이미지는 참조용입니다.
H26M74002HMR
+BOMFBGA-153 Memory (ICs) RoHS
-
제조업체HYNIX
-
제조업체 부품 #H26M74002HMR
-
재고14495
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Packaging | FBGA-153 |
개요
Description
- Capacity: 256Gb (32GB) per die.
- Interface: Toggle-mode DDR (Double Data Rate) for fast data transfer.
- Applications: Used in SSDs, enterprise storage, and high-density memory solutions.
- Performance: Offers improved speed, power efficiency, and reliability compared to planar NAND.
This chip leverages 3D stacking technology to enhance storage density while maintaining cost-effectiveness. It supports advanced error correction and endurance optimization, making it suitable for both consumer and industrial applications.
For detailed specifications, refer to SK Hynix’s official datasheets or product documentation.
Equivalent
- Samsung: KLUDG4U1EA-B0C1 (512GB eMMC)
- Micron: MTFC512GAKAE-1WT (512GB eMMC)
- Kioxia (Toshiba): THGAMFT0T43BAIR (512GB eMMC)
- Western Digital (SanDisk): SDINBDG4-512G
These are 512GB eMMC 5.1 chips with comparable specs. Verify pin compatibility and datasheets for exact replacements.
Pinout
- Pin Count: 168-ball FBGA (Fine-pitch Ball Grid Array).
- Function:
- Designed for low-power mobile applications (e.g., smartphones, tablets).
- 32-bit wide bus (x32) for high-speed data transfer.
- Supports LPDDR2 (Low Power DDR2) interface.
- Operates at 1.2V (core) and 1.8V (I/O), optimizing power efficiency.
- Typical applications include main memory for embedded systems.
Key features: high density, low latency, and power-saving modes.
Manufacturer
SK Hynix is a global leader in memory technology, specializing in DRAM, NAND flash, and other advanced semiconductor solutions. It is one of the largest memory chip producers worldwide, competing with companies like Samsung and Micron. The company supplies components for consumer electronics, data centers, and enterprise storage systems.
The H26M74002HMR is a 3D NAND flash chip, likely used in SSDs, mobile devices, or embedded storage applications. For detailed specifications, refer to SK Hynix's official datasheets.
Package
Frequently Asked Questions
Q: What is the packaging form of the H26M74002HMR?
A: It is supplied in FBGA-153 packaging, which is a Fine-pitch Ball Grid Array with 153 balls for compact surface-mount assembly.
Q: Is this component suitable for high-density memory applications?
A: Yes, the FBGA-153 package indicates it is designed for high-density NAND flash memory or embedded storage solutions in mobile devices.
Q: Does the H26M74002HMR support industrial temperature ranges?
A: Based on provided parameters, no temperature range is specified. Please verify the datasheet for operating conditions.
Q: Can this part be used as a drop-in replacement for other HYNIX FBGA-153 parts?
A: Not necessarily. Pinouts, controller interface, and memory density may differ. You must confirm compatibility via the official datasheet.
Q: What is the typical application for the H26M74002HMR?
A: It is likely used in embedded storage, eMMC/NAND controllers, or mobile DRAM modules requiring a compact 153-ball BGA footprint.
Q: Is the H26M74002HMR RoHS compliant?
A: The RoHS status is not provided in the parameters. You should check with the manufacturer or distributor for compliance details.
Q: Can I use this component in a consumer electronics prototype?
A: Yes, given the FBGA-153 package, it is suitable for prototyping if you have the required reflow soldering capability and board layout.
