K4A4G085WE-BIRC

The K4A4G085WE-BIRC is a 4GB DDR3 SDRAM (Dynamic Random Access Memory) chip designed for high-performance applications. It is produced by Samsung and features a data rate of 1600 MT/s with a 64-bit wide data bus, making it suitable for both mobile devices and desktop systems. This memory chip is based on a 2, 1G x 4 configuration and operates at a voltage of 1.5V.
The BIRC designation indicates its package type and features, which may include a specific thermal profile and electrical characteristics. The K4A4G085WE-BIRC is optimized for energy efficiency, which is essential in portable devices, minimizing power consumption while delivering reliable performance.
It is commonly used in various applications, including laptops, tablets, and embedded systems, providing an effective balance between speed and power efficiency. Overall, this memory chip contributes significantly to the performance and responsiveness of computing systems.

The K4A4G085WE-BIRC chip is a 4Gb DDR4 memory module. Equivalent products include:
1. K4A4G085WE-BIRC (Samsung)
2. MT40A4G8-2GDR3 (Micron)
3. H5GQ4H24AFR (SK Hynix)
4. MTA4ATF1G64HZ-2G3B1 (Micron)
5. D4H4G64X4J-16 (Nanya)
Always verify compatibility with your specific application before use.

The K4A4G085WE-BIRC is a 4 Gb (Gigabit) DDR3 SDRAM memory chip, designed for high-performance applications. Key features include:
1. Density: 4 Gb capacity, suitable for various computing needs.
2. Data Rate: Supports a data rate of up to 1600 MT/s (megatransfers per second).
3. Architecture: Utilizes a x4 data width configuration.
4. Voltage: Operates at a low voltage of 1.5V, enhancing energy efficiency.
5. Package Type: Typically comes in a small 78-ball TFBGA (Thin Fine Ball Grid Array) package, which allows for compact designs.
6. Organization: Organized as 512M x 4 bits, facilitating flexible memory configurations.
7. Temperature Range: Designed for a standard operating temperature range, making it suitable for consumer electronics.
This memory chip is ideal for use in applications such as smartphones, tablets, and other mobile devices where compact size and energy efficiency are critical.

The K4A4G085WE-BIRC is a 4Gb (Gigabit) DDR3 SDRAM memory chip that typically comes in a 78-ball (or 78-pin) FBGA (Fine Ball Grid Array) package. Its primary functions include providing high-speed data storage and transfer for various applications, including mobile devices and computing systems.
Key features include:
- Data Width: 8 bits (1 byte) per I/O.
- Operating Voltage: 1.5V.
- Data Rate: Supports DDR3 data rates up to 1600 MT/s.
- Latency: CL (CAS Latency) of 11 or 13, depending on configuration.
This chip is used in various consumer electronics, offering a balance of performance and power efficiency.

The K4A4G085WE-BIRC is manufactured by Samsung Electronics, a South Korean multinational company. Samsung is one of the largest technology companies in the world, known primarily for its consumer electronics, semiconductors, and telecommunications equipment. Founded in 1938, the company has diversified into various sectors, including mobile phones, televisions, home appliances, and integrated circuits.
In the semiconductor industry, Samsung is a leading producer of memory chips, including DRAM and NAND flash memory, as well as logic chips and sensors. The K4A4G085WE-BIRC is a specific type of DRAM (Dynamic Random-Access Memory) module designed for use in various electronic devices such as smartphones, tablets, and computers, showcasing Samsung's innovation and expertise in high-performance memory solutions. The company is recognized for its significant investment in research and development, enabling it to stay at the forefront of technology advancements.

The K4A4G085WE-BIRC is a 4Gb DDR3 SDRAM memory chip, primarily used in mobile devices, such as smartphones and tablets, for applications requiring high-speed data access. It supports various tasks including gaming, multimedia playback, and multitasking in mobile platforms. Additionally, it is utilized in embedded systems, networking equipment, and consumer electronics where efficient memory performance is critical. The chip's low power consumption also makes it suitable for battery-operated devices, enhancing overall energy efficiency.

The K4A4G085WE-BIRC is packaged in a 78-ball Thin BGA (Ball Grid Array). This compact form factor allows for efficient heat dissipation and is suitable for high-density applications in mobile and computing devices.