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IS22TF64G-JQLA1
+BOMIC FLASH 512GBIT EMMC 100LFBGA
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제조업체통합 실리콘 솔루션 회사
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제조업체 부품 #IS22TF64G-JQLA1
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사양
| 속성 | 가치 |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (TLC) |
| Memory Size | 512Gbit |
| Memory Organization | 64G x 8 |
| Memory Interface | eMMC_5.1 |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 100-LBGA |
| Supplier Device Package | 100-LFBGA (14x18) |
| Base Product Number | IS22TF64G |
| Clock Frequency | 200 MHz |
| Grade | Automotive |
| Qualification | AEC-Q100 |
개요
Description
To understand its specifics, one would typically look up the product using its model number in the manufacturer's catalog or website. This would provide detailed information about its functionality, technical specifications, applications, and compatibility. For instance, if the IS22TF64G-JQLA1 is a storage module, details might include its storage capacity, data transfer rates, form factor, and intended use scenarios. Understanding the context of use, such as consumer electronics, industrial applications, or computing, would also help in grasping its significance. For precise information, consulting the manufacturer's datasheet or product documentation is recommended.
Equivalent
Features
Key features include:
1. Capacity: 64 Megabits (8 Megabytes).
2. Interface: Serial Peripheral Interface (SPI) with Dual and Quad I/O support.
3. Operating Voltage: Typically operates at 3V.
4. Sector and Block Architecture: Erase capabilities include sectors and blocks, enabling flexible memory management.
5. Low Power Consumption: Designed for low power operations to extend battery life in portable applications.
6. Endurance and Data Retention: High endurance with capability for many erase/program cycles and extended data retention time.
7. Security Features: May include features like block protection and status register write protection for improved data security.
These features make it suitable for a variety of applications, including consumer electronics, industrial systems, and communication devices.
Pinout
While specific details about the pin count and function might vary slightly based on precise part numbers and configurations, standard NAND Flash chips of this type generally have a TSOP (Thin Small Outline Package) or BGA (Ball Grid Array) form factor, which typically includes a pin count in the range of 48 to 63 pins for TSOP packages and more for BGA packages.
The pins on these chips are used for various functions, including power supply, ground, data input/output, command interface, and control signals such as chip enable, write enable, read enable, and more. For the exact pin count and functional description of each pin for the IS22TF64G-JQLA1, it is best to refer to the datasheet provided by ISSI, as it will contain detailed and specific information about the pin configuration and functions.