and industrial applications. The company is known for its niche memory solutions and has a strong presence in the Asian semiconductor market.
Application
The EM638325TS-6G is a high-speed DDR3 SDRAM chip, primarily used in applications requiring fast data processing and low power consumption. Key application areas include:
1. Consumer Electronics – Smartphones, tablets, and digital cameras.
2. Computing Systems – Laptops, desktops, and embedded computing devices.
3. Networking Equipment – Routers, switches, and servers.
4. Automotive Systems – Infotainment and ADAS (Advanced Driver Assistance Systems).
5. Industrial Automation – Control systems and IoT devices.
Its 6Gb density and high-speed performance make it suitable for memory-intensive tasks in compact, power-efficient designs.
1. Consumer Electronics – Smartphones, tablets, and digital cameras.
2. Computing Systems – Laptops, desktops, and embedded computing devices.
3. Networking Equipment – Routers, switches, and servers.
4. Automotive Systems – Infotainment and ADAS (Advanced Driver Assistance Systems).
5. Industrial Automation – Control systems and IoT devices.
Its 6Gb density and high-speed performance make it suitable for memory-intensive tasks in compact, power-efficient designs.
Package
The EM638325TS-6G is a TSOP-II (Thin Small Outline Package) type DRAM module. It features a 54-pin configuration, a compact form factor, and is commonly used in memory applications. The "TS" in the part number denotes the TSOP-II package style.
