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K4AAG165WA-BCTD

Name: K4AAG165WA-BCTD
Rating: 4.8 (15 reviews)

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16Gbit 1.2V 1.6GHz DDR4 SDRAM FBGA-96 Memory (ICs) RoHS

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제조업체 부품 #K4AAG165WA-BCTD
데이터시트 K4AAG165WA-BCTD DataSheet
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사양

속성	가치
Packaging	FBGA-96
Clock Frequency	1.6GHz
Memory Format	DDR4 SDRAM
Memory Size	16Gbit
Operating Temperature	0℃~+85℃
Voltage - Supply	1.2V

개요

Description

The K4AAG165WA-BCTD is a specific model of DRAM (Dynamic Random-Access Memory) module, typically used in electronic devices for temporary data storage and fast data retrieval. Manufactured by Samsung, it belongs to the LPDDR4 (Low Power Double Data Rate 4) family, which is designed for use in mobile devices due to its low power consumption and high performance.
Key features include a 16Gb (gigabit) density, making it suitable for applications requiring substantial memory capacity. The "BCTD" in its designation refers to specific package and speed grade specifications, with variations in frequency and voltage parameters tailored to particular device needs. The LPDDR4 technology offers improvements over previous generations, such as increased bandwidth and efficiency, which contribute to enhanced device performance and battery life.
Overall, the K4AAG165WA-BCTD is an integral component for devices that require efficient memory solutions, balancing power consumption with performance demands in mobile technology.

Equivalent

The K4AAG165WA-BCTD is a DRAM chip manufactured by Samsung. Equivalent products are usually other DDR4 DRAM chips with similar specifications, including those from companies like Micron, SK Hynix, and Kingston. Specifically, look for DDR4-3200 memory chips with similar density, voltage, and form factor. However, it is essential to verify the exact compatibility requirements such as size, speed, and configuration for your specific application or device.

Features

The K4AAG165WA-BCTD is a 16 Gb (gigabit) DDR4 DRAM chip designed by Samsung. Key features include:
1. Capacity: 16 Gb, suitable for high-density memory applications.
2. Speed: Supports a data transfer rate up to 3200 MT/s (million transfers per second), enhancing performance in demanding applications.
3. Voltage: Operates at a low voltage of 1.2V, contributing to energy efficiency and reduced power consumption.
4. Architecture: Utilizes a 1y nm process technology, which improves both performance and efficiency.
5. Package Type: Comes in a compact FBGA (Fine-Pitch Ball Grid Array) package, optimizing space for integration in various devices.
6. Reliability: Features on-die error correction code (ECC) which helps in maintaining data integrity and reliability.
7. Applications: Ideal for use in various computing systems including desktops, laptops, servers, and other high-performance computing applications.
These features make the K4AAG165WA-BCTD a versatile and efficient choice for modern computing needs, balancing speed, capacity, and energy efficiency.

Pinout

The K4AAG165WA-BCTD is a DRAM chip produced by Samsung, part of their LPDDR4 (Low Power Double Data Rate 4) memory series. This particular chip is designed for use in mobile devices where power efficiency and compact size are critical.
1. Pin Count: The K4AAG165WA-BCTD typically has a ball grid array (BGA) package, commonly with 200 balls/pins. This configuration allows for a compact form factor ideal for use in mobile devices.
2. Function: As a DRAM chip, it serves as volatile memory, providing fast read and write access to a device's CPU. LPDDR4 technology offers improvements over previous generations, such as higher data transfer rates and reduced power consumption, which enhances performance and extends battery life in mobile applications. The chip supports high bandwidth and low power, making it suitable for smartphones, tablets, and other portable electronics.
These features are key for applications requiring efficient power management and speed, such as gaming, video streaming, and multi-tasking on mobile platforms.

Manufacturer

The K4AAG165WA-BCTD is a product manufactured by Samsung Electronics. Samsung Electronics is a major multinational conglomerate based in South Korea, known for its diverse range of electronic products and components. It is one of the largest technology companies in the world and operates in various sectors, including consumer electronics, semiconductors, telecommunications equipment, and home appliances. Samsung is particularly renowned for its advancements in semiconductor technology, producing memory chips, processors, and other critical components that are widely used in various electronic devices.

Application

The K4AAG165WA-BCTD is a type of LPDDR4 DRAM chip, which is typically used in various applications that require low power and high-performance memory. Key application areas include:
1. Mobile Devices: Smartphones and tablets, where power efficiency and performance are critical.
2. Wearable Technology: Smartwatches and fitness trackers, benefiting from the chip's compact size and low power consumption.
3. Automotive Systems: Advanced driver-assistance systems (ADAS) and infotainment systems requiring robust memory solutions.
4. Internet of Things (IoT): Devices that need efficient memory to process data quickly while maintaining low energy usage.
5. Consumer Electronics: Such as cameras and smart TVs, for improved processing speed and responsiveness.

Package

The K4AAG165WA-BCTD is a DRAM memory component from Samsung. It typically comes in a FBGA (Fine-Pitch Ball Grid Array) package type, which is common for high-density memory modules, offering efficient electrical performance and compact size.

Frequently Asked Questions

Q: What is the memory density and organization of this DDR4 IC?
A: It has a 16Gbit density, typically organized as 2G x 8 or 1G x 16, suitable for high-density memory modules.

Q: What is the maximum operating clock frequency and data rate?
A: The clock frequency is 1.6GHz, supporting a data transfer rate of 3200 Mbps per pin (DDR4-3200).

Q: What is the recommended operating voltage for this device?
A: The nominal supply voltage is 1.2V (VDD), with VPP typically at 2.5V, compliant with DDR4 JEDEC standards.

Q: Does this component support commercial or industrial temperature ranges?
A: Its operating temperature range is 0°C to +85°C (TC), making it suitable for commercial and high-temperature server environments.

Q: In which package form is this memory chip available?
A: It comes in an FBGA-96 package (Ball Grid Array with 96 balls) for optimized signal integrity and thermal performance.

Q: How does this part compare to standard DDR4 SDRAM modules?
A: It is a monolithic 16Gbit IC designed for use in RDIMMs, LRDIMMs, or soldered-on-board (SODIMM) applications, delivering low latency at 3200MT/s.