IS42S32800D-6BLI

The IS42S32800D-6BLI is a 256 Megabit (32MB) DRAM memory chip manufactured by ISSI (Integrated Silicon Solutions, Inc.). It features a DDR3 (Double Data Rate 3) interface, operating at a clock frequency of 533 MHz, which allows for effective data transfer rates up to 1066 MT/s. The chip is organized as 8 Meg x 32 bits, making it suitable for various applications, including consumer electronics, automotive systems, and industrial equipment.
Key specifications include a supply voltage of 1.5V, low power consumption, and a flexible memory architecture designed for easy integration into systems. The IS42S32800D-6BLI also supports a variety of operating modes for enhanced performance and efficiency. Its compact design and high-speed capability make it an attractive choice for developers looking to optimize memory performance in their products.

The IS42S32800D-6BLI chip is a 256Mb DDR2 SDRAM memory chip. Equivalent products include the Micron MT47H256M8, Hynix H5TQ2G83BFR, and Nanya NT5TU128M8. However, always verify compatibility based on specific requirements such as speed, voltage, and packaging before substituting.

The IS42S32800D-6BLI is a 256Mb (32MB) DRAM memory chip featuring DDR (Double Data Rate) technology. Key features include:
1. Density: 256 Megabits organized as 32 Meg x 8 bits.
2. Speed: Operates at a clock frequency of 166 MHz with an access time of 6 ns.
3. Interface: Supports a 16-bit wide data bus, allowing for efficient data transfer.
4. Power Supply: Operates on a voltage of 2.5V for core and 3.0V for I/O, promoting low power consumption.
5. Package Type: Available in a 54-pin TSOP II package, facilitating easy integration into various applications.
6. Applications: Commonly used in consumer electronics, automotive, and networking devices that require high-speed memory performance.
This chip is ideal for applications that demand reliable data processing and storage capabilities.

The IS42S32800D-6BLI is a 32M x 8-bit DRAM chip, featuring a total of 54 pins. Its primary functions include data storage, control, and address input/output.
Key pin functions include:
- Address Pins (A0 - A14): Used for addressing the memory locations.
- Data Pins (DQ0 - DQ7): 8 data input/output pins for data transfer.
- Control Pins: Includes CS (Chip Select), RAS (Row Address Strobe), CAS (Column Address Strobe), and WE (Write Enable) for controlling read/write operations.
- VDD: Power supply pin.
- VSS: Ground pin.
- DQML / DQMH: Data Mask pins for byte control.
This DRAM is commonly used in various applications requiring reliable and efficient memory storage.

The manufacturer of the IS42S32800D-6BLI is ISSI (Integrated Silicon Solution, Inc.). ISSI is a semiconductor company that specializes in the design and manufacturing of high-performance integrated circuits, particularly for memory applications. The company's product portfolio includes SRAM (Static Random Access Memory), DRAM (Dynamic Random Access Memory), and Flash memory solutions.
Founded in 1988 and headquartered in San Jose, California, ISSI serves various markets, including telecommunications, automotive, consumer electronics, and industrial applications. The IS42S32800D-6BLI is a DDR2 DRAM memory chip designed for use in a range of electronic devices, providing efficient data storage and retrieval capabilities.
As a technology company, ISSI focuses on innovation and quality, catering to the growing demand for efficient memory solutions in an increasingly digital world.

The IS42S32800D-6BLI is a 256Mb DDR3 SDRAM memory chip commonly used in various applications such as consumer electronics, networking equipment, and industrial devices. It is suitable for applications requiring high-speed data processing, including laptops, desktops, and servers. Additionally, it can be found in telecommunications equipment, automotive systems, and embedded systems, where fast and efficient memory performance is crucial. Its low power consumption also makes it ideal for portable devices and energy-efficient applications.

The IS42S32800D-6BLI is a DRAM memory chip packaged in a 54-pin TSOP II (Thin Small Outline Package) form factor. This package type is designed for surface-mount technology, allowing for efficient space utilization on printed circuit boards.