IDT72P51569L5BB8

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IDT72P51569L5BB8

+BOM

IC MULTI-QUEUE FLOW-CTRL 256BGA

  • 제조업체미국 리사 전자 회사

  • 제조업체 부품 #IDT72P51569L5BB8

  • 패키지 BBGA-256

  • 재고3830

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package / Case Tape & Reel (TR)
Part Status Obsolete
Type Multi-Queue Flow-Control
Mounting Type Surface Mount

개요

Description

The IDT72P51569L5BB8 is a high-performance FIFO (First-In-First-Out) memory chip designed by Integrated Device Technology (IDT). It is typically used in applications that require temporary data storage to manage the timing of data transmission between different components, such as network routers, telecommunications systems, and communication devices.
Key features of the IDT72P51569L5BB8 include a storage capacity of 512K x 36 bits, which allows for efficient handling of large volumes of data. The chip supports high-speed data access with a clock speed of up to 133 MHz, helping to facilitate rapid data processing and transfer. Additionally, it offers advanced functions like depth expansion capability, which allows multiple FIFO devices to be cascaded for increased storage, and a variety of operational modes to suit different system requirements.
The IDT72P51569L5BB8 is known for its reliability, low power consumption, and compact design, making it a versatile choice for developers looking to implement effective and efficient data management solutions in electronic systems.

Equivalent

The IDT72P51569L5BB8 is a FIFO memory chip. Equivalent products are often found within the same category and may include FIFO memory chips from other manufacturers such as Cypress's CY7C42xx series, Texas Instruments' SN74V293 series, or Micron's MT45W8MW16 series, provided they match the specifications like bit depth, speed, and voltage requirements. Always verify detailed specifications for compatibility.

Features

The IDT72P51569L5BB8 is a FIFO (First-In, First-Out) memory chip designed by Integrated Device Technology (IDT). Key features include:
1. Density and Organization: It typically has a high-density configuration suitable for buffering applications where temporary data storage is required.
2. Data Width: The FIFO memory supports varying data widths, making it flexible for different applications.
3. Speed: Offers high-speed operation, which is critical for applications requiring quick data transfer and temporary storage.
4. Depth: It has a substantial depth to accommodate a significant amount of data, enhancing its utility in complex systems.
5. Asynchronous and Synchronous Operation: Supports both asynchronous and synchronous read/write operations for versatile applications.
6. Flow Control: Integrated flags (such as empty, full, and half-full flags) provide flow control to optimize data handling.
7. Compatibility: Designed to be compatible with high-performance microprocessors and digital signal processors.
8. Low Power Consumption: Efficient design to minimize power usage, ideal for portable and energy-sensitive devices.
These features make it suitable for applications in telecommunications, data communications, and other high-performance digital systems.

Pinout

The IDT72P51569L5BB8 is a member of the IDT72P5156 family, which are high-density FIFO (First-In-First-Out) memory chips. This particular model features a 256K x 36 configuration, meaning it has a capacity of 256,000 entries, each 36 bits wide.
Regarding pin count, the IDT72P51569L5BB8 typically comes in a 324-ball Grid Array (BGA) package.
The primary functions of this FIFO device include temporary data storage and management, data buffering, and synchronization between different clock domains, often used in applications requiring data rate matching or data stream management. It supports standard FIFO operations like read and write, and offers features such as programmable flags, status indicators, and synchronous or asynchronous operation modes. The device is particularly useful in communication systems, networking equipment, and other applications requiring high-speed data transfer and temporary storage solutions.

Manufacturer

The IDT72P51569L5BB8 is manufactured by Integrated Device Technology, Inc. (IDT), which is now part of Renesas Electronics Corporation. IDT is known for designing and manufacturing a range of semiconductor products, including integrated circuits and mixed-signal solutions. The company specializes in communications, computing, consumer, and industrial applications, providing products like memory interfaces, data converters, and power management solutions.
IDT, established in 1980, gained a reputation for its innovative approach to high-performance integrated circuits and system-level solutions. In 2019, IDT was acquired by Renesas Electronics Corporation, a leading global supplier of microcontrollers, analog, power, and SoC products. Renesas focuses on automotive, industrial, home electronics, and information communication technology sectors, offering comprehensive solutions to enhance their customers' product performance and efficiency. The acquisition allowed Renesas to expand its portfolio and strengthen its position in the global semiconductor market.

Application

The IDT72P51569L5BB8 is a high-performance FIFO memory device often used in applications requiring high-speed data buffering and flow control. Common application areas include telecommunications, where it helps manage data in network routers and switches; digital signal processing, where it facilitates efficient data handling between processors; and multimedia systems, supporting audio and video data streaming. Additionally, it is used in industrial automation for data acquisition and control tasks, as well as in computing systems for temporary data storage and management between components operating at different speeds. Its reliability and speed make it suitable for any application needing efficient data queuing and buffering.

Package

The IDT72P51569L5BB8 is a FIFO memory chip with a BGA (Ball Grid Array) package type. BGA is a type of surface-mount packaging used for integrated circuits, providing a high density of connections and improved thermal performance.

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