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H5TC2G63GFR-PBA

Name: H5TC2G63GFR-PBA
Rating: 4.8 (15 reviews)

+BOM

1.283V~1.45V 2Gbit 800MHz DDR3L SDRAM FBGA-96 Memory (ICs) RoHS

제조업체HYNIX
제조업체 부품 #H5TC2G63GFR-PBA
데이터시트 H5TC2G63GFR-PBA DataSheet
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사양

속성	가치
Packaging	FBGA-96
Clock Frequency	800MHz
Memory Format	DDR3L SDRAM
Memory Size	2Gbit
Operating Temperature	-40℃~+95℃
Voltage - Supply	1.283V~1.45V

개요

Description

The H5TC2G63GFR-PBA is a type of memory chip manufactured by SK Hynix, a leading producer of semiconductor memory products. Specifically, it is a 2 Gb DDR3L (Double Data Rate 3 Low Voltage) synchronous DRAM (Dynamic Random Access Memory) chip. DDR3L memory is known for its enhanced performance and power efficiency compared to its predecessors, making it suitable for a variety of computing applications, including laptops, desktops, and servers.
The "PBA" at the end of the model number typically indicates a specific configuration or packaging type used by SK Hynix for this chip. The chip's low voltage operation (typically 1.35V) allows for reduced power consumption, which is particularly beneficial in mobile and compact devices where energy efficiency is crucial.
Overall, the H5TC2G63GFR-PBA is designed to meet the demands of high-performance computing, offering a balance between speed, power efficiency, and capacity, making it a popular choice in the semiconductor market for devices requiring reliable and efficient memory solutions.

Equivalent

The H5TC2G63GFR-PBA is a DRAM chip produced by SK Hynix. Equivalent products from other manufacturers would include similar DDR3 SDRAM chips with comparable specifications, such as:
1. Micron: MT41K256M16TW-107 (DDR3 SDRAM)
2. Samsung: K4B2G1646Q-HCK0 (DDR3 SDRAM)
3. Nanya: NT5CB256M16ER-EK (DDR3 SDRAM)
These chips would have similar capacity, speed, and form factor. Always verify specifications to ensure compatibility.

Features

The H5TC2G63GFR-PBA is a DDR3 SDRAM memory chip manufactured by SK hynix. It is commonly used in a variety of electronic devices for efficient data storage and retrieval. Key features include:
1. Capacity: 2Gb (Gigabit), organized as 256M x 8 bits.
2. Speed: Supports data transfer rates of up to 1600 Mbps (megabits per second) per pin, which makes it suitable for high-speed applications.
3. Voltage: Operates at a low voltage of 1.5V, which helps in reducing power consumption.
4. Package: Comes in a 78-ball FBGA (Fine-Pitch Ball Grid Array) package, which is compact and facilitates better thermal performance.
5. Operating Temperature: Designed to function within a temperature range of 0 to 95 degrees Celsius, making it reliable under various environmental conditions.
6. Applications: Ideal for use in laptops, desktops, and a variety of consumer electronics where efficient memory performance is critical.
These attributes make the H5TC2G63GFR-PBA a versatile choice for various computing needs, balancing performance with energy efficiency.

Pinout

The H5TC2G63GFR-PBA is a DRAM chip produced by SK Hynix. It is a 2Gb (gigabit) DDR3 SDRAM, organized as 256Mx8. The chip features a 78-ball FBGA (Fine-Pitch Ball Grid Array) package, indicating a pin count of 78. These pins serve various functions critical for the memory operation, including:
1. Power Supply and Ground Pins: To provide the necessary power (VDD, VDDQ) and grounding (VSS, VSSQ) for the DRAM operation.
2. Address Pins (A0-A15): Used to select memory addresses.
3. Data Pins (DQ0-DQ7): For data input and output.
4. Control Pins: Include RAS (Row Address Strobe), CAS (Column Address Strobe), WE (Write Enable), CS (Chip Select), and CKE (Clock Enable).
5. Clock Pins (CK, CK#): To synchronize the DRAM operations.
6. Data Strobe (DQS, DQS#): To capture data precisely during read and write operations.
7. Other Functional Pins: Such as ODT (On-Die Termination), ZQ (Calibration), and DM (Data Mask).
This configuration supports high-speed data processing applications in computing devices.

Manufacturer

The H5TC2G63GFR-PBA is a DRAM chip manufactured by SK Hynix. SK Hynix is a South Korean company and is one of the leading global suppliers of semiconductors. The company specializes in the production of memory products, including DRAM, NAND flash, and other semiconductor devices. SK Hynix plays a significant role in the electronics industry, providing essential components for various applications ranging from consumer electronics to data centers.

Application

The H5TC2G63GFR-PBA is a DDR3 SDRAM memory chip commonly used in various electronic devices for efficient data storage and retrieval. Its primary application areas include:
1. Computing Devices: Used in laptops, desktops, and servers for main memory.
2. Consumer Electronics: Found in smart TVs, gaming consoles, and set-top boxes.
3. Networking Equipment: Utilized in routers and switches for buffering and data handling.
4. Embedded Systems: Integrated into industrial and automotive systems for reliable performance.
5. Mobile Devices: Employed in smartphones and tablets for multitasking and app performance.
Its high-speed data transfer capability makes it suitable for applications requiring rapid data processing and access.

Package

The H5TC2G63GFR-PBA is a DRAM memory chip produced by SK Hynix. It uses a 96-ball FBGA (Fine-Pitch Ball Grid Array) package, which is common for DRAM chips, allowing for a compact and reliable connection to printed circuit boards (PCBs).

Frequently Asked Questions

Q: What is the memory density of the H5TC2G63GFR-PBA?
A: This device features a 2Gbit (2 Gigabit) DDR3L SDRAM memory density, suitable for high-density memory applications.

Q: What is the operating voltage range for this DDR3L component?
A: It operates at a low voltage supply of 1.283V to 1.45V, compliant with DDR3L (low voltage) standards for reduced power consumption.

Q: Can it support high-speed data transfer at 800MHz?
A: Yes, it supports a clock frequency of 800MHz, enabling high-bandwidth data transfer for demanding computing tasks.

Q: What is the operating temperature range of this SDRAM?
A: The component is rated for an extended industrial temperature range of -40°C to +95°C, ensuring reliability in harsh environments.

Q: What is the physical packaging of the H5TC2G63GFR-PBA?
A: It is packaged in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package, commonly used for space-constrained PCB designs.

Q: Is this memory compatible with standard DDR3L interfaces?
A: Yes, it uses the DDR3L SDRAM memory format, ensuring backward compatibility with DDR3L controllers and supporting low-voltage operation.

Q: What are typical applications for this memory chip?
A: It is ideal for industrial computing, networking, and embedded systems requiring low power consumption and wide temperature tolerance.