EP2AGX125EF29C6N

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EP2AGX125EF29C6N

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IC FPGA 372 I/O 780FBGA

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  • 제조업체 부품 #EP2AGX125EF29C6N

  • 재고5019

365 1일 품질 보증

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사양

속성 가치
Series Arria II GX
PartStatus Obsolete
BaseProductNumber EP2AGX125
DigiKeyProgrammable Not Verified
NumberofLABs/CLBs 4964
NumberofLogicElements/Cells 118143
TotalRAMBits 8315904
NumberofI/O 372
Voltage-Supply 0.87V ~ 0.93V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package 780-BBGA, FCBGA
SupplierDevicePackage 780-FBGA (29x29)
Packaging Tray

개요

Description

EP2AGX125EF29C6N is an Intel (formerly Altera) Arria GX FPGA device. It targets mid‑ to high‑density FPGA applications and provides approximately 125k logic elements. The device includes embedded memory blocks, DSP blocks, phase‑locked loops, and high‑speed I/O and SERDES transceivers across several I/O banks. It is designed for flexible hardware acceleration, signal processing, communications, and embedded systems where reconfigurability is key. Programming is done with Intel Quartus Prime (or Quartus II in older toolchains). The EP2AGX125EF29C6N name encodes the family (Arria GX), capacity (125k LEs), and packaging/speed options, with C6N referring to the package. For exact specifications—number of I/O, block RAM, transceiver channels, timing, and power—consult the official Intel product page and the EP2AGX125EF29C6N datasheet. Availability may vary as newer generations supersede it.

Equivalent

Direct equivalents depend on package, speed grade, and I/O. There are no fixed drop-in substitutions. To get precise cross-references, use Intel/Altera’s Device Cross Reference tool: enter EP2AGX125EF29C6N and view listed equivalents (same logic size in other families and compatible packages). You can also compare specs (125K LEs, I/O count, memory blocks, speed grade) and footprints to pick alternatives in Cyclone GX, Cyclone V or Arria GX families if a replacement is needed.

Features

EP2AGX125EF29C6N is an Altera (Intel) Arria GX FPGA. Key features (typical, device-specific details may vary by package/speed grade):
- 125K logic elements (LEs) for flexible logic and routing
- On-chip memory: BRAM/M9K-style blocks plus distributed RAM
- DSP/DSP blocks for high‑efficiency arithmetic
- High-speed SERDES transceivers for multi-Gbps serial interfaces
- Clock management: PLLs/clocking resources and global routing
- I/O: multiple banks with wide I/O standards (LVCMOS/LVTTL/LVDS, 3.3V tolerant, etc.)
- Configuration options: AS (Active Serial), Passive Serial, JTAG, and other standard config interfaces
- Power and thermal: support for industrial temperature grades and power-saving modes
- Package: high-pin-count BGA (C6N family packaging)
Common use cases: embedded processing, digital communications, video/graphics, DSP-heavy applications. For exact counts (memory size, number of SERDES, I/O per bank, etc.) see the official datasheet for EP2AGX125EF29C6N.

Pinout

- Pin count: 672 pins (FineLine BGA package)
- Function: Cyclone V GX FPGA with about 125K logic elements (general-purpose programmable logic device with integrated transceivers).

Manufacturer

Manufacturer: Altera Corporation (now part of Intel).
What kind of company: A semiconductor company that specialized in programmable logic devices (FPGAs/CPLDs). It was fabless, designing PLDs and outsourcing fabrication, and was acquired by Intel in 2015.

Application

EP2AGX125EF29C6N is a Cyclone GX FPGA with about 125k logic elements. Common application areas include:
- Industrial automation, motor control, and process monitoring
- Networking and communications: protocol bridging, data paths, line interfaces
- Video, image, and DSP processing
- Embedded systems: glue logic for microcontrollers, custom peripherals, memory interfaces
- Data acquisition, test and measurement equipment
- Consumer electronics and automotive-grade applications needing moderate FPGA resources
- Prototyping, evaluation boards, and educational projects

Package

FineLine BGA (FBGA) package, 29×29 ball grid array.

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