EP4CE40F23A7N

EP4CE40F23A7N is a Cyclone IV E FPGA from Intel (formerly Altera). It’s a mid-density, SRAM-based device designed for cost-sensitive designs that need moderate logic, embedded RAM, DSP resources, and ample I/O. The part provides roughly 40k logic elements, M9K memory blocks, DSP resources, multiple PLLs, and multiple I/O banks in a FineLine BGA package (F23). It is programmed with Intel Quartus Prime and supported IPs, making it suitable for digital controllers, interface bridges, signal processing, and embedded control tasks. For exact specifications (LE count, RAM blocks, PLLs, I/O counts, and package pinout), consult the official datasheet and user guide on Intel’s website.

EP4CE40F23A7N is a Cyclone IV E FPGA device. Key features (typical for this family; check the exact datasheet for exact counts per variant):
- Approx. 40K logic elements (LEs)
- Embedded RAM via M9K memory blocks
- Dedicated DSP/multiplier blocks for signal processing
- Multiple clock management resources (PLLs)
- Numerous I/O banks with 3.3V-tolerant I/O (and LVDS/differential options)
- FineLine BGA packaging (A7N variant)
- General-purpose, low-power FPGA fabric suitable for mixed-signal and logic-intensive designs
Note: exact counts (LEs, RAM, DSP blocks, I/O in the package) vary by device variant and must be confirmed in the specific datasheet for EP4CE40F23A7N.

- Pin count: 780 pins (FineLine BGA, FBGA780).
- Function: EP4CE40F23A7N is a Cyclone IV E FPGA device with about 40K logic elements (LEs); it provides configurable logic, embedded memory blocks, DSP blocks, and I/O for implementing reconfigurable digital circuits.

- Manufacturer: Intel Corporation (the EP4CE40F23A7N was originally from Altera and is now part of Intel’s FPGA product lines).
- What kind of company: A multinational technology company that designs and manufactures semiconductors and computing hardware, including FPGAs, CPUs, memory, and other integrated circuits.

EP4CE40F23A7N is a Cyclone IV E FPGA. Typical application areas include:
- Industrial automation and control (PLC, motor drives)
- Digital signal processing and communications (DSP, filters, mod/demod, SDR)
- Embedded systems (soft processors with peripheral interfaces)
- Video, image processing and multimedia (camera interfaces, display controllers)
- Data acquisition and instrumentation
- Automotive electronics (sensor interfaces, infotainment subsystems)
- Medical devices and lab equipment
- Consumer electronics and IoT prototyping
- Education and research/prototyping projects

FBGA (FineLine Ball Grid Array) package, 23×23 mm.