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H5TQ4G63EFR-TEC
+BOM4Gbit 1.425V~1.575V 1.066GHz DDR3 SDRAM FBGA-96 Memory (ICs) RoHS
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제조업체HYNIX
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제조업체 부품 #H5TQ4G63EFR-TEC
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사양
| 속성 | 가치 |
| Packaging | FBGA-96 |
| Clock Frequency | 1.066GHz |
| Memory Format | DDR3 SDRAM |
| Memory Size | 4Gbit |
| Operating Temperature | -40℃~+95℃ |
| Voltage - Supply | 1.425V~1.575V |
개요
Features
- Density & Organization: 4Gb (512M x 8)
- Voltage: Low-power 1.35V (DDR3L), compatible with 1.5V
- Speed: 1866 Mbps (DDR3L-1866)
- Timings: CL=13, tRCD=13, tRP=13
- Package: 96-ball FBGA
- Refresh: 8192 cycles/64ms
- Operating Temp: Commercial (0°C to 95°C)
- Features: On-die termination (ODT), auto-refresh, self-refresh
Ideal for low-power, high-performance applications like networking, embedded systems, and consumer electronics.
Pinout
- Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- Low-voltage operation (1.35V, DDR3L-compatible).
- 8-bit prefetch architecture for high-speed data transfer.
- Clock frequency: Up to 933 MHz (1866 Mbps/pin).
- On-Die Termination (ODT) for signal integrity.
- Auto-refresh & self-refresh modes for power efficiency.
Common applications include mobile devices, embedded systems, and low-power computing.
Manufacturer
SK Hynix is a major global producer of memory chips, specializing in DRAM, NAND flash, and other semiconductor solutions. It is one of the largest memory suppliers worldwide, competing with companies like Samsung and Micron. The company supplies components for various applications, including consumer electronics, servers, and automotive systems.
Package
Frequently Asked Questions
Q: What is the memory capacity and organization of the H5TQ4G63EFR-TEC?
A: It is a 4Gbit DDR3 SDRAM, typically organized as 512M x 8-bit, suitable for high-density memory applications.
Q: What is the maximum operating clock frequency of this IC?
A: The clock frequency is 1.066GHz, corresponding to DDR3-2133 data rates, offering high-speed data transfer.
Q: What voltage supply range does this memory require?
A: It requires a VDD and VDDQ supply from 1.425V to 1.575V, compliant with standard DDR3 specifications.
Q: Is this component suitable for industrial temperature environments?
A: Yes, its operating temperature range is -40℃ to +95℃, making it suitable for industrial or extended temperature applications.
Q: What is the physical package type of the H5TQ4G63EFR-TEC?
A: It is packaged in FBGA-96 (Fine-pitch Ball Grid Array, 96 balls), a common package for high-density DDR3 ICs.
Q: Can this memory be used in networking or embedded systems?
A: Yes, with its 4Gbit capacity and high clock speed, it is ideal for routers, switches, and embedded computing modules.
